HK1045372B - 動態平衡的微電子機械裝置 - Google Patents

動態平衡的微電子機械裝置

Info

Publication number
HK1045372B
HK1045372B HK02105453.7A HK02105453A HK1045372B HK 1045372 B HK1045372 B HK 1045372B HK 02105453 A HK02105453 A HK 02105453A HK 1045372 B HK1045372 B HK 1045372B
Authority
HK
Hong Kong
Prior art keywords
tuning fork
dynamically balanced
microelectromechanical devices
balancing
microfabricated
Prior art date
Application number
HK02105453.7A
Other languages
English (en)
Other versions
HK1045372A1 (en
Inventor
Marc S Weinberg
Kaplesh Kumar
A Thomas King
Original Assignee
Charles Stark Draper Laboratory Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Charles Stark Draper Laboratory Inc filed Critical Charles Stark Draper Laboratory Inc
Publication of HK1045372A1 publication Critical patent/HK1045372A1/xx
Publication of HK1045372B publication Critical patent/HK1045372B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
    • G01C25/005—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass initial alignment, calibration or starting-up of inertial devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B23K26/125—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases of mixed gases
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Manufacturing & Machinery (AREA)
  • Gyroscopes (AREA)
  • Micromachines (AREA)
HK02105453.7A 1999-03-25 2002-07-23 動態平衡的微電子機械裝置 HK1045372B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12620599P 1999-03-25 1999-03-25
PCT/US2000/007756 WO2000057194A1 (en) 1999-03-25 2000-03-23 Dynamically balanced microelectromechanical devices

Publications (2)

Publication Number Publication Date
HK1045372A1 HK1045372A1 (en) 2002-11-22
HK1045372B true HK1045372B (zh) 2010-11-05

Family

ID=22423563

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02105453.7A HK1045372B (zh) 1999-03-25 2002-07-23 動態平衡的微電子機械裝置

Country Status (8)

Country Link
US (1) US6571630B1 (zh)
EP (1) EP1173773B1 (zh)
JP (1) JP5123447B2 (zh)
AT (1) ATE466288T1 (zh)
DE (1) DE60044293D1 (zh)
HK (1) HK1045372B (zh)
TW (1) TW425479B (zh)
WO (1) WO2000057194A1 (zh)

