HK1214072A1 - 加熱接合裝置及加熱接合產品的製造方法 - Google Patents
加熱接合裝置及加熱接合產品的製造方法Info
- Publication number
- HK1214072A1 HK1214072A1 HK16101806.4A HK16101806A HK1214072A1 HK 1214072 A1 HK1214072 A1 HK 1214072A1 HK 16101806 A HK16101806 A HK 16101806A HK 1214072 A1 HK1214072 A1 HK 1214072A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- heat
- bonded
- bonding device
- article manufacturing
- article
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013011040A JP6144495B2 (ja) | 2013-01-24 | 2013-01-24 | 加熱接合装置及び加熱接合製品の製造方法 |
PCT/JP2014/050239 WO2014115583A1 (ja) | 2013-01-24 | 2014-01-09 | 加熱接合装置及び加熱接合製品の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1214072A1 true HK1214072A1 (zh) | 2016-07-15 |
Family
ID=51227375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16101806.4A HK1214072A1 (zh) | 2013-01-24 | 2016-02-18 | 加熱接合裝置及加熱接合產品的製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9919372B2 (zh) |
EP (1) | EP2950622B1 (zh) |
JP (1) | JP6144495B2 (zh) |
CN (1) | CN104956780B (zh) |
HK (1) | HK1214072A1 (zh) |
TW (1) | TWI639478B (zh) |
WO (1) | WO2014115583A1 (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5902107B2 (ja) * | 2013-01-24 | 2016-04-13 | オリジン電気株式会社 | 加熱接合装置及び加熱接合製品の製造方法 |
WO2016091962A1 (de) | 2014-12-09 | 2016-06-16 | Pink Gmbh Thermosysteme | Wärmeübertragungsvorrichtung für die lötverbindungsherstellung elektrischer bauteile |
DE102015106298B4 (de) * | 2015-04-24 | 2017-01-26 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung, Verfahren und Anlage zur inhomogenen Abkühlung eines flächigen Gegenstandes |
JP6720033B2 (ja) * | 2016-09-14 | 2020-07-08 | 株式会社Screenホールディングス | 熱処理装置 |
JP6215426B1 (ja) * | 2016-09-21 | 2017-10-18 | オリジン電気株式会社 | 加熱装置及び板状部材の製造方法 |
JP6322746B1 (ja) * | 2017-03-30 | 2018-05-09 | オリジン電気株式会社 | ワーク処理装置及び処理済ワークの製造方法 |
JP6803617B2 (ja) * | 2017-12-13 | 2020-12-23 | 株式会社シンアペックス | リフロー装置 |
CN107838516B (zh) * | 2017-12-29 | 2023-10-03 | 山东才聚电子科技有限公司 | 一种真空焊接炉的焊接机构 |
CN107931768B (zh) * | 2017-12-29 | 2023-05-16 | 山东才聚电子科技有限公司 | 一种真空焊接炉及焊接工艺 |
CN107855623B (zh) * | 2017-12-29 | 2023-07-18 | 山东才聚电子科技有限公司 | 一种真空焊接炉控制***及其控制方法 |
CN108788363B (zh) * | 2018-07-17 | 2024-05-14 | 兴宁市光科电子有限公司 | 电感线圈生产用自动焊锡设备 |
JP2020064936A (ja) * | 2018-10-16 | 2020-04-23 | トヨタ自動車株式会社 | 半導体装置の製造方法 |
JP7239307B2 (ja) * | 2018-12-04 | 2023-03-14 | 株式会社アイシン福井 | レーザ溶接装置 |
JP7168430B2 (ja) * | 2018-12-04 | 2022-11-09 | 株式会社アイシン福井 | レーザ溶接装置 |
JP6879482B1 (ja) * | 2020-01-09 | 2021-06-02 | 株式会社オリジン | 酸化物除去済部材の製造方法及び酸化物除去装置 |
CN113492240A (zh) * | 2020-03-18 | 2021-10-12 | 上海朗仕电子设备有限公司 | 一种用于真空回流焊炉的传送*** |
US11465224B2 (en) * | 2020-06-18 | 2022-10-11 | Kulicke And Soffa Industries, Inc. | Ovens for equipment such as die attach systems, flip chip bonding systems, clip attach systems, and related methods |
Family Cites Families (28)
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US3693239A (en) * | 1969-07-25 | 1972-09-26 | Sidney Dix | A method of making a micromodular package |
US4278867A (en) | 1978-12-29 | 1981-07-14 | International Business Machines Corporation | System for chip joining by short wavelength radiation |
JPS63196363A (ja) | 1987-02-10 | 1988-08-15 | Asahi Glass Co Ltd | 乱反射面を有する陰極線管の製造方法 |
