HK1065995A1 - A scribing method, a cutter wheel, a scribing apparatus using the cutter wheel, and an apparatus forproducing the cutter wheel - Google Patents

A scribing method, a cutter wheel, a scribing apparatus using the cutter wheel, and an apparatus forproducing the cutter wheel

Info

Publication number
HK1065995A1
HK1065995A1 HK04108892A HK04108892A HK1065995A1 HK 1065995 A1 HK1065995 A1 HK 1065995A1 HK 04108892 A HK04108892 A HK 04108892A HK 04108892 A HK04108892 A HK 04108892A HK 1065995 A1 HK1065995 A1 HK 1065995A1
Authority
HK
Hong Kong
Prior art keywords
cutter wheel
scribing
forproducing
scribing method
cutter
Prior art date
Application number
HK04108892A
Other languages
English (en)
Inventor
Kiyoshi Takamatsu
Kazuya Maekawa
Noriyuki Ogasawara
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of HK1065995A1 publication Critical patent/HK1065995A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0237—Pricking
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0341—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0385—Rotary scoring blade
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9372—Rotatable type

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
HK04108892A 2001-03-16 2004-11-11 A scribing method, a cutter wheel, a scribing apparatus using the cutter wheel, and an apparatus forproducing the cutter wheel HK1065995A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001076082 2001-03-16
PCT/JP2002/002522 WO2002074707A1 (fr) 2001-03-16 2002-03-15 Procede de rainurage, molette de decoupe, dispositif de rainurage utilisant ladite molette de decoupe et dispositif de production de molette de decoupe pour produire ladite molette de decoupe

Publications (1)

Publication Number Publication Date
HK1065995A1 true HK1065995A1 (en) 2005-03-11

Family

ID=18933073

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04108892A HK1065995A1 (en) 2001-03-16 2004-11-11 A scribing method, a cutter wheel, a scribing apparatus using the cutter wheel, and an apparatus forproducing the cutter wheel

Country Status (8)

Country Link
US (3) US7523846B2 (xx)
EP (1) EP1378495A4 (xx)
JP (1) JP4038431B2 (xx)
KR (1) KR100555329B1 (xx)
CN (2) CN1970266B (xx)
HK (1) HK1065995A1 (xx)
TW (1) TWI261049B (xx)
WO (1) WO2002074707A1 (xx)