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US6854315B2 (en) * 2002-04-22 2005-02-15 Northrop Grumman Corporation Quadrature compensation technique for vibrating gyroscopes
US6718823B2 (en) * 2002-04-30 2004-04-13 Honeywell International Inc. Pulse width modulation drive signal for a MEMS gyroscope
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US6978673B2 (en) * 2003-02-07 2005-12-27 Honeywell International, Inc. Methods and systems for simultaneously fabricating multi-frequency MEMS devices
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US7302848B2 (en) 2005-03-10 2007-12-04 The Charles Stark Draper Laboratory, Inc. Force compensated comb drive
US20070163346A1 (en) * 2006-01-18 2007-07-19 Honeywell International Inc. Frequency shifting of rotational harmonics in mems devices
US7290435B2 (en) * 2006-02-06 2007-11-06 Invensense Inc. Method and apparatus for electronic cancellation of quadrature error
JP2008194729A (ja) * 2007-02-13 2008-08-28 Fujitsu Ltd 小型デバイスの製造方法、レーザ加工方法及びレーザ加工装置
FI119895B (fi) * 2007-10-05 2009-04-30 Vti Technologies Oy Värähtelevä mikromekaaninen kulmanopeusanturi
EP2098822B8 (en) 2008-03-05 2015-08-12 Colibrys S.A. Vibrating gyroscope with quadrature signals reduction
US8187902B2 (en) 2008-07-09 2012-05-29 The Charles Stark Draper Laboratory, Inc. High performance sensors and methods for forming the same
EP2327960B1 (en) * 2008-08-18 2019-10-09 Hitachi, Ltd. Micro electro mechanical system
WO2010138717A1 (en) * 2009-05-27 2010-12-02 King Abdullah University Of Science And Technology Mems mass spring damper systems using an out-of-plane suspension scheme
US9097524B2 (en) 2009-09-11 2015-08-04 Invensense, Inc. MEMS device with improved spring system
US8534127B2 (en) 2009-09-11 2013-09-17 Invensense, Inc. Extension-mode angular velocity sensor
JP6010968B2 (ja) * 2012-03-29 2016-10-19 セイコーエプソン株式会社 振動デバイス及び振動デバイスの製造方法
JP5963567B2 (ja) * 2012-06-26 2016-08-03 日立オートモティブシステムズ株式会社 慣性センサ
US9316665B2 (en) * 2013-04-22 2016-04-19 Freescale Semicondcutor, Inc. Estimation of sidewall skew angles of a structure
CN103697909B (zh) * 2013-12-13 2016-06-01 上海交通大学 导轨滑块型圆盘式微机械固体波动陀螺封装装置及方法
SE537998C2 (sv) 2014-05-09 2016-02-02 Per-Axel Uhlin Vibrationssensor av magnetisk typ
US10514259B2 (en) 2016-08-31 2019-12-24 Analog Devices, Inc. Quad proof mass MEMS gyroscope with outer couplers and related methods
JP6819216B2 (ja) 2016-10-26 2021-01-27 セイコーエプソン株式会社 ジャイロセンサー、ジャイロセンサーの製造方法、電子機器および移動体
US10415968B2 (en) 2016-12-19 2019-09-17 Analog Devices, Inc. Synchronized mass gyroscope
US10697774B2 (en) 2016-12-19 2020-06-30 Analog Devices, Inc. Balanced runners synchronizing motion of masses in micromachined devices
US10627235B2 (en) 2016-12-19 2020-04-21 Analog Devices, Inc. Flexural couplers for microelectromechanical systems (MEMS) devices
JP2018185188A (ja) 2017-04-25 2018-11-22 セイコーエプソン株式会社 物理量センサー、物理量センサーの製造方法、物理量センサーデバイス、電子機器および移動体
JP6984342B2 (ja) * 2017-11-22 2021-12-17 セイコーエプソン株式会社 物理量センサー、物理量センサーの製造方法、慣性計測ユニット、携帯型電子機器、電子機器、および移動体
JP2019132690A (ja) 2018-01-31 2019-08-08 セイコーエプソン株式会社 物理量センサー、物理量センサーデバイス、複合センサーデバイス、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器、移動体および物理量センサーの出力信号調整方法
US10948294B2 (en) 2018-04-05 2021-03-16 Analog Devices, Inc. MEMS gyroscopes with in-line springs and related systems and methods
JP7192437B2 (ja) 2018-11-28 2022-12-20 セイコーエプソン株式会社 慣性センサー、電子機器および移動体
JP7225817B2 (ja) 2019-01-17 2023-02-21 セイコーエプソン株式会社 角速度センサー、慣性計測装置、電子機器および移動体
JP7188311B2 (ja) 2019-07-31 2022-12-13 セイコーエプソン株式会社 ジャイロセンサー、電子機器、及び移動体
US11193771B1 (en) 2020-06-05 2021-12-07 Analog Devices, Inc. 3-axis gyroscope with rotational vibration rejection
US11686581B2 (en) 2020-06-08 2023-06-27 Analog Devices, Inc. Stress-relief MEMS gyroscope
CN116075728A (zh) 2020-06-08 2023-05-05 美国亚德诺半导体公司 驱动和感测应力释放装置
US11698257B2 (en) 2020-08-24 2023-07-11 Analog Devices, Inc. Isotropic attenuated motion gyroscope
CN114689088B (zh) * 2022-06-02 2022-08-02 中国人民解放军国防科技大学 一种用于振动陀螺不平衡质量检测的弹性支撑电极结构

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JPH0642970A (ja) * 1992-07-23 1994-02-18 Murata Mfg Co Ltd 角速度センサ
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JP3218813B2 (ja) * 1993-02-03 2001-10-15 松下電器産業株式会社 角速度センサおよびその製造方法
JP3336780B2 (ja) * 1994-11-16 2002-10-21 株式会社村田製作所 振動子の共振周波数調整方法およびその装置
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JPH09269229A (ja) * 1996-04-02 1997-10-14 Nikon Corp 圧電振動角速度計用振動子の感度調節方法
JP3327150B2 (ja) * 1996-12-13 2002-09-24 株式会社豊田中央研究所 共振型角速度センサ
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JPH10197256A (ja) * 1997-01-16 1998-07-31 Toyota Motor Corp 角速度検出装置

Also Published As

Publication number Publication date
JP2002540406A (ja) 2002-11-26
US6571630B1 (en) 2003-06-03
HK1045372A1 (en) 2002-11-22
JP5123447B2 (ja) 2013-01-23
TW425479B (en) 2001-03-11
EP1173773A4 (en) 2006-05-17
EP1173773A1 (en) 2002-01-23
WO2000057194A1 (en) 2000-09-28
EP1173773B1 (en) 2010-04-28
ATE466288T1 (de) 2010-05-15
DE60044293D1 (de) 2010-06-10

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20160323