FR2531597A1 - Printed circuit for heavy currents. - Google Patents

Printed circuit for heavy currents. Download PDF

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Publication number
FR2531597A1
FR2531597A1 FR8213845A FR8213845A FR2531597A1 FR 2531597 A1 FR2531597 A1 FR 2531597A1 FR 8213845 A FR8213845 A FR 8213845A FR 8213845 A FR8213845 A FR 8213845A FR 2531597 A1 FR2531597 A1 FR 2531597A1
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France
Prior art keywords
circuit according
passages
insulator
plate
insulation
Prior art date
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Granted
Application number
FR8213845A
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French (fr)
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FR2531597B1 (en
Inventor
Jean Vuarchex
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Dav Ind
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Dav Ind
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Filing date
Publication date
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Priority to FR8213845A priority Critical patent/FR2531597B1/en
Publication of FR2531597A1 publication Critical patent/FR2531597A1/en
Application granted granted Critical
Publication of FR2531597B1 publication Critical patent/FR2531597B1/en
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

It comprises a metal plate 1, one face of which is covered over by an insulation 5, the other face being uncovered, and in which are cut out electrical circuits separated by passages 3 and linked together by linking bridges 4, the said insulation being interrupted above orifices 6 let into the plate for the positioning of connecting pins, characterised in that the insulation 5 is also introduced into the said passages 3 in such a way as to reinforce the strength of the said plate, the said insulation being capable of being removed at least partially from the said passages. Application especially in interconnection housings used in motor vehicles.

Description

Circuit imprimé pour courants élevés.Printed circuit for high currents.

La présente invention concerne un circuit imprimé pour courants élevés et, plus particulièrement, un circuit imprimé réalisé dans une plaque métallique. The present invention relates to a printed circuit for high currents and, more particularly, a printed circuit produced in a metal plate.

Les circuits imprimés pour la réalisation de platines de servitude pour véhicule automobile ne dépassent guère 0,1 mm dgépaissour et sont limités dans leur utilisation par les chutes de tension et par le manque de tenue au court-circuits. Printed circuits for the production of service plates for motor vehicles hardly exceed 0.1 mm thick and are limited in their use by voltage drops and by the lack of withstand at short circuits.

Lorsqu'on souhaite le passage de courants élevés il faut soit augmenter la largeur des circuits électriques ce qui conduirait alors à utiliser des plaques de très grandes dimensions incompatibles avec la tendance à la miniaturisation des circuits et à la place disponible sur les véhicules, soit augmenter l'épaisseur de la plaque pour éviter les dimensions prohibitives
Pour remédier aux inconvénients dus à des dimensions et/ou à une épaisseur de plaque trop importante, on a pro posé de réaliser le circuit imprimé sous la forme d'un empi- lage de plaques de circuits séparées les unes des autres par une feuille isolante accolée de préférence sur une plaque.Les circuits sont découpés dans des plaques métalliques et sont reliés entre eux par des pontets qui peuvent être éliminés par emboutissage, par exemple, de manière à former des circuits électriques séparés. Cela revient en fait à dissocier les fonctions qui doivent être assurées par l'ensemble desdits circuits. De toutes les façons, l'empila- ge doit être maintenu serré dans un boîtier et les #différen- tes plaques reliées entre elles par des broches insérées à force dans des orifices ménagés a cet effet dans lesdites plaques. Un tel empilage est notamment décrit et représenté dans le brevet français No. 2.362.504.When one wishes the passage of high currents it is necessary either to increase the width of the electrical circuits which would then lead to the use of very large plates incompatible with the tendency to miniaturization of the circuits and to the space available on vehicles, or to increase the thickness of the plate to avoid prohibitive dimensions
To overcome the drawbacks due to excessive dimensions and / or plate thickness, it has been proposed to produce the printed circuit in the form of a stack of circuit plates separated from each other by an insulating sheet. preferably attached to a plate. The circuits are cut from metal plates and are interconnected by bridges which can be removed by stamping, for example, so as to form separate electrical circuits. This effectively amounts to dissociating the functions which must be provided by all of said circuits. In any case, the stack must be kept tight in a case and the various plates connected to one another by pins inserted by force into holes provided for this purpose in said plates. Such stacking is notably described and represented in French patent No. 2,362,504.

La présente invention a pour objet un circuit imprimé qui permet le passage- de courants élevés sans être limité par la diffusion thermique due au passage du courant comme cela se produit pour les circuits empilés connus. The present invention relates to a printed circuit which allows the passage of high currents without being limited by the thermal diffusion due to the passage of current as occurs with known stacked circuits.

