HK1173507A1 - 感光性樹脂組合物及其固化物、以及印刷電路板 - Google Patents

感光性樹脂組合物及其固化物、以及印刷電路板

Info

Publication number
HK1173507A1
HK1173507A1 HK13100672A HK13100672A HK1173507A1 HK 1173507 A1 HK1173507 A1 HK 1173507A1 HK 13100672 A HK13100672 A HK 13100672A HK 13100672 A HK13100672 A HK 13100672A HK 1173507 A1 HK1173507 A1 HK 1173507A1
Authority
HK
Hong Kong
Prior art keywords
resin composition
wiring board
printed wiring
photosensitive resin
cured product
Prior art date
Application number
HK13100672A
Other languages
English (en)
Inventor
植田千穗
鐮田清良
Original Assignee
太陽控股株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 太陽控股株式會社 filed Critical 太陽控股株式會社
Publication of HK1173507A1 publication Critical patent/HK1173507A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31938—Polymer of monoethylenically unsaturated hydrocarbon

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
HK13100672A 2009-09-29 2013-01-16 感光性樹脂組合物及其固化物、以及印刷電路板 HK1173507A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009225059A JP5306952B2 (ja) 2009-09-29 2009-09-29 感光性樹脂組成物及びその硬化物、並びにプリント配線板
PCT/JP2010/005776 WO2011039984A1 (ja) 2009-09-29 2010-09-24 感光性樹脂組成物及びその硬化物、並びにプリント配線板

Publications (1)

Publication Number Publication Date
HK1173507A1 true HK1173507A1 (zh) 2013-05-16

Family

ID=43825833

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13100672A HK1173507A1 (zh) 2009-09-29 2013-01-16 感光性樹脂組合物及其固化物、以及印刷電路板

Country Status (8)

