HK1214072A1 - 加熱接合裝置及加熱接合產品的製造方法 - Google Patents

加熱接合裝置及加熱接合產品的製造方法

Info

Publication number
HK1214072A1
HK1214072A1 HK16101806.4A HK16101806A HK1214072A1 HK 1214072 A1 HK1214072 A1 HK 1214072A1 HK 16101806 A HK16101806 A HK 16101806A HK 1214072 A1 HK1214072 A1 HK 1214072A1
Authority
HK
Hong Kong
Prior art keywords
heat
bonded
bonding device
article manufacturing
article
Prior art date
Application number
HK16101806.4A
Other languages
English (en)
Inventor
松田純
鈴木隆之
黑田正己
Original Assignee
Origin Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Origin Electric filed Critical Origin Electric
Publication of HK1214072A1 publication Critical patent/HK1214072A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
HK16101806.4A 2013-01-24 2016-02-18 加熱接合裝置及加熱接合產品的製造方法 HK1214072A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013011040A JP6144495B2 (ja) 2013-01-24 2013-01-24 加熱接合装置及び加熱接合製品の製造方法
PCT/JP2014/050239 WO2014115583A1 (ja) 2013-01-24 2014-01-09 加熱接合装置及び加熱接合製品の製造方法

Publications (1)

Publication Number Publication Date
HK1214072A1 true HK1214072A1 (zh) 2016-07-15

Family

ID=51227375

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16101806.4A HK1214072A1 (zh) 2013-01-24 2016-02-18 加熱接合裝置及加熱接合產品的製造方法

Country Status (7)

Country Link
US (1) US9919372B2 (zh)
EP (1) EP2950622B1 (zh)
JP (1) JP6144495B2 (zh)
CN (1) CN104956780B (zh)
HK (1) HK1214072A1 (zh)
TW (1) TWI639478B (zh)
WO (1) WO2014115583A1 (zh)

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JP5902107B2 (ja) * 2013-01-24 2016-04-13 オリジン電気株式会社 加熱接合装置及び加熱接合製品の製造方法
WO2016091962A1 (de) 2014-12-09 2016-06-16 Pink Gmbh Thermosysteme Wärmeübertragungsvorrichtung für die lötverbindungsherstellung elektrischer bauteile
DE102015106298B4 (de) * 2015-04-24 2017-01-26 Semikron Elektronik Gmbh & Co. Kg Vorrichtung, Verfahren und Anlage zur inhomogenen Abkühlung eines flächigen Gegenstandes
JP6720033B2 (ja) * 2016-09-14 2020-07-08 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
JP6215426B1 (ja) * 2016-09-21 2017-10-18 オリジン電気株式会社 加熱装置及び板状部材の製造方法
JP6322746B1 (ja) * 2017-03-30 2018-05-09 オリジン電気株式会社 ワーク処理装置及び処理済ワークの製造方法
JP6803617B2 (ja) * 2017-12-13 2020-12-23 株式会社シンアペックス リフロー装置
CN107838516B (zh) * 2017-12-29 2023-10-03 山东才聚电子科技有限公司 一种真空焊接炉的焊接机构
CN107931768B (zh) * 2017-12-29 2023-05-16 山东才聚电子科技有限公司 一种真空焊接炉及焊接工艺
CN107855623B (zh) * 2017-12-29 2023-07-18 山东才聚电子科技有限公司 一种真空焊接炉控制***及其控制方法
CN108788363B (zh) * 2018-07-17 2024-05-14 兴宁市光科电子有限公司 电感线圈生产用自动焊锡设备
JP2020064936A (ja) * 2018-10-16 2020-04-23 トヨタ自動車株式会社 半導体装置の製造方法
JP7239307B2 (ja) * 2018-12-04 2023-03-14 株式会社アイシン福井 レーザ溶接装置
JP7168430B2 (ja) * 2018-12-04 2022-11-09 株式会社アイシン福井 レーザ溶接装置
JP6879482B1 (ja) * 2020-01-09 2021-06-02 株式会社オリジン 酸化物除去済部材の製造方法及び酸化物除去装置
CN113492240A (zh) * 2020-03-18 2021-10-12 上海朗仕电子设备有限公司 一种用于真空回流焊炉的传送***
US11465224B2 (en) * 2020-06-18 2022-10-11 Kulicke And Soffa Industries, Inc. Ovens for equipment such as die attach systems, flip chip bonding systems, clip attach systems, and related methods

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JP5424201B2 (ja) * 2009-08-27 2014-02-26 アユミ工業株式会社 加熱溶融処理装置および加熱溶融処理方法
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WO2013161875A1 (ja) * 2012-04-25 2013-10-31 オリジン電気株式会社 半田付け装置及び半田付け製品の製造方法
JP5902107B2 (ja) * 2013-01-24 2016-04-13 オリジン電気株式会社 加熱接合装置及び加熱接合製品の製造方法

Also Published As

Publication number Publication date
US20150321278A1 (en) 2015-11-12
CN104956780A (zh) 2015-09-30
WO2014115583A1 (ja) 2014-07-31
TWI639478B (zh) 2018-11-01
EP2950622A4 (en) 2016-09-07
US9919372B2 (en) 2018-03-20
TW201436908A (zh) 2014-10-01
CN104956780B (zh) 2018-05-15
JP2014143304A (ja) 2014-08-07
JP6144495B2 (ja) 2017-06-07
EP2950622B1 (en) 2020-08-19
EP2950622A1 (en) 2015-12-02

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