ATE466288T1 - Dynamisch ausbalancierte mikroelektromechanische vorrichtungen - Google Patents

Dynamisch ausbalancierte mikroelektromechanische vorrichtungen

Info

Publication number
ATE466288T1
ATE466288T1 AT00918314T AT00918314T ATE466288T1 AT E466288 T1 ATE466288 T1 AT E466288T1 AT 00918314 T AT00918314 T AT 00918314T AT 00918314 T AT00918314 T AT 00918314T AT E466288 T1 ATE466288 T1 AT E466288T1
Authority
AT
Austria
Prior art keywords
tuning fork
microelectromechanical devices
balancing
dynamic balanced
dynamic
Prior art date
Application number
AT00918314T
Other languages
English (en)
Inventor
Marc Weinberg
Kaplesh Kumar
A King
Original Assignee
Draper Lab Charles S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Draper Lab Charles S filed Critical Draper Lab Charles S
Application granted granted Critical
Publication of ATE466288T1 publication Critical patent/ATE466288T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
    • G01C25/005—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass initial alignment, calibration or starting-up of inertial devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B23K26/125—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases of mixed gases
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Manufacturing & Machinery (AREA)
  • Gyroscopes (AREA)
  • Micromachines (AREA)
AT00918314T 1999-03-25 2000-03-23 Dynamisch ausbalancierte mikroelektromechanische vorrichtungen ATE466288T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12620599P 1999-03-25 1999-03-25
PCT/US2000/007756 WO2000057194A1 (en) 1999-03-25 2000-03-23 Dynamically balanced microelectromechanical devices

Publications (1)

Publication Number Publication Date
ATE466288T1 true ATE466288T1 (de) 2010-05-15

Family

ID=22423563

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00918314T ATE466288T1 (de) 1999-03-25 2000-03-23 Dynamisch ausbalancierte mikroelektromechanische vorrichtungen

Country Status (8)

Country Link
US (1) US6571630B1 (de)
EP (1) EP1173773B1 (de)
JP (1) JP5123447B2 (de)
AT (1) ATE466288T1 (de)
DE (1) DE60044293D1 (de)
HK (1) HK1045372B (de)
TW (1) TW425479B (de)
WO (1) WO2000057194A1 (de)

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ATE328702T1 (de) * 2002-09-24 2006-06-15 Hasselblad As Vorrichtung zur zweidimensionalen verschiebung
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US7290435B2 (en) * 2006-02-06 2007-11-06 Invensense Inc. Method and apparatus for electronic cancellation of quadrature error
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EP2098822B8 (de) * 2008-03-05 2015-08-12 Colibrys S.A. Schwingungsgyroskop mit reduzierten Quadratursignalen
US8187902B2 (en) 2008-07-09 2012-05-29 The Charles Stark Draper Laboratory, Inc. High performance sensors and methods for forming the same
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JP2012528335A (ja) * 2009-05-27 2012-11-12 キング アブドゥーラ ユニバーシティ オブ サイエンス アンド テクノロジー 面外サスペンション方式を使用するｍｅｍｓ質量−バネ−ダンパシステム
US8534127B2 (en) 2009-09-11 2013-09-17 Invensense, Inc. Extension-mode angular velocity sensor
US9097524B2 (en) 2009-09-11 2015-08-04 Invensense, Inc. MEMS device with improved spring system
JP6010968B2 (ja) * 2012-03-29 2016-10-19 セイコーエプソン株式会社 振動デバイス及び振動デバイスの製造方法
JP5963567B2 (ja) * 2012-06-26 2016-08-03 日立オートモティブシステムズ株式会社 慣性センサ
US9316665B2 (en) * 2013-04-22 2016-04-19 Freescale Semicondcutor, Inc. Estimation of sidewall skew angles of a structure
CN103697909B (zh) * 2013-12-13 2016-06-01 上海交通大学 导轨滑块型圆盘式微机械固体波动陀螺封装装置及方法
SE537998C2 (sv) 2014-05-09 2016-02-02 Per-Axel Uhlin Vibrationssensor av magnetisk typ
US10514259B2 (en) 2016-08-31 2019-12-24 Analog Devices, Inc. Quad proof mass MEMS gyroscope with outer couplers and related methods
JP6819216B2 (ja) 2016-10-26 2021-01-27 セイコーエプソン株式会社 ジャイロセンサー、ジャイロセンサーの製造方法、電子機器および移動体
US10627235B2 (en) 2016-12-19 2020-04-21 Analog Devices, Inc. Flexural couplers for microelectromechanical systems (MEMS) devices
US10697774B2 (en) 2016-12-19 2020-06-30 Analog Devices, Inc. Balanced runners synchronizing motion of masses in micromachined devices
US10415968B2 (en) 2016-12-19 2019-09-17 Analog Devices, Inc. Synchronized mass gyroscope
JP2018185188A (ja) 2017-04-25 2018-11-22 セイコーエプソン株式会社 物理量センサー、物理量センサーの製造方法、物理量センサーデバイス、電子機器および移動体
JP6984342B2 (ja) * 2017-11-22 2021-12-17 セイコーエプソン株式会社 物理量センサー、物理量センサーの製造方法、慣性計測ユニット、携帯型電子機器、電子機器、および移動体
JP2019132690A (ja) 2018-01-31 2019-08-08 セイコーエプソン株式会社 物理量センサー、物理量センサーデバイス、複合センサーデバイス、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器、移動体および物理量センサーの出力信号調整方法
US10948294B2 (en) 2018-04-05 2021-03-16 Analog Devices, Inc. MEMS gyroscopes with in-line springs and related systems and methods
JP7192437B2 (ja) 2018-11-28 2022-12-20 セイコーエプソン株式会社 慣性センサー、電子機器および移動体
JP7225817B2 (ja) 2019-01-17 2023-02-21 セイコーエプソン株式会社 角速度センサー、慣性計測装置、電子機器および移動体
JP7188311B2 (ja) 2019-07-31 2022-12-13 セイコーエプソン株式会社 ジャイロセンサー、電子機器、及び移動体
US11193771B1 (en) 2020-06-05 2021-12-07 Analog Devices, Inc. 3-axis gyroscope with rotational vibration rejection
EP4162282A1 (de) 2020-06-08 2023-04-12 Analog Devices, Inc. Antriebs- und erfassungsspannungsentlastungsvorrichtung
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Also Published As

Publication number Publication date
DE60044293D1 (de) 2010-06-10
EP1173773B1 (de) 2010-04-28
HK1045372B (zh) 2010-11-05
JP5123447B2 (ja) 2013-01-23
EP1173773A1 (de) 2002-01-23
WO2000057194A1 (en) 2000-09-28
US6571630B1 (en) 2003-06-03
TW425479B (en) 2001-03-11
EP1173773A4 (de) 2006-05-17
HK1045372A1 (en) 2002-11-22
JP2002540406A (ja) 2002-11-26

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