HK1050867A1 - Method and apparatus for laser drilling. - Google Patents
Method and apparatus for laser drilling.Info
- Publication number
- HK1050867A1 HK1050867A1 HK03103091A HK03103091A HK1050867A1 HK 1050867 A1 HK1050867 A1 HK 1050867A1 HK 03103091 A HK03103091 A HK 03103091A HK 03103091 A HK03103091 A HK 03103091A HK 1050867 A1 HK1050867 A1 HK 1050867A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- laser drilling
- drilling
- laser
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28630499A JP2001105164A (ja) | 1999-10-07 | 1999-10-07 | レーザ穴あけ加工方法及び加工装置 |
PCT/JP2000/006878 WO2001024964A1 (fr) | 1999-10-07 | 2000-10-03 | Procede et appareil pour perçage au laser |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1050867A1 true HK1050867A1 (en) | 2003-07-11 |
Family
ID=17702657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK03103091A HK1050867A1 (en) | 1999-10-07 | 2003-04-30 | Method and apparatus for laser drilling. |
Country Status (8)
Country | Link |
---|---|
US (1) | US6720524B1 (zh) |
EP (1) | EP1231013A4 (zh) |
JP (1) | JP2001105164A (zh) |
KR (1) | KR100477147B1 (zh) |
CN (1) | CN1170653C (zh) |
HK (1) | HK1050867A1 (zh) |
TW (1) | TW460352B (zh) |
WO (1) | WO2001024964A1 (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100488165B1 (ko) * | 2002-01-29 | 2005-05-06 | (주)삼성종합호스 | 분수 호스 천공 장치 |
KR20030075731A (ko) * | 2002-03-20 | 2003-09-26 | (주)삼성종합호스 | Pe 편직 천공호스, 그리고 상기 pe 편직 천공호스를제조하기 위한 제조장치 |
KR20030075729A (ko) * | 2002-03-20 | 2003-09-26 | (주)삼성종합호스 | 비닐 천공호스, 그리고 상기 비닐 천공호스를 제조하기위한 제조장치 및 제조방법 |
DE10225387B4 (de) * | 2002-06-07 | 2007-09-20 | Mlt Micro Laser Technology Gmbh | Vorrichtung zur Substratbehandlung mittels Laserstrahlung |
KR100570979B1 (ko) * | 2004-10-26 | 2006-04-13 | 삼성에스디아이 주식회사 | 이미지 방향 조절기를 구비한 광학계 및 상기 광학계를구비한 레이저 조사장치 |
US10488606B2 (en) * | 2005-09-19 | 2019-11-26 | Topcon Medical Laser Systems, Inc. | Optical switch and method for treatment of tissue |
JP4667329B2 (ja) * | 2006-08-30 | 2011-04-13 | 三菱電機株式会社 | レーザ加工装置 |
KR20080028559A (ko) * | 2006-09-27 | 2008-04-01 | 주식회사 이오테크닉스 | 폴리곤 미러를 이용한 대상물 다중 가공 방법 |
JP4961517B2 (ja) * | 2007-02-20 | 2012-06-27 | 国立大学法人福井大学 | ステント及びそれを用いた管状器官の治療具 |
US8294062B2 (en) * | 2007-08-20 | 2012-10-23 | Universal Laser Systems, Inc. | Laser beam positioning systems for material processing and methods for using such systems |
JP2009106979A (ja) * | 2007-10-30 | 2009-05-21 | Sumitomo Heavy Ind Ltd | レーザ加工装置、及び、レーザ加工方法 |
CN101856772A (zh) * | 2010-05-27 | 2010-10-13 | 张立国 | 一种光束旋转振镜扫描聚焦加工*** |
GB2490143B (en) * | 2011-04-20 | 2013-03-13 | Rolls Royce Plc | Method of manufacturing a component |
JPWO2012172960A1 (ja) * | 2011-06-15 | 2015-02-23 | 旭硝子株式会社 | ガラス板の切断方法 |
US20130052768A1 (en) * | 2011-08-24 | 2013-02-28 | Applied Materials, Inc. | High speed laser scanning system for silicon solar cell fabrication |
KR20140133741A (ko) * | 2013-05-10 | 2014-11-20 | 삼성디스플레이 주식회사 | 레이저 열전사용 마스크 및 이를 포함하는 레이저 조사 장치 |
CN103639594B (zh) * | 2013-12-19 | 2015-10-28 | 苏州德龙激光股份有限公司 | 激光钻孔方法 |
WO2015126438A1 (en) * | 2014-02-20 | 2015-08-27 | Applied Materials, Inc. | Laser ablation platform for solar cells |
EP2940740A1 (en) * | 2014-05-02 | 2015-11-04 | Applied Materials, Inc. | Edge scan and alignment |
RU2661977C1 (ru) * | 2014-07-03 | 2018-07-23 | Ниппон Стил Энд Сумитомо Метал Корпорейшн | Устройство лазерной обработки |
EP3047932B1 (en) * | 2015-01-21 | 2018-12-26 | Agie Charmilles New Technologies SA | Method of laser ablation for engraving of a surface with patch optimization, with corresponding software and machine tool |
