GB964349A - Improvements in printed circuit and method of making the same - Google Patents

Improvements in printed circuit and method of making the same

Info

Publication number
GB964349A
GB964349A GB3136561A GB3136561A GB964349A GB 964349 A GB964349 A GB 964349A GB 3136561 A GB3136561 A GB 3136561A GB 3136561 A GB3136561 A GB 3136561A GB 964349 A GB964349 A GB 964349A
Authority
GB
United Kingdom
Prior art keywords
base
conductors
die
metal foil
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3136561A
Inventor
Norman Lawrence Greenman
Paul Lott Anderson
John Andrew Zagusta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Corp
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Priority to GB3136561A priority Critical patent/GB964349A/en
Publication of GB964349A publication Critical patent/GB964349A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

964,349. Printed circuits. ROGERS CORPORATION. Aug. 31, 1961, No. 31365/61. Heading H1R. A method of producing a printed circuit assembly is characterized by the steps of die-citting an electrically conductive pattern, adhesively securing the pattern to a surface of a mouldable fibrous base sheet embodying a curable resin, and subjecting the assembly to a moulding operation at temperatures and pressures which cause the base sheet to assume a predetermined shape and the curable resin impregnate to flow to cause a moulded skin to be formed upon and to cover all the surfaces of the base sheet. As shown in Fig. 2, a pattern blanking and embedding die 10 is used to secure the conductors to the base. A mouldable fibrous base member 14 impregnated with a curable thermosetting resin is fed under the die unit 10, and an elongated strip of metal foil 20, having its underside provided with a coating of thermosetting adhesive, is fed at right angles to the base member between male and female blanking dies 22, 24 respectively, the cutting portions of the male die 22 extending within corresponding openings in a stripping plate 30. When the movable member 12 of the punch press is lowered an indexing punch 40 first pierces the base 14 and then the heated male blanking die 22 cuts and blanks the metal foil pattern through the female die, the metal foil being embedded in the surface of the base and adhered thereto. The base member 14 is then moved along to position 44 where required holes are pierced through the base and conductors. After cutting the base material to the desired shape the individual circuit assemblies 61 are placed in a flash mould 53, Fig. 3, which is provided with pins 60 corresponding to the holes in the base member and which are preferably of smaller diameter. The assembly is then subjected to heat and pressure to effect curing of the mouldable fibrous material and to result in the formation of a resin skin 72, Fig. 6, covering the exterior surface of the base and the walls of the holes so as to render the base waterproof. During the moulding process the adhesive on the metal foil is cured and effects secure bonding of the conductors 62 to the base. Electrical conductors may be provided on both sides of the base, Fig. 8 (not shown), and a sandwich type unit, Fig. 9 (not shown), having intermediate conductors as well as conductors on the outer surfaces may be produced by placing several different sheets in superimposed relation in the mould and subjecting the assembly to heat and pressure to form a unitary member.
GB3136561A 1961-08-31 1961-08-31 Improvements in printed circuit and method of making the same Expired GB964349A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3136561A GB964349A (en) 1961-08-31 1961-08-31 Improvements in printed circuit and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3136561A GB964349A (en) 1961-08-31 1961-08-31 Improvements in printed circuit and method of making the same

Publications (1)

Publication Number Publication Date
GB964349A true GB964349A (en) 1964-07-22

Family

ID=10322018

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3136561A Expired GB964349A (en) 1961-08-31 1961-08-31 Improvements in printed circuit and method of making the same

Country Status (1)

Country Link
GB (1) GB964349A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2531597A1 (en) * 1982-08-09 1984-02-10 Dav Ind Printed circuit for heavy currents.
EP0103627A1 (en) * 1982-03-04 1984-03-28 Ecolab Inc. A method and apparatus for manufacturing multi-layer circuit boards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0103627A1 (en) * 1982-03-04 1984-03-28 Ecolab Inc. A method and apparatus for manufacturing multi-layer circuit boards
EP0103627A4 (en) * 1982-03-04 1985-09-18 Economics Lab A method and apparatus for manufacturing multi-layer circuit boards.
FR2531597A1 (en) * 1982-08-09 1984-02-10 Dav Ind Printed circuit for heavy currents.

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