Le circuit imprimé suivant l'invention est du type comprenant une plaque métallique dont une face est recou verte par un isolant, l'autre face étant découverte, et dans laquelle sont découpés des circuits électriques sépares par des passages et reliés entre eux par des pontets de liaison, ledit isolant étant interrompu au-dessus d' orifices menaces dans la plaque pour le positionnement des broches de connexion, et il est caractérisé en ce que 11 isolant est introduit également dans lesdits passages de manière à renforcer la tenue de ladite plaque, ledit isolant étant susceptible d'etre enlevé au moins partiellement desdits passages. The printed circuit according to the invention is of the type comprising a metal plate one side of which is covered with an insulator, the other side being uncovered, and in which are cut electrical circuits separated by passages and connected together by bridges of connection, said insulator being interrupted above threatened openings in the plate for positioning the connection pins, and it is characterized in that 11 insulator is also introduced into said passages so as to reinforce the holding of said plate, said insulator being capable of being at least partially removed from said passages.

Selon une autre caractéristique, les évidements dans l'isolant sur la face recouverte sont plus grands que les orifices de positionnement des broches de connexion de manière à permettre une fixation desdites brochés sur ladite plaque par soudage à la vague. According to another characteristic, the recesses in the insulation on the covered face are larger than the positioning orifices of the connection pins so as to allow fixing of said blanks on said plate by wave welding.

Cette- -caractéristique trouve tout son intérêt dans la fabrication en série des plaques de circuits et des boîtes de connexion dans lesquelles elles sont montées. This feature is of great interest in the mass production of circuit boards and connection boxes in which they are mounted.

En effet, dans les empilages de plaques connus, l'empilage est d'abord introduit dans la boîte de connexion avant de positionner a force les broches de connexion qui doivent être de longueur supérieure à la hauteur de l'empilage et comporter des moyens de retenue qui les empêchent de s'extraire des orifices de liaison. Grâce à la présente invention, les broches de connexion peuvent être fixées sur le boîtier préalablement à la mise en place des plaques.In fact, in the stacks of known plates, the stack is first introduced into the connection box before forcibly positioning the connection pins which must be of length greater than the height of the stack and include means for retainers which prevent them from being extracted from the connection orifices. Thanks to the present invention, the connection pins can be fixed to the housing before the plates are put in place.

D'autres avantages et caractéristiques ressortiront mieux à la lecture de la description donnée ci-dessus à titre indicatif mais non limitatif d'un mode de réalisation préféré de l'invention, ainsi que du dessin annexé sur lequel
la figure 1 est une vue de dessus d'une face du circuit imprimé selon l'invention ;
la figure 2 est une vue de dessus de l'autre face du circuit imprimé représenté sur la figure 1
la figure 3 est une vue en coupe à échelle agrandie, d'un évidement ménagé dans l'isolant et correspondant à un orifice pour le passage d'une broche de connexion
la figure 4 est une vue en coupe a échelle agrandie d'un passage ménagé entre les deux circuits électriques et rempli d'isolant.Other advantages and characteristics will emerge more clearly on reading the description given above by way of indication but not limiting of a preferred embodiment of the invention, as well as of the appended drawing in which
Figure 1 is a top view of a face of the printed circuit according to the invention;
Figure 2 is a top view of the other side of the printed circuit shown in Figure 1
Figure 3 is a sectional view on an enlarged scale, of a recess in the insulation and corresponding to an orifice for the passage of a connection pin
Figure 4 is a sectional view on an enlarged scale of a passage formed between the two electrical circuits and filled with insulation.

Le circuit imprimé selon l'invention et représenté sur les figures 1 et 2, comprend une plaque métallique 1 d'épaisseur e appropriée,- dans laquelle sont découpés des circuits 2 délimitant entre eux des passages 3. Le découpage des circuits ou pistes métalliques peut être chimique ou plus économiquement mécanique avec récupération des déchets. Les circuits 2 sont reliés entre eux par des pontets de liaison 4. Une face de la plaque I est recouverte d'une couche d'isolant 5 (figure 2) sauf à certains endroits 6 et notamment autour d'orifices 7 ménagés dans la plaque et pre- vus pour le positionnement de broches de connexion nàn représentées. The printed circuit according to the invention and represented in FIGS. 1 and 2, comprises a metal plate 1 of appropriate thickness e, - in which are cut circuits 2 delimiting between them passages 3. The cutting of metal circuits or tracks can be chemical or more economically mechanical with waste recovery. The circuits 2 are interconnected by connecting bridges 4. One face of the plate I is covered with an insulating layer 5 (Figure 2) except in certain places 6 and in particular around orifices 7 formed in the plate and intended for the positioning of connection pins nàn shown.

