HK1178320A1 - 光反射性各向異性導電粘接劑及發光裝置 - Google Patents

光反射性各向異性導電粘接劑及發光裝置

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Publication number
HK1178320A1
HK1178320A1 HK13105913.8A HK13105913A HK1178320A1 HK 1178320 A1 HK1178320 A1 HK 1178320A1 HK 13105913 A HK13105913 A HK 13105913A HK 1178320 A1 HK1178320 A1 HK 1178320A1
Authority
HK
Hong Kong
Prior art keywords
light
emitting device
conductive adhesive
anisotropic conductive
adhesive agent
Prior art date
Application number
HK13105913.8A
Other languages
English (en)
Inventor
波木秀次
蟹澤士行
馬越英明
石神明
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1178320A1 publication Critical patent/HK1178320A1/zh

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    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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HK13105913.8A 2010-04-13 2013-05-20 光反射性各向異性導電粘接劑及發光裝置 HK1178320A1 (zh)

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JP6066643B2 (ja) * 2012-09-24 2017-01-25 デクセリアルズ株式会社 異方性導電接着剤
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JP3485643B2 (ja) * 1994-06-16 2004-01-13 三井金属鉱業株式会社 被覆酸化亜鉛粉末及び被覆酸化亜鉛粉末含有組成物
JPH10256687A (ja) * 1997-03-14 1998-09-25 Matsushita Electric Ind Co Ltd ビアホール充填用導体ペースト組成物とそれを用いたプリント配線基板
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JP4802666B2 (ja) * 2005-11-08 2011-10-26 住友金属鉱山株式会社 エポキシ樹脂接着組成物及びそれを用いた光半導体用接着剤
JP2009525614A (ja) * 2006-01-31 2009-07-09 スリーエム イノベイティブ プロパティズ カンパニー コンプライアントなフォイル構造を有するｌｅｄ照明アセンブリ
JP2007258324A (ja) * 2006-03-22 2007-10-04 Matsushita Electric Ind Co Ltd 発光装置の製造方法および発光装置
TW200821632A (en) * 2006-08-23 2008-05-16 Mitsui Chemicals Inc Light reflector and light source having same
JP5608955B2 (ja) * 2007-02-06 2014-10-22 日亜化学工業株式会社 発光装置及びその製造方法並びに発光装置用成形体
JP2010092672A (ja) * 2008-10-06 2010-04-22 Harison Toshiba Lighting Corp バックライト装置および表示装置
JP5617210B2 (ja) * 2009-09-14 2014-11-05 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置

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CN102859673B (zh) 2015-09-09
TW201211178A (en) 2012-03-16
US9260634B2 (en) 2016-02-16
WO2011129373A1 (ja) 2011-10-20
TWI513783B (zh) 2015-12-21
KR20130049689A (ko) 2013-05-14
EP2560198A4 (en) 2014-08-06
JP2011222875A (ja) 2011-11-04
US20130049054A1 (en) 2013-02-28
US8916894B2 (en) 2014-12-23
CN102859673A (zh) 2013-01-02
JP5555038B2 (ja) 2014-07-23
US20150069448A1 (en) 2015-03-12

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