HK1205355A1 - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
HK1205355A1
HK1205355A1 HK15105925.2A HK15105925A HK1205355A1 HK 1205355 A1 HK1205355 A1 HK 1205355A1 HK 15105925 A HK15105925 A HK 15105925A HK 1205355 A1 HK1205355 A1 HK 1205355A1
Authority
HK
Hong Kong
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
HK15105925.2A
Other languages
English (en)
Chinese (zh)
Inventor
山道新太郎
小川健太
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of HK1205355A1 publication Critical patent/HK1205355A1/xx

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Classifications

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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L2225/06544—Design considerations for via connections, e.g. geometry or layout
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/30—Technical effects
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HK15105925.2A 2013-06-06 2015-06-22 Semiconductor device HK1205355A1 (en)

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US9502270B2 (en) 2014-07-08 2016-11-22 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device packages, packaging methods, and packaged semiconductor devices
JP6515724B2 (ja) * 2015-07-31 2019-05-22 富士通株式会社 半導体装置
KR20170066843A (ko) * 2015-12-07 2017-06-15 삼성전자주식회사 적층형 반도체 장치 및 적층형 반도체 장치의 제조 방법
KR102454892B1 (ko) * 2015-12-09 2022-10-14 삼성전자주식회사 반도체 칩, 이를 포함하는 반도체 패키지, 및 반도체 칩의 제조 방법
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US8031505B2 (en) * 2008-07-25 2011-10-04 Samsung Electronics Co., Ltd. Stacked memory module and system
JP2011243724A (ja) 2010-05-18 2011-12-01 Elpida Memory Inc 半導体装置およびその製造方法
TWI427753B (zh) * 2010-05-20 2014-02-21 Advanced Semiconductor Eng 封裝結構以及封裝製程
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JP2012038790A (ja) * 2010-08-04 2012-02-23 Hitachi Ltd 電子部材ならびに電子部品とその製造方法
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JP2012119368A (ja) * 2010-11-29 2012-06-21 Elpida Memory Inc 半導体装置の製造方法
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CN104241258B (zh) 2018-09-25
US20140361411A1 (en) 2014-12-11
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