Une ou plusieurs bandes 8 transversales par rapport à l'axe longitudinal de la plaque 1 sont également maintenues nues, sur les deux faces de la plaque 1, sans isolant, pour permettre le pliage de ladite plaque le long de cette ou ces bandes. A cet effet, les zones nues 8 présentent des découpes 13 et des trous 14 pour faciliter le pliage le long des trous 14. One or more bands 8 transverse to the longitudinal axis of the plate 1 are also kept bare, on both sides of the plate 1, without insulation, to allow folding of said plate along this or these bands. To this end, the bare zones 8 have cutouts 13 and holes 14 to facilitate folding along the holes 14.

Autour des orifices 7, l'isolant présente un chanfrein 9 qui permet un meilleur écoulement de la matière à souder dans l'évidement 10 créé par l'isolant autour desdits orifices 7 et surtout gui permet un soudage à la vague rea- lisé en déplaçant la face recouverte de la plaque sur un bain de soudure. La soudure, pendant le déplacement, glisse sur l'isolant et remplit les évidements 10 jusqu'à sensiblement le chanfrein, réalisant ainsi une liaison entre la plaque métallique 1 et l'extrémité. des broches de connexion traversant les orifices 7 et débouchant dans les évidements 10. Around the orifices 7, the insulation has a chamfer 9 which allows a better flow of the material to be welded in the recess 10 created by the insulation around said orifices 7 and above all which allows a wave welding carried out by moving the coated side of the plate on a solder bath. The weld, during displacement, slides on the insulation and fills the recesses 10 until substantially the chamfer, thus realizing a connection between the metal plate 1 and the end. connection pins passing through the openings 7 and opening into the recesses 10.

Sur l'autre face de la plaque non recouverte d'isolant, les passages 3 ménagés entre les circuits 2 sont remplis d'isolant 5. De préférence, l'isolant 5 des passages forme une surépaisseur 11 et recouvre, de part et d'autre de chaque passage, une petite partie des circuits adjacents pour former ainsi deux bourrelets 12 (figures 2 et t). Une fois que la plaque 1 est assemblée à l'isolant, les pontets de liaison mécaniques 4 peuvent être alors éliminés par découpage de manière à réaliser la séparation appropriée des circuits électriques. On the other side of the plate not covered with insulation, the passages 3 formed between the circuits 2 are filled with insulation 5. Preferably, the insulation 5 of the passages forms an additional thickness 11 and covers, on both sides other of each passage, a small part of the adjacent circuits to thereby form two beads 12 (Figures 2 and t). Once the plate 1 is assembled with the insulation, the mechanical connecting bridges 4 can then be removed by cutting so as to achieve the appropriate separation of the electrical circuits.

Le recouvrement d'une face de la plaque 1 et le remplissage des passages 3 par de l'isolant peuvent être effectués en surmoulant ladite plaque en prenant bien soin d'éviter un cintrage de ladite plaque. La matière isolante est une matière plastique moulable thermodurcissable et de préférence, un composé polyester chargé de fibres de verre. The covering of one face of the plate 1 and the filling of the passages 3 with insulation can be carried out by overmolding said plate, taking great care to avoid bending of said plate. The insulating material is a thermosetting moldable plastic and preferably a polyester compound loaded with glass fibers.

Un autre procédé consiste à utiliser une feuille isolante prédécoupée fortement chargée de façon que lors du collage et du pressage de la feuille sur la plaque métallique il se produise un fluage de la résine qui remplirait alors partiellement les passages entre les circuits électriques sans formation de bourrelets sur l'autre face. La feuille support peur être par exemple un tissu de fibres de verre ou papier bakélisé. Another method consists in using a highly charged precut insulating sheet so that during the gluing and pressing of the sheet on the metal plate there occurs a creep of the resin which would then partially fill the passages between the electrical circuits without the formation of beads on the other side. The support sheet can for example be a glass fiber fabric or bakelized paper.

