HK1046986B - 用於盤狀工件的鍍膜站 - Google Patents
用於盤狀工件的鍍膜站Info
- Publication number
- HK1046986B HK1046986B HK02105269.1A HK02105269A HK1046986B HK 1046986 B HK1046986 B HK 1046986B HK 02105269 A HK02105269 A HK 02105269A HK 1046986 B HK1046986 B HK 1046986B
- Authority
- HK
- Hong Kong
- Prior art keywords
- coating station
- disk
- rams
- transport
- axis
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Coating Apparatus (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Magnetic Record Carriers (AREA)
- Spray Control Apparatus (AREA)
- Manufacturing Optical Record Carriers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH12332000 | 2000-06-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
HK1046986A1 HK1046986A1 (en) | 2003-01-30 |
HK1046986B true HK1046986B (zh) | 2005-06-03 |
Family
ID=4564286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK02105269.1A HK1046986B (zh) | 2000-06-22 | 2002-07-16 | 用於盤狀工件的鍍膜站 |
Country Status (5)
Country | Link |
---|---|
US (2) | US6656330B2 (zh) |
EP (1) | EP1172842B1 (zh) |
AT (1) | ATE280436T1 (zh) |
DE (1) | DE50104178D1 (zh) |
HK (1) | HK1046986B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7432634B2 (en) | 2000-10-27 | 2008-10-07 | Board Of Regents, University Of Texas System | Remote center compliant flexure device |
US6873087B1 (en) * | 1999-10-29 | 2005-03-29 | Board Of Regents, The University Of Texas System | High precision orientation alignment and gap control stages for imprint lithography processes |
CN1262883C (zh) * | 2000-07-17 | 2006-07-05 | 得克萨斯州大学***董事会 | 影印用于平版印刷工艺中的自动化液体分配的方法和*** |
US20060005657A1 (en) * | 2004-06-01 | 2006-01-12 | Molecular Imprints, Inc. | Method and system to control movement of a body for nano-scale manufacturing |
US20080131622A1 (en) * | 2006-12-01 | 2008-06-05 | White John M | Plasma reactor substrate mounting surface texturing |
EP1970467B1 (de) * | 2007-03-14 | 2012-05-16 | Applied Materials, Inc. | Flutungskammer für Beschichtungsanlagen |
PL3087213T3 (pl) | 2014-12-22 | 2018-08-31 | Singulus Technologies Ag | Instalacja przelotowa |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4670126A (en) * | 1986-04-28 | 1987-06-02 | Varian Associates, Inc. | Sputter module for modular wafer processing system |
US5709785A (en) * | 1995-06-08 | 1998-01-20 | First Light Technology Inc. | Metallizing machine |
US5855675A (en) * | 1997-03-03 | 1999-01-05 | Genus, Inc. | Multipurpose processing chamber for chemical vapor deposition processes |
DE29716440U1 (de) * | 1997-09-12 | 1997-12-11 | Balzers Ag, Balzers | Sputterstation |
DE19742923A1 (de) | 1997-09-29 | 1999-04-01 | Leybold Systems Gmbh | Vorrichtung zum Beschichten eines im wesentlichen flachen, scheibenförmigen Substrats |
DE19806282C1 (de) * | 1998-02-16 | 1999-03-25 | Singulus Technologies Ag | Vorrichtung und Verfahren von zum Belüften einer Vakuum-Bearbeitungskammer mit einer Transportkammer |
-
2001
- 2001-06-15 AT AT01114426T patent/ATE280436T1/de not_active IP Right Cessation
- 2001-06-15 EP EP01114426A patent/EP1172842B1/de not_active Expired - Lifetime
- 2001-06-15 DE DE50104178T patent/DE50104178D1/de not_active Expired - Lifetime
- 2001-06-21 US US09/886,678 patent/US6656330B2/en not_active Expired - Fee Related
-
2002
- 2002-07-16 HK HK02105269.1A patent/HK1046986B/zh not_active IP Right Cessation
-
2003
- 2003-07-01 US US10/611,754 patent/US6841048B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1172842A3 (de) | 2002-04-03 |
US20040003992A1 (en) | 2004-01-08 |
US6656330B2 (en) | 2003-12-02 |
US6841048B2 (en) | 2005-01-11 |
HK1046986A1 (en) | 2003-01-30 |
ATE280436T1 (de) | 2004-11-15 |
US20020005165A1 (en) | 2002-01-17 |
DE50104178D1 (de) | 2004-11-25 |
EP1172842B1 (de) | 2004-10-20 |
EP1172842A2 (de) | 2002-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20090615 |