HK1052525A1 - Polymerization initiator systems and bonding compositions comprising vinyl aromatic compounds - Google Patents
Polymerization initiator systems and bonding compositions comprising vinyl aromatic compoundsInfo
- Publication number
- HK1052525A1 HK1052525A1 HK03103577A HK03103577A HK1052525A1 HK 1052525 A1 HK1052525 A1 HK 1052525A1 HK 03103577 A HK03103577 A HK 03103577A HK 03103577 A HK03103577 A HK 03103577A HK 1052525 A1 HK1052525 A1 HK 1052525A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- polymerization initiator
- vinyl aromatic
- initiator systems
- bonding compositions
- aromatic compounds
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Polymerization Catalysts (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/525,368 US6479602B1 (en) | 2000-03-15 | 2000-03-15 | Polymerization initiator systems and bonding compositions comprising vinyl aromatic compounds |
PCT/US2001/004752 WO2001068783A2 (en) | 2000-03-15 | 2001-02-14 | Polymerization initiator systems and bonding compositions comprising vinyl aromatic compounds |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1052525A1 true HK1052525A1 (en) | 2003-09-19 |
Family
ID=24092956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK03103577A HK1052525A1 (en) | 2000-03-15 | 2003-05-20 | Polymerization initiator systems and bonding compositions comprising vinyl aromatic compounds |
Country Status (9)
Country | Link |
---|---|
US (1) | US6479602B1 (pt) |
EP (1) | EP1263907B1 (pt) |
JP (2) | JP5073906B2 (pt) |
CN (1) | CN1253477C (pt) |
AT (1) | ATE300589T1 (pt) |
BR (1) | BR0109243A (pt) |
DE (1) | DE60112255T2 (pt) |
HK (1) | HK1052525A1 (pt) |
WO (1) | WO2001068783A2 (pt) |
Families Citing this family (24)
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US6812308B2 (en) * | 2000-11-21 | 2004-11-02 | 3M Innovative Properties Company | Initiator systems and adhesive compositions made therewith |
KR100794633B1 (ko) * | 2000-05-18 | 2008-01-14 | 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션 | 경화성 전자 공여체 화합물 |
CN1237077C (zh) | 2001-02-21 | 2006-01-18 | 3M创新有限公司 | 工作寿命长的可聚合体系 |
US6734268B2 (en) * | 2001-12-31 | 2004-05-11 | 3M Innovative Properties Company | Metal salt modifiers for bonding compositions |
US6849569B2 (en) * | 2001-12-31 | 2005-02-01 | 3M Innovative Properties Company | Initiator systems comprising β-ketone compounds |
GB0311121D0 (en) * | 2003-05-15 | 2003-06-18 | Avecia Ltd | Polyurethane dispersants |
US20040229990A1 (en) * | 2003-05-16 | 2004-11-18 | Lord Corporation | Acrylic structural adhesive having improved T-peel strength |
US6911509B1 (en) * | 2004-02-17 | 2005-06-28 | The Penn State Research Foundation | Functional fluoropolymers and process therefor |
US7220807B2 (en) * | 2004-02-17 | 2007-05-22 | Penn State Research Foundation | Process of preparing functional fluoropolymers |
DE102005049681B4 (de) * | 2005-10-14 | 2011-03-10 | Henkel Ag & Co. Kgaa | Hülsenförmige Etiketten |
US8742050B2 (en) | 2008-03-28 | 2014-06-03 | Henkel US IP LLC | Two part hybrid adhesive |
AU2010264689A1 (en) * | 2009-06-26 | 2012-02-02 | Basf Se | Paint coating system and method of producing multilayered paint coating |
GB2497300A (en) * | 2011-12-06 | 2013-06-12 | Tyco Electronics Ltd Uk | Method of repairing or encapsulating a cable |
EP3019538B1 (en) * | 2013-07-12 | 2018-04-18 | 3M Innovative Properties Company | Bonding composition and component thereof, and method of using the same |
JP6297857B2 (ja) * | 2014-02-21 | 2018-03-20 | スリーエム イノベイティブ プロパティズ カンパニー | 2液型接着剤及びそれを含む構造体 |
WO2016028783A1 (en) | 2014-08-18 | 2016-02-25 | Lord Corporation | Method for low temperature bonding of elastomers |
JP6404645B2 (ja) * | 2014-08-28 | 2018-10-10 | スリーエム イノベイティブ プロパティズ カンパニー | 2液型接着剤及びそれを含む構造体 |
EP3218442B1 (en) | 2014-11-14 | 2018-09-05 | 3M Innovative Properties Company | Two-part adhesive composition and method of making an adhesive composition |
JP6676946B2 (ja) * | 2015-12-10 | 2020-04-08 | 日立化成株式会社 | 樹脂組成物 |
KR20190086462A (ko) * | 2016-11-17 | 2019-07-22 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 중합체 및 중공 세라믹 미소구체를 포함하는 조성물 및 3차원 물품의 제조 방법 |
DE102019200736A1 (de) * | 2019-01-22 | 2020-07-23 | Tesa Se | Reaktives 2-Komponentenklebesystem in Filmform auf Basis von geruchsneutralen Acrylmonomeren |
FR3098815B1 (fr) * | 2019-07-18 | 2021-06-25 | Bostik Sa | Procédé de polymérisation avec un complexe de borane-amine |
CN113403017A (zh) * | 2020-09-30 | 2021-09-17 | 丁建利 | 一种金属与塑料粘结用胶粘剂 |
WO2022254369A1 (en) | 2021-06-02 | 2022-12-08 | 3M Innovative Properties Company | Composition including cyclic imide-containing monomer and organoborane complex and related articles and methods |
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-
2000
- 2000-03-15 US US09/525,368 patent/US6479602B1/en not_active Expired - Lifetime
-
2001
- 2001-02-14 WO PCT/US2001/004752 patent/WO2001068783A2/en active IP Right Grant
- 2001-02-14 CN CNB018065767A patent/CN1253477C/zh not_active Expired - Fee Related
- 2001-02-14 AT AT01910679T patent/ATE300589T1/de not_active IP Right Cessation
- 2001-02-14 DE DE60112255T patent/DE60112255T2/de not_active Expired - Lifetime
- 2001-02-14 EP EP01910679A patent/EP1263907B1/en not_active Expired - Lifetime
- 2001-02-14 BR BR0109243-0A patent/BR0109243A/pt not_active Application Discontinuation
- 2001-02-14 JP JP2001567270A patent/JP5073906B2/ja not_active Expired - Fee Related
-
2003
- 2003-05-20 HK HK03103577A patent/HK1052525A1/xx not_active IP Right Cessation
-
2012
- 2012-05-10 JP JP2012108523A patent/JP5443538B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE60112255T2 (de) | 2006-05-24 |
EP1263907B1 (en) | 2005-07-27 |
CN1418246A (zh) | 2003-05-14 |
JP2012158767A (ja) | 2012-08-23 |
WO2001068783A2 (en) | 2001-09-20 |
CN1253477C (zh) | 2006-04-26 |
JP5073906B2 (ja) | 2012-11-14 |
WO2001068783A3 (en) | 2002-02-21 |
BR0109243A (pt) | 2002-12-24 |
EP1263907A2 (en) | 2002-12-11 |
DE60112255D1 (de) | 2005-09-01 |
US6479602B1 (en) | 2002-11-12 |
ATE300589T1 (de) | 2005-08-15 |
JP5443538B2 (ja) | 2014-03-19 |
JP2003526729A (ja) | 2003-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20100214 |