Enfin, une autre application du circuit imprimé selon l'invention pourrait être-envisagée. Elle consiste à utiliser l'ensemble décrit ci-dessus non pas dans une boite d'interconnexion comme cela est envisagé, mais comme support de composants électroniques, en montant par exemple des résistances et/ou des capacités et selfs sur la face isolée, ces composants étant fixés par des conducteurs de liaison dans les orifices prévus pour la fixation des broches de connexion. Finally, another application of the printed circuit according to the invention could be envisaged. It consists in using the assembly described above not in an interconnection box as envisaged, but as a support for electronic components, by mounting for example resistors and / or capacitors and inductors on the isolated face, these components being fixed by connecting conductors in the holes provided for fixing the connection pins.

Bien entendu, l'invention ntest nullement limitée au mode de réalisation de l'exemple décrit et représenté, elle est susceptible de nombreuses variantes accessibles à l'homme de l'art, suivant les applications envisagées et sans s'écarter pour cela du cadre de l'invention.  Of course, the invention is in no way limited to the embodiment of the example described and shown, it is capable of numerous variants accessible to those skilled in the art, depending on the applications envisaged and without departing from the scope of the invention.

Claims (12)

REVENDICATIONS 1. Circuit imprimé pour courant élevés, du type comprenant une plaque métallique (l) dont une face est recouser- te par un isolant (5), l'autre face étant découverte, et dans laquelle sont découpés des circuits électriques (2) sépa- rés par des passages (3) et reliés entre eux par des pontets de liaison (4) gledit isolant étant interrompu au-dessus orifices (6) ménagés dans la plaque pour le positionnement de broches de connexion, caradtérisé en ce que isolant (5) est introduit également dans lesdits passages (3) de manière à renforoer la tenue de ladite plaque, ledit isolant étant susceptible entre enlevé au moins partiellement desdits passages. 1. Printed circuit for high current, of the type comprising a metal plate (l) one side of which is sewn by an insulator (5), the other side being uncovered, and in which electrical circuits (2) are cut apart. - res through passages (3) and interconnected by connecting bridges (4) gledit insulator being interrupted above orifices (6) formed in the plate for the positioning of connection pins, caradérisé in that insulator (5 ) is also introduced into said passages (3) so as to strengthen the holding of said plate, said insulator being capable of being at least partially removed from said passages. 2 Circuit selon la revendication 1, caractérisé en ce que sur la face découverte l'isolant, introduit dans les passages, forme au moins une surépaisseur (11) recouvrant une partie des circuits adjacents auxdits passages. 2 Circuit according to claim 1, characterized in that on the exposed side the insulator, introduced into the passages, forms at least one extra thickness (11) covering part of the circuits adjacent to said passages. 3. Circuit selon la revendication 2, caractérisé en ce que sur la face découverte de axa laque et de part et d'autre de chaque passage l'isolant recouvre une partie des circuits adjacents auxdits passages. 3. Circuit according to claim 2, characterized in that on the exposed face of axa lacquer and on either side of each passage the insulator covers part of the circuits adjacent to said passages. 4. Circuit selon la revendication 1, caractérisé en ce que les evidements (10) isolant sur la face recouverte sont de dimensions supérieures à celles des orifices (6) de positionnement des broches de connexion de manière à permettre une fixation des broches de connexion sur ladite plaque par soudage à la vague. 4. The circuit as claimed in claim 1, characterized in that the insulating recesses (10) on the covered face are of dimensions greater than those of the orifices (6) for positioning the connection pins so as to allow the connection pins to be fixed to said plate by wave welding. 5. Circuit selon la revendication 1, caractérisé en ce que sur chaque face de ladite plaque est ménagée au moins une zone nue, continue et dépourvue totalement d'isolant de manière à permettre le pliage du circuit imprimé le long de ladite zone nue. 5. Circuit according to claim 1, characterized in that on each side of said plate is provided at least one bare area, continuous and totally devoid of insulation so as to allow the folding of the printed circuit along said bare area. 6. Circuit selon l'une des revendications 1 à 5, caractérisé en ce que l'isolant est une matière plastique moulable thermodurcissable. 6. Circuit according to one of claims 1 to 5, characterized in that the insulator is a thermosetting moldable plastic. 7. Circuit selon la revendication 6, caractérisé en ce que la matière plastique thermodurcissable est un composé polyester chargé de fibres de verre.  7. Circuit according to claim 6, characterized in that the thermosetting plastic material is a polyester compound loaded with glass fibers. 8 . Circuit selon la revendication 4, caractérisé en ce que les évidements dans l'isolant sont munis de chanfreins. 8. Circuit according to claim 4, characterized in that the recesses in the insulation are provided with chamfers. 9. Circuit selon l'une des revendications g à 8, caractérise an ce qu'il est utilisé comme support de composants électroniques  9. Circuit according to one of claims g to 8, characterized in that it is used as a support for electronic components 10 . Circuit selon l'une des revendications 1 à 5, caractérisé en ce que l'isolant est une feuille support prédécoupée et fortement chargée d'une résine de façon que lors du collage et pressage se produise un fluage de ladite résina de manière à remplir les passages entre les circuits électriques  10. Circuit according to one of claims 1 to 5, characterized in that the insulation is a precut support sheet heavily loaded with a resin so that during bonding and pressing occurs a creep of said resin so as to fill the passages between electrical circuits 11 . Circuit selon la revendication 10, caractérisé en ce que la feuille support est un tissu de fibres de verre. 11. Circuit according to claim 10, characterized in that the support sheet is a glass fiber fabric. 12 2 Circuit selon la revendication 10, caractérisé an ce que la feuille support est an papier bakelisé.  12 2 Circuit according to claim 10, characterized in that the support sheet is bakelized paper.
FR8213845A 1982-08-09 1982-08-09 PRINTED CIRCUIT FOR HIGH CURRENTS Expired FR2531597B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8213845A FR2531597B1 (en) 1982-08-09 1982-08-09 PRINTED CIRCUIT FOR HIGH CURRENTS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8213845A FR2531597B1 (en) 1982-08-09 1982-08-09 PRINTED CIRCUIT FOR HIGH CURRENTS