JPS63196363U (zh) * | 1987-06-05 | 1988-12-16 | ||
JPH01147281A (ja) * | 1987-12-02 | 1989-06-08 | Matsushita Electric Ind Co Ltd | 基板加熱装置 |
JPH06268B2 (ja) * | 1988-02-23 | 1994-01-05 | エイティックテクトロン株式会社 | リフロー半田付け方法及び装置 |
JPH05211391A (ja) * | 1992-01-21 | 1993-08-20 | Hitachi Ltd | 高精度はんだ付け方法及び装置 |
JP2668330B2 (ja) * | 1994-03-04 | 1997-10-27 | 日本無線株式会社 | 樹脂基板バンプ貼合わせ方法及び装置 |
JP3390268B2 (ja) * | 1994-10-18 | 2003-03-24 | 日本電熱計器株式会社 | はんだ付け装置 |
US5785233A (en) * | 1996-02-01 | 1998-07-28 | Btu International, Inc. | Apparatus and method for solder reflow bottom cooling |
JP3409679B2 (ja) * | 1998-02-06 | 2003-05-26 | 神港精機株式会社 | 半田付け装置 |
JP2001308511A (ja) * | 2000-04-19 | 2001-11-02 | Nec Corp | リフローはんだ付け方法およびその装置 |
TW467788B (en) * | 2000-09-18 | 2001-12-11 | Shyi-Kaan Wu | The manufacturing of single layer superabrasive tools by infrared brazing |
US6649887B2 (en) * | 2001-03-30 | 2003-11-18 | General Electric Company | Apparatus and method for protective atmosphere induction brazing of complex geometries |
JP4073183B2 (ja) * | 2001-08-01 | 2008-04-09 | 株式会社日立製作所 | Pbフリーはんだを用いた混載実装方法及び実装品 |
JP4371619B2 (ja) * | 2001-09-21 | 2009-11-25 | パナソニック株式会社 | リフロー装置 |
JP2004006657A (ja) * | 2002-03-22 | 2004-01-08 | Seiko Epson Corp | 半導体装置の製造方法及びその製造装置 |
JP3809806B2 (ja) | 2002-03-29 | 2006-08-16 | 富士電機デバイステクノロジー株式会社 | 半導体装置の製造方法 |
JP4233905B2 (ja) * | 2003-03-26 | 2009-03-04 | Juki株式会社 | 部品装着装置 |
JP4448749B2 (ja) * | 2004-09-16 | 2010-04-14 | 神港精機株式会社 | 加熱及び冷却装置 |
DE102004047359B3 (de) * | 2004-09-29 | 2006-01-26 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Verfahren und Vorrichtung zur Regelung und Überwachung eines Lötprozesses |
JP2008284557A (ja) * | 2007-05-15 | 2008-11-27 | Shinko Seiki Co Ltd | 加熱冷却装置 |
JP5251456B2 (ja) * | 2008-11-27 | 2013-07-31 | 株式会社デンソー | 半田付け用真空加熱装置 |
JP2010267769A (ja) * | 2009-05-14 | 2010-11-25 | Toyota Motor Corp | はんだ付け方法及び装置 |
JP5424201B2 (ja) * | 2009-08-27 | 2014-02-26 | アユミ工業株式会社 | 加熱溶融処理装置および加熱溶融処理方法 |
JP5892682B2 (ja) * | 2011-04-27 | 2016-03-23 | アピックヤマダ株式会社 | 接合方法 |
WO2013161875A1 (ja) * | 2012-04-25 | 2013-10-31 | オリジン電気株式会社 | 半田付け装置及び半田付け製品の製造方法 |
JP5902107B2 (ja) * | 2013-01-24 | 2016-04-13 | オリジン電気株式会社 | 加熱接合装置及び加熱接合製品の製造方法 |
-
2013
- 2013-01-24 JP JP2013011040A patent/JP6144495B2/ja active Active
-
2014
- 2014-01-09 EP EP14742961.7A patent/EP2950622B1/en active Active
- 2014-01-09 CN CN201480005967.7A patent/CN104956780B/zh active Active
- 2014-01-09 US US14/763,150 patent/US9919372B2/en active Active
- 2014-01-09 WO PCT/JP2014/050239 patent/WO2014115583A1/ja active Application Filing
- 2014-01-23 TW TW103102421A patent/TWI639478B/zh active
-
2016
- 2016-02-18 HK HK16101806.4A patent/HK1214072A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20150321278A1 (en) | 2015-11-12 |
CN104956780A (zh) | 2015-09-30 |
WO2014115583A1 (ja) | 2014-07-31 |
TWI639478B (zh) | 2018-11-01 |
EP2950622A4 (en) | 2016-09-07 |
US9919372B2 (en) | 2018-03-20 |
TW201436908A (zh) | 2014-10-01 |
CN104956780B (zh) | 2018-05-15 |
JP2014143304A (ja) | 2014-08-07 |
JP6144495B2 (ja) | 2017-06-07 |
EP2950622B1 (en) | 2020-08-19 |
EP2950622A1 (en) | 2015-12-02 |
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