GB9220923D0 - Electroless plating bath solutions - Google Patents

Electroless plating bath solutions

Info

Publication number
GB9220923D0
GB9220923D0 GB929220923A GB9220923A GB9220923D0 GB 9220923 D0 GB9220923 D0 GB 9220923D0 GB 929220923 A GB929220923 A GB 929220923A GB 9220923 A GB9220923 A GB 9220923A GB 9220923 D0 GB9220923 D0 GB 9220923D0
Authority
GB
United Kingdom
Prior art keywords
electroless plating
plating bath
bath solutions
solutions
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB929220923A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMP Akzo Corp
Original Assignee
AMP Akzo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Akzo Corp filed Critical AMP Akzo Corp
Publication of GB9220923D0 publication Critical patent/GB9220923D0/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB929220923A 1988-04-29 1992-10-05 Electroless plating bath solutions Pending GB9220923D0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18782288A 1988-04-29 1988-04-29

Publications (1)

Publication Number Publication Date
GB9220923D0 true GB9220923D0 (en) 1992-11-18

Family

ID=22690615

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8909623A Expired - Lifetime GB2218714B (en) 1988-04-29 1989-04-27 Method of formulating and operating an electroless plating bath solution for forming cu-deposits which are essentially free of fissures
GB929220923A Pending GB9220923D0 (en) 1988-04-29 1992-10-05 Electroless plating bath solutions

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB8909623A Expired - Lifetime GB2218714B (en) 1988-04-29 1989-04-27 Method of formulating and operating an electroless plating bath solution for forming cu-deposits which are essentially free of fissures

Country Status (8)

Country Link
EP (1) EP0340649B1 (en)
JP (1) JPH07107193B2 (en)
KR (1) KR890016207A (en)
AU (1) AU3304389A (en)
BR (1) BR8901962A (en)
CA (1) CA1331420C (en)
DE (1) DE3914180A1 (en)
GB (2) GB2218714B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526458B2 (en) * 2006-12-06 2014-06-18 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
WO2012022660A1 (en) 2010-08-17 2012-02-23 Chemetall Gmbh Process for the electroless copper plating of metallic substrates

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1522048A (en) * 1966-05-06 1968-04-19 Photocircuits Corp Non-galvanic deposit of metals
FR1551275A (en) * 1966-12-19 1968-12-27
ZA775495B (en) * 1976-11-22 1978-07-26 Kollmorgen Tech Corp Method and apparatus for control of electroless plating solutions
CA1135903A (en) * 1978-09-13 1982-11-23 John F. Mccormack Electroless copper deposition process having faster plating rates
US4301196A (en) 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
JPS5627594A (en) * 1979-08-10 1981-03-17 Matsushita Electric Ind Co Ltd Remote controller
JPS6016517B2 (en) * 1979-12-29 1985-04-25 上村工業株式会社 Electroless plating control method
JPS5927379A (en) * 1982-08-09 1984-02-13 Hitachi Ltd Pattern video signal processing system
JPH0247550B2 (en) * 1982-08-23 1990-10-22 Chusho Kigyo Jigyodan MUDENKAIDOMETSUKIEKINOKANRIHOHO
JPH0239596B2 (en) * 1983-03-25 1990-09-06 Uemura Kogyo Kk KAGAKUDOMETSUKINOKONTOROORUHOHO
KR920002710B1 (en) * 1984-06-18 1992-03-31 가부시기가이샤 히다찌세이사꾸쇼 Chemical copper plating method
US4692346A (en) * 1986-04-21 1987-09-08 International Business Machines Corporation Method and apparatus for controlling the surface chemistry on objects plated in an electroless plating bath
ES2039403T3 (en) * 1986-10-31 1993-10-01 Amp-Akzo Corporation (A Delaware Corp.) METHOD FOR DEPOSITING WITHOUT ELECTRICITY HIGH QUALITY COPPER.
US4814197A (en) * 1986-10-31 1989-03-21 Kollmorgen Corporation Control of electroless plating baths

Also Published As

Publication number Publication date
EP0340649A1 (en) 1989-11-08
GB8909623D0 (en) 1989-06-14
KR890016207A (en) 1989-11-28
BR8901962A (en) 1989-12-05
GB2218714B (en) 1992-10-14
AU3304389A (en) 1989-11-02
JPH07107193B2 (en) 1995-11-15
CA1331420C (en) 1994-08-16
EP0340649B1 (en) 1993-02-03
DE3914180C2 (en) 1991-04-18
JPH0270070A (en) 1990-03-08
GB2218714A (en) 1989-11-22
DE3914180A1 (en) 1989-11-09

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