HK1127960A1 - Mounting method, board with electrical component and electrical apparatus - Google Patents

Mounting method, board with electrical component and electrical apparatus

Info

Publication number
HK1127960A1
HK1127960A1 HK09105327.4A HK09105327A HK1127960A1 HK 1127960 A1 HK1127960 A1 HK 1127960A1 HK 09105327 A HK09105327 A HK 09105327A HK 1127960 A1 HK1127960 A1 HK 1127960A1
Authority
HK
Hong Kong
Prior art keywords
electric part
radiation
electrical
adhesive layer
board
Prior art date
Application number
HK09105327.4A
Other languages
English (en)
Inventor
Kazutaka Furuta
Shiyuki Kanisawa
Masaki Taniguchi
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1127960A1 publication Critical patent/HK1127960A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
HK09105327.4A 2006-03-07 2009-06-15 Mounting method, board with electrical component and electrical apparatus HK1127960A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006060600A JP4902229B2 (ja) 2006-03-07 2006-03-07 実装方法
PCT/JP2007/054267 WO2007102482A1 (ja) 2006-03-07 2007-03-06 実装方法、電気部品付き基板及び電気装置

Publications (1)

Publication Number Publication Date
HK1127960A1 true HK1127960A1 (en) 2009-10-09

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Country Status (8)

Country Link
US (1) US20090039291A1 (xx)
EP (1) EP1993124A4 (xx)
JP (1) JP4902229B2 (xx)
KR (1) KR101088577B1 (xx)
CN (1) CN101395710B (xx)
HK (1) HK1127960A1 (xx)
TW (1) TW200807587A (xx)
WO (1) WO2007102482A1 (xx)

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JP5102704B2 (ja) * 2008-02-18 2012-12-19 デクセリアルズ株式会社 磁性シート及び磁性シートの製造方法
JP2010028015A (ja) * 2008-07-24 2010-02-04 Toppan Forms Co Ltd 部品実装基板の製造方法
WO2010109718A1 (ja) 2009-03-26 2010-09-30 シャープ株式会社 チップ部品実装構造、チップ部品実装方法および液晶表示装置
JP5523942B2 (ja) * 2010-06-11 2014-06-18 株式会社日立ハイテクインスツルメンツ 部品装着装置の部品実装方法および部品装着装置
US9029996B2 (en) * 2010-10-19 2015-05-12 Continental Automotive Systems, Inc. Bonding and electrically coupling components
JP6095006B2 (ja) * 2013-09-05 2017-03-15 日本化学工業株式会社 電子部品の実装方法、この実装方法を用いてｉｃタグを製造する方法、この実装方法を用いて発光電子部品を製造する方法、及びこの実装方法に用いる装置
JP6440946B2 (ja) * 2014-02-18 2018-12-19 デクセリアルズ株式会社 接続体の製造方法、電子部品の接続方法及び接続体
JP6489309B2 (ja) 2015-05-14 2019-03-27 パナソニックＩｐマネジメント株式会社 インプリント方法およびインプリント装置
KR102424347B1 (ko) 2018-11-06 2022-07-22 삼성전자주식회사 반도체 칩의 접착 방법

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JPH034546A (ja) * 1989-06-01 1991-01-10 Matsushita Electric Ind Co Ltd 半導体実装装置
JP2663649B2 (ja) * 1989-10-16 1997-10-15 松下電器産業株式会社 マルチチップ実装方法
JPH10340927A (ja) * 1997-06-06 1998-12-22 Matsushita Electron Corp 半導体装置の製造方法およびボンディング装置
JP3381563B2 (ja) 1997-07-28 2003-03-04 松下電器産業株式会社 半導体装置の製造方法
JPH1187413A (ja) * 1997-09-08 1999-03-30 Fujitsu Ltd 半導体ベアチップ実装方法
JP2000105388A (ja) 1998-09-30 2000-04-11 Matsushita Electric Ind Co Ltd 液晶表示装置の製造方法、液晶表示装置、および導電性接着フィルム
CN1201383C (zh) * 1999-01-29 2005-05-11 松下电器产业株式会社 电子部件的安装方法、安装装置及电子部件装置
JP2001308145A (ja) * 2000-04-25 2001-11-02 Fujitsu Ltd 半導体チップの実装方法
DE10232636A1 (de) * 2002-07-18 2004-02-12 Delo Industrieklebstoffe Gmbh & Co. Kg Verfahren und Klebstoff zur Flip-Chip-Kontaktierung
JP2005033053A (ja) * 2003-07-08 2005-02-03 Lintec Corp 半導体装置の製造方法及び半導体装置
JP3921459B2 (ja) 2003-07-11 2007-05-30 ソニーケミカル＆インフォメーションデバイス株式会社 電気部品の実装方法及び実装装置

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Publication number Publication date
EP1993124A4 (en) 2009-04-01
CN101395710A (zh) 2009-03-25
US20090039291A1 (en) 2009-02-12
KR20090004914A (ko) 2009-01-12
EP1993124A1 (en) 2008-11-19
WO2007102482A1 (ja) 2007-09-13
JP4902229B2 (ja) 2012-03-21
JP2007242752A (ja) 2007-09-20
CN101395710B (zh) 2010-06-23
KR101088577B1 (ko) 2011-12-05
TW200807587A (en) 2008-02-01

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