DE102017218130A1 (de) * | 2017-10-11 | 2019-04-11 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Stromableiters, Elektrode und Batteriezelle |
US11237386B2 (en) * | 2020-03-11 | 2022-02-01 | Rohr, Inc. | Substrate perforation system and method using polygon mirror(s) |
US20210283719A1 (en) * | 2020-03-12 | 2021-09-16 | Rohr, Inc. | Substrate perforation system & method using beamlets |
JP2023045543A (ja) * | 2021-09-22 | 2023-04-03 | 川崎重工業株式会社 | レーザ加工方法 |
CN114193007A (zh) * | 2022-01-21 | 2022-03-18 | 武汉元禄光电技术有限公司 | 多头fpc紫外激光钻孔装置及方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3742182A (en) * | 1971-12-27 | 1973-06-26 | Coherent Radiation | Method for scanning mask forming holes with a laser beam |
JPS52108598A (en) * | 1976-03-08 | 1977-09-12 | Nec Corp | Laser processing device |
DE2918283C2 (de) * | 1979-05-07 | 1983-04-21 | Carl Baasel, Lasertechnik KG, 8000 München | Gerät zur Substratbehandlung mit einem Drehspiegel od. dgl. |
JPH0441259A (ja) | 1990-06-07 | 1992-02-12 | Komatsu Ltd | レーザ印字装置 |
JP2701183B2 (ja) | 1991-08-09 | 1998-01-21 | 株式会社小松製作所 | 液晶マスク式レーザマーカ |
JP3101636B2 (ja) * | 1991-11-21 | 2000-10-23 | 日本たばこ産業株式会社 | 帯状シートの穿孔装置 |
JP2588281Y2 (ja) * | 1992-11-25 | 1999-01-06 | 株式会社小松製作所 | レーザマーキング装置 |
JP3257157B2 (ja) | 1993-07-16 | 2002-02-18 | 松下電器産業株式会社 | Co2レーザ穴加工装置及び方法 |
JPH08150485A (ja) | 1994-11-28 | 1996-06-11 | Komatsu Ltd | レーザマーキング装置 |
JP3141715B2 (ja) * | 1994-12-22 | 2001-03-05 | 松下電器産業株式会社 | レーザ加工方法 |
JP3021330B2 (ja) * | 1995-09-29 | 2000-03-15 | 三菱重工業株式会社 | 液晶カラーフィルタの溝加工方法 |
US6220058B1 (en) * | 1996-03-25 | 2001-04-24 | Nippon Sheet Glass Co., Ltd | Method of changing the surface of a glass substrate containing silver, by using a laser beam |
JP3312294B2 (ja) | 1996-05-17 | 2002-08-05 | 住友重機械工業株式会社 | 複数軸ガルバノスキャナを用いたレーザ加工装置及びレーザ加工方法 |
US5837962A (en) * | 1996-07-15 | 1998-11-17 | Overbeck; James W. | Faster laser marker employing acousto-optic deflection |
US5948200A (en) * | 1996-07-26 | 1999-09-07 | Taiyo Yuden Co., Ltd. | Method of manufacturing laminated ceramic electronic parts |
JPH10166167A (ja) * | 1996-12-03 | 1998-06-23 | Komatsu Ltd | レーザマーキング方法及び装置 |
US6090330A (en) * | 1997-02-06 | 2000-07-18 | Matsushita Electric Industrial Co., Ltd. | Laser processing method |
JPH10242617A (ja) * | 1997-02-28 | 1998-09-11 | Murata Mfg Co Ltd | セラミックグリーンシートの加工方法及びレーザ加工装置 |
JP3691221B2 (ja) * | 1997-09-24 | 2005-09-07 | 三菱電機株式会社 | レーザ加工方法 |
JP3353134B2 (ja) * | 1998-03-02 | 2002-12-03 | 住友重機械工業株式会社 | レーザ加工装置 |
-
1999
- 1999-10-07 JP JP28630499A patent/JP2001105164A/ja active Pending
-
2000
- 2000-10-03 WO PCT/JP2000/006878 patent/WO2001024964A1/ja not_active Application Discontinuation
- 2000-10-03 EP EP00963076A patent/EP1231013A4/en not_active Withdrawn
- 2000-10-03 CN CNB008139830A patent/CN1170653C/zh not_active Expired - Fee Related
- 2000-10-03 US US10/089,063 patent/US6720524B1/en not_active Expired - Fee Related
- 2000-10-03 KR KR10-2002-7003935A patent/KR100477147B1/ko not_active IP Right Cessation
- 2000-10-06 TW TW089120952A patent/TW460352B/zh not_active IP Right Cessation
-
2003
- 2003-04-30 HK HK03103091A patent/HK1050867A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20020033205A (ko) | 2002-05-04 |
CN1378493A (zh) | 2002-11-06 |
EP1231013A4 (en) | 2007-05-09 |
KR100477147B1 (ko) | 2005-03-17 |
EP1231013A1 (en) | 2002-08-14 |
US6720524B1 (en) | 2004-04-13 |
JP2001105164A (ja) | 2001-04-17 |
WO2001024964A1 (fr) | 2001-04-12 |
TW460352B (en) | 2001-10-21 |
CN1170653C (zh) | 2004-10-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20131003 |