Country Link
US (2) US20130048357A1 (zh)
JP (1) JP5306952B2 (zh)
KR (1) KR101410086B1 (zh)
CN (1) CN102725690B (zh)
HK (1) HK1173507A1 (zh)
MY (1) MY155964A (zh)
TW (1) TWI485514B (zh)
WO (1) WO2011039984A1 (zh)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012003225A (ja) 2010-01-27 2012-01-05 Fujifilm Corp ソルダーレジスト用重合性組成物及びソルダーレジストパターンの形成方法
JP5007453B2 (ja) * 2010-06-11 2012-08-22 株式会社タムラ製作所 黒色硬化性樹脂組成物
JP2012237864A (ja) * 2011-05-11 2012-12-06 Kaneka Corp 新規な黒色感光性樹脂組成物及びその利用
JP5583091B2 (ja) * 2011-08-31 2014-09-03 株式会社タムラ製作所 黒色硬化性樹脂組成物
JP5877690B2 (ja) * 2011-11-15 2016-03-08 株式会社カネカ 新規な感光性樹脂組成物作製キット及びその利用
WO2013084714A1 (ja) * 2011-12-06 2013-06-13 株式会社カネカ 黒色感光性樹脂組成物及びその利用
WO2013171888A1 (ja) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
JP5766671B2 (ja) * 2012-09-05 2015-08-19 株式会社タムラ製作所 黒色硬化性樹脂組成物およびそれを用いたプリント配線基板
JP5695622B2 (ja) * 2012-09-24 2015-04-08 株式会社タムラ製作所 黒色硬化性樹脂組成物
TW201423272A (zh) * 2012-11-27 2014-06-16 Jsr Corp 感光性組成物、著色劑分散液、濾光片及光感應器
JP6170673B2 (ja) 2012-12-27 2017-07-26 富士フイルム株式会社 カラーフィルタ用組成物、赤外線透過フィルタ及びその製造方法、並びに赤外線センサー
JP5809182B2 (ja) * 2013-03-26 2015-11-10 株式会社タムラ製作所 感光性樹脂組成物
JP6134188B2 (ja) * 2013-04-03 2017-05-24 株式会社カネカ 黒色感光性樹脂組成物及びその利用
DE102013211090A1 (de) * 2013-06-14 2014-12-18 Robert Bosch Gmbh Erfassungssystem zum Erfassen einer Lötverbindung
JP6185943B2 (ja) * 2015-02-10 2017-08-23 互応化学工業株式会社 ソルダーレジスト組成物、被覆プリント配線板
JP6421161B2 (ja) * 2015-11-27 2018-11-07 株式会社タムラ製作所 感光性樹脂組成物
KR102025359B1 (ko) * 2016-03-08 2019-09-25 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 블랙 컬럼 스페이서 및 컬러필터
JP5997860B1 (ja) * 2016-03-16 2016-09-28 互応化学工業株式会社 液状ソルダーレジスト組成物及びプリント配線板
JP6112691B1 (ja) 2016-03-16 2017-04-12 互応化学工業株式会社 液状ソルダーレジスト組成物及びプリント配線板
KR102080235B1 (ko) * 2016-10-28 2020-02-21 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 흑색 감광성 수지막 및 컬러필터
KR101992009B1 (ko) * 2017-02-03 2019-06-21 동우 화인켐 주식회사 자발광 감광성 수지 조성물, 이를 이용한 색변환층을 포함하는 컬러필터 및 화상표시장치
KR20180119475A (ko) * 2017-04-25 2018-11-02 도오꾜오까고오교 가부시끼가이샤 블랙 칼럼 스페이서 형성용의 감광성 수지 조성물, 블랙 칼럼 스페이서, 표시 장치, 및 블랙 칼럼 스페이서의 형성 방법
CN109254498B (zh) * 2017-07-14 2023-07-14 株式会社田村制作所 感光性树脂组合物
JP6596550B2 (ja) * 2017-09-08 2019-10-23 株式会社タムラ製作所 感光性樹脂組成物、感光性樹脂組成物が塗工されたドライフィルム及び感光性樹脂組成物の光硬化膜を有するプリント配線板
JP6986476B2 (ja) * 2018-03-29 2021-12-22 株式会社タムラ製作所 感光性樹脂組成物
JP7324595B2 (ja) * 2018-03-30 2023-08-10 太陽ホールディングス株式会社 黒色感光性樹脂組成物、その硬化物、およびリジッドフレキシブルプリント配線板
JP6764894B2 (ja) * 2018-04-19 2020-10-07 富士フイルム株式会社 赤外線透過フィルタ用組成物、赤外線透過フィルタ、赤外線透過フィルタの製造方法、及び、赤外線センサー
JP7300619B2 (ja) * 2019-01-11 2023-06-30 太陽ホールディングス株式会社 積層構造体、ドライフィルム、その硬化物および電子部品

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06289602A (ja) * 1993-03-31 1994-10-18 Tokyo Ohka Kogyo Co Ltd ペリレン系色素を用いた感光性樹脂組成物
JP4768924B2 (ja) * 2001-03-30 2011-09-07 互応化学工業株式会社 フォトソルダーレジストインク
US20040157140A1 (en) * 2001-05-15 2004-08-12 Hirotoshi Kamata Photosensitive coloring composition, color filter using the composition and method of producing the same
JP2004317850A (ja) * 2003-04-17 2004-11-11 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造方法およびプリント配線板の製造方法
JP4245510B2 (ja) * 2004-05-10 2009-03-25 日本合成化学工業株式会社 感光性樹脂組成物及びそれを用いたフォトレジストフィルム
JP4461005B2 (ja) * 2004-12-06 2010-05-12 日本合成化学工業株式会社 感光性樹脂組成物及びそれを用いたフォトレジストフィルム、レジストパターン形成方法
JP4794870B2 (ja) * 2005-02-24 2011-10-19 東京応化工業株式会社 遮光層形成用感光性樹脂組成物ならびに遮光層およびカラーフィルタ
JP2007071994A (ja) * 2005-09-05 2007-03-22 Tokyo Ohka Kogyo Co Ltd 黒色感光性樹脂組成物
KR100881860B1 (ko) * 2007-01-17 2009-02-06 제일모직주식회사 컬러필터용 감광성 수지 조성물 및 이를 이용한 이미지센서컬러필터
JP4994923B2 (ja) * 2007-04-06 2012-08-08 太陽ホールディングス株式会社 黒色ソルダーレジスト組成物およびその硬化物
JP5352175B2 (ja) * 2008-03-26 2013-11-27 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物、並びにその硬化物からなるソルダーレジスト層を有するプリント配線基板