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FR2531597A1 true FR2531597A1 (en) 1984-02-10
FR2531597B1 FR2531597B1 (en) 1985-07-05

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2621774A1 (en) * 1987-10-12 1989-04-14 Dav CIRCUIT BOARD FOR HIGH CURRENTS AND METHOD OF PREPARATION
EP0891124A2 (en) * 1997-07-10 1999-01-13 Molex Incorporated Three-dimensional electrical interconnection system
EP1039581A3 (en) * 1999-02-24 2001-07-11 Sumitomo Wiring Systems, Ltd. Circuit board assembly

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3072734A (en) * 1958-08-26 1963-01-08 Eastman Kodak Co Circuit board for mounting and inter-connecting electrical components
GB926963A (en) * 1959-08-25 1963-05-22 Vactoric Control Equip Process for making a printed circuit
GB964349A (en) * 1961-08-31 1964-07-22 Rogers Corp Improvements in printed circuit and method of making the same
FR2272573A1 (en) * 1974-05-24 1975-12-19 Ebauches Sa
FR2344151A1 (en) * 1976-03-08 1977-10-07 Amp Inc ELECTRICAL CONNECTOR AND ITS PRODUCTION PROCESS
US4149219A (en) * 1978-02-22 1979-04-10 The United States Of America As Represented By The Secretary Of The Navy Flexible printed circuit board assembly

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3072734A (en) * 1958-08-26 1963-01-08 Eastman Kodak Co Circuit board for mounting and inter-connecting electrical components
GB926963A (en) * 1959-08-25 1963-05-22 Vactoric Control Equip Process for making a printed circuit
GB964349A (en) * 1961-08-31 1964-07-22 Rogers Corp Improvements in printed circuit and method of making the same
FR2272573A1 (en) * 1974-05-24 1975-12-19 Ebauches Sa
FR2344151A1 (en) * 1976-03-08 1977-10-07 Amp Inc ELECTRICAL CONNECTOR AND ITS PRODUCTION PROCESS
US4149219A (en) * 1978-02-22 1979-04-10 The United States Of America As Represented By The Secretary Of The Navy Flexible printed circuit board assembly

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2621774A1 (en) * 1987-10-12 1989-04-14 Dav CIRCUIT BOARD FOR HIGH CURRENTS AND METHOD OF PREPARATION
EP0312415A1 (en) * 1987-10-12 1989-04-19 DAV, Société dite Circuit board for high currents and process of making the same
EP0891124A2 (en) * 1997-07-10 1999-01-13 Molex Incorporated Three-dimensional electrical interconnection system
EP0891124A3 (en) * 1997-07-10 2000-03-01 Molex Incorporated Three-dimensional electrical interconnection system
EP1039581A3 (en) * 1999-02-24 2001-07-11 Sumitomo Wiring Systems, Ltd. Circuit board assembly
US6348662B1 (en) 1999-02-24 2002-02-19 Sumitomo Wiring Systems, Ltd. Circuit board assembly

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