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JP4131853B2 (ja) * 2003-04-28 2008-08-13 株式会社 日立ディスプレイズ 表示装置の製造方法及び製造装置
WO2005053925A1 (ja) * 2003-12-04 2005-06-16 Mitsuboshi Diamond Industrial Co., Ltd. 基板加工方法、基板加工装置および基板搬送方法、基板搬送機構
CN1906002B (zh) * 2003-12-29 2011-08-31 三星钻石工业株式会社 划线形成机构、划线头和划线设备
KR101307277B1 (ko) * 2004-07-16 2013-09-11 미쓰보시 다이야몬도 고교 가부시키가이샤 커터휠과 그 제조방법, 수동 스크라이브 공구 및 스크라이브 장치
TWI380868B (zh) * 2005-02-02 2013-01-01 Mitsuboshi Diamond Ind Co Ltdl Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same
JP2006259566A (ja) * 2005-03-18 2006-09-28 Hitachi Displays Ltd 表示装置とその製造方法
KR101211426B1 (ko) * 2005-07-06 2012-12-12 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료용 스크라이빙 휠, 및 이를 이용한 스크라이브 방법, 스크라이브 장치 및 스크라이브 공구
DE102006012582B4 (de) * 2006-03-16 2010-01-21 Schott Ag Vorrichtung und Verfahren zum Abtrennen von Abschnitten von Glasstangen
JP4240111B2 (ja) * 2006-11-06 2009-03-18 セイコーエプソン株式会社 電気光学装置の製造方法
TWI486320B (zh) * 2007-03-02 2015-06-01 Nippon Electric Glass Co 強化板玻璃及其製造方法
JP2008292997A (ja) * 2007-04-27 2008-12-04 Semiconductor Energy Lab Co Ltd 液晶表示装置の作製方法
DE102007045383A1 (de) * 2007-09-22 2008-07-17 Bohle Ag Verfahren zur Herstellung von Schneidrädchen
DE202007013306U1 (de) * 2007-09-22 2008-04-24 Bohle Ag Schneidrädchen
DE202007013307U1 (de) * 2007-09-22 2008-04-24 Bohle Ag Schneidrädchen
KR101228959B1 (ko) * 2008-05-30 2013-02-01 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 모따기 방법
WO2009148073A1 (ja) * 2008-06-05 2009-12-10 三星ダイヤモンド工業株式会社 スクライビングホイール及び脆性材料基板のスクライブ方法
JP5192977B2 (ja) * 2008-10-10 2013-05-08 三星ダイヤモンド工業株式会社 貼り合せ基板のスクライブ方法
KR100966082B1 (ko) * 2009-06-16 2010-06-28 주식회사 토비스 액정 패널 절단 방법
JP2011088382A (ja) * 2009-10-23 2011-05-06 Mitsuboshi Diamond Industrial Co Ltd ブレイク装置およびブレイク方法
JP5501024B2 (ja) 2010-02-22 2014-05-21 株式会社ジャパンディスプレイ 液晶表示パネル
TWI494284B (zh) 2010-03-19 2015-08-01 Corning Inc 強化玻璃之機械劃割及分離
US8864005B2 (en) 2010-07-16 2014-10-21 Corning Incorporated Methods for scribing and separating strengthened glass substrates
JP5118736B2 (ja) 2010-09-28 2013-01-16 三星ダイヤモンド工業株式会社 スクライブ方法及びスクライビングホイール
CN101973080B (zh) * 2010-10-15 2013-09-04 北京石晶光电科技股份有限公司济源分公司 石英棒材切割工艺
CN102219366B (zh) * 2011-04-12 2012-12-19 深圳市晶向科技有限公司 异型玻璃切割机的自动对位***及自动对位方法
DE102011002209A1 (de) * 2011-04-20 2012-10-25 Simon Möhringer Anlagenbau GmbH Vorrichtung zur schleifenden Materialtrennung
WO2013056591A1 (zh) * 2011-10-17 2013-04-25 苏州天健旋切技术有限公司 旋转对切复合锯片
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US10351460B2 (en) * 2012-05-22 2019-07-16 Corning Incorporated Methods of separating strengthened glass sheets by mechanical scribing
JP6268805B2 (ja) * 2013-08-13 2018-01-31 日本電気硝子株式会社 ガラス板の製造方法
WO2015048902A1 (en) * 2013-10-03 2015-04-09 Bromer Inc. Glass-breaking device and apparatus
KR20150129156A (ko) * 2014-05-08 2015-11-19 삼성디스플레이 주식회사 표시 패널 제조 방법
CN105365058A (zh) * 2014-05-26 2016-03-02 孙春雨 一种脆性材料的切割刀轮
CN111116029A (zh) 2014-05-30 2020-05-08 三星钻石工业股份有限公司 脆性基板的裂缝线形成方法及脆性基板
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Also Published As

Publication number Publication date
WO2002074707A1 (fr) 2002-09-26
CN1970266A (zh) 2007-05-30
KR20030076719A (ko) 2003-09-26
US7523846B2 (en) 2009-04-28
JP4038431B2 (ja) 2008-01-23
CN1496339A (zh) 2004-05-12
CN100361914C (zh) 2008-01-16
KR100555329B1 (ko) 2006-02-24
TWI261049B (en) 2006-09-01
US20090126551A1 (en) 2009-05-21
CN1970266B (zh) 2010-09-01
EP1378495A1 (en) 2004-01-07
JPWO2002074707A1 (ja) 2004-07-08
US20040155085A1 (en) 2004-08-12
US20090179060A1 (en) 2009-07-16
EP1378495A4 (en) 2010-03-03
US7975588B2 (en) 2011-07-12

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Legal Events

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PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20120315