Also Published As

Publication number Publication date
MY155964A (en) 2015-12-31
KR101410086B1 (ko) 2014-06-25
CN102725690B (zh) 2014-05-28
KR20120044371A (ko) 2012-05-07
WO2011039984A1 (ja) 2011-04-07
US9282644B2 (en) 2016-03-08
US20140360758A1 (en) 2014-12-11
CN102725690A (zh) 2012-10-10
TW201128306A (en) 2011-08-16
JP5306952B2 (ja) 2013-10-02
TWI485514B (zh) 2015-05-21
US20130048357A1 (en) 2013-02-28
JP2011075678A (ja) 2011-04-14

Similar Documents

Publication Publication Date Title
HK1173507A1 (zh) 感光性樹脂組合物及其固化物、以及印刷電路板
TWI365886B (en) Epoxy resin composition, prepreg, laminate, and printed wiring board
HK1221481A1 (zh) 熱固性粘接組合物、熱固性粘接片材、其製造方法及增强柔性印刷布線板
EP2343327A4 (en) HARDENABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, PCB AND EPOXY RESIN AND MANUFACTURING METHOD THEREFOR
EP2537853A4 (en) PHOSPHORATE-COMPATIBLE OLIGOMERS, MANUFACTURING METHOD, HARDENABLE RESIN COMPOSITION, CURED PRODUCTS THEREOF, AND FABRICATED PCB
EP2554561A4 (en) Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board
EP2666826A4 (en) RESIN COMPOSITION AND FITTED PCB, COMPOSITE FILM AND PREPREG WITH THIS
EP2532710A4 (en) Phenol resin composition, process for production thereof, curable resin composition, cured products tehreof, and printed wiring board
SG10201605363VA (en) Resin composition for printed wiring boards
HK1121816A1 (en) Solder resist composition and cured product thereof
GB2453083B (en) Printed circuit boards
HK1121815A1 (en) Black solder resist composition and cured product thereof
EP2009058A4 (en) THERMOSETTING POLYIMIDE RESIN FORMULA AND CURED PRODUCT OBTAINED THEREFROM
EP2604639A4 (en) Resin composition, cured resin product, wiring board, and manufacturing method for wiring board
EP2194098A4 (en) EPOXY RESIN COMPOSITION, PREPREG USING THE EPOXY COMPOSITION, METAL-COATED LAMINATE AND CONDUCTOR PLATE
EP2042540A4 (en) polyimide
EP2259669A4 (en) INTEGRATED COMPONENT CONNECTION TABLE
EP2562195A4 (en) EPOXY RESIN COMPOSITION, PREPREG, METALLIC COATING LAMINATE AND PRINTED BOARD
EP2624671A4 (en) COPPER FOIL FOR FITTED PCB, METHOD FOR MAKING THIS COPPER FILM, RESIN COVER FOR FITTED PCB AND FITTED PCB
TWI372008B (en) Printed circuit board
EP2366742A4 (en) THERMOSETTING RESIN COMPOSITION AND PREPREGATION USING THE SAME
HK1129904A1 (en) Polyimide resin
EP2669310A4 (en) EPOXY RESIN, HARDENABLE RESIN COMPOSITION, AND HARDENED PRODUCT THEREOF, AND FITTED WIRE SUPPLY SUBSTRATE
GB2490072B (en) printed circuit board
EP2428535A4 (en) THERMOSETTING POLYIMIDE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE