GB1058444A - Method of plating metal surfaces with gold - Google Patents
Method of plating metal surfaces with goldInfo
- Publication number
- GB1058444A GB1058444A GB4000562A GB4000562A GB1058444A GB 1058444 A GB1058444 A GB 1058444A GB 4000562 A GB4000562 A GB 4000562A GB 4000562 A GB4000562 A GB 4000562A GB 1058444 A GB1058444 A GB 1058444A
- Authority
- GB
- United Kingdom
- Prior art keywords
- gold
- copper
- resist
- nickel
- strips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
Landscapes
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Abstract
A metal substrate is plated with gold without application of an external voltage by contacting it with a counter-electrode of Co, Ni or Pb while immersed in a solution of a gold salt, the counter electrode metal being more electropositive than both the salt solution and the metal substrate the process being referred to as "galvanic plating". Typically the substrate metal is copper and the counter electrode is of cobalt or nickel and comprises small separate areas of metal fixed in or on the substrate. As described a printed circuit board comprising copper conductor strips on an insulating panel is covered with a photo-resist which is exposed except at the sites for the counter electrodes and wash-off developed to uncover the copper in these areas. The board is then given an acid PdCl2 solution treatment followed by successive electroless platings with Ni and Co, the latter serving as the counter electrode for "galvanic" deposition of gold on the copper strips after removal of the photo-resist with a solvent such as acetone or trichlorethylene. In modifications the copper strips may be plated all over with nickel by electrolytic or electroless deposition prior to the formation of the counter electrodes or the copper strips may be coated with lacquer, holes drilled through the strips and board, and the board immersed successively in the palladium chloride and nickel and/or cobalt solutions to form the counter electrodes on the inside of the holes. Alternatively a resistive panel clad with a copper foil may be treated to form counter electrodes by the photo-resist masking and plating technique the resist is stripped off and an etching resist applied defining the conductors and then copper is etched away to form the conductors which after removal of the resist are then "galvanically" plated with gold. The electroless nickel bath used at 94 DEG C. comprises per litre .Sodium pyrophosphate.50g .Nickel sulphate.25g .Sodium hypophosphite.25g .Ammonium hydroxide to.pH 10-11 The electroless cobalt bath used at 95 DEG C. comprises per litre .Sodium hypophosphite.30g .Sodium citrate.20g .Cobalt chloride.35g .Ammonium chloride.50g The "galvanic plating" gold bath used at 92-95 DEG C. comprises per litre .Ammonium chloride.75g .Sodium nitrate.50g .Sodium hypophosphite.10g .Potassium gold cyanide.2g .Ammonium hydroxide to.pH 7.0-7.5
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB4000562A GB1058444A (en) | 1962-10-23 | 1962-10-23 | Method of plating metal surfaces with gold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB4000562A GB1058444A (en) | 1962-10-23 | 1962-10-23 | Method of plating metal surfaces with gold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1058444A true GB1058444A (en) | 1967-02-08 |
Family
ID=10412679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4000562A Expired GB1058444A (en) | 1962-10-23 | 1962-10-23 | Method of plating metal surfaces with gold |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1058444A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107557770A (en) * | 2017-08-14 | 2018-01-09 | 浙江工业大学 | A kind of Pd/ foams copper electrode and preparation method and application |
| CN107557771A (en) * | 2017-08-14 | 2018-01-09 | 浙江工业大学 | A kind of Pd/ foams silver electrode and preparation method and application |
-
1962
- 1962-10-23 GB GB4000562A patent/GB1058444A/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107557770A (en) * | 2017-08-14 | 2018-01-09 | 浙江工业大学 | A kind of Pd/ foams copper electrode and preparation method and application |
| CN107557771A (en) * | 2017-08-14 | 2018-01-09 | 浙江工业大学 | A kind of Pd/ foams silver electrode and preparation method and application |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2699424A (en) | Electroplating process for producing printed circuits | |
| JPH0383395A (en) | Printed circuit board and its manufacture | |
| DE3110415C2 (en) | Process for the manufacture of printed circuit boards | |
| WO1989007162A1 (en) | Electrochemical processes | |
| GB1101299A (en) | Method of manufacturing an electric circuit unit | |
| GB1568941A (en) | Method of providing printed circuits | |
| DE3008434C2 (en) | ||
| US3984290A (en) | Method of forming intralayer junctions in a multilayer structure | |
| KR830002066A (en) | How to remove copper ions from baths containing copper ions | |
| JPS58500765A (en) | A method for chemically stripping a plating layer containing palladium and at least one of copper and nickel, and a bath used in the method | |
| GB956922A (en) | Chemical gold plating | |
| GB1058444A (en) | Method of plating metal surfaces with gold | |
| GB1208337A (en) | Method to produce printed circuits | |
| EP0248683A3 (en) | Composition and process for the electrolytic coating of circuit boards without an electroless metal coating | |
| GB918220A (en) | Method of chemically plating a dielectric article | |
| AT392087B (en) | METHOD FOR PRODUCING METALLIZED PLASTICS AND METALLIZING CERAMIC MATERIALS | |
| JP2000178752A (en) | Palladium catalyst removing agent for electroless plating | |
| DE1496984C3 (en) | Process for the production of printed circuits with galvanically generated conductor tracks according to the build-up method | |
| GB892451A (en) | Improvements in and relating to the manufacture of printed circuits | |
| FR2307438A1 (en) | Printed circuits with conducting transverse bores - starting with thin copper sheets as thin layers | |
| US5044073A (en) | Process for producing printed-circuit board | |
| GB806977A (en) | Improvements in printed circuits | |
| JPS62230996A (en) | Method for plating aluminum substrate | |
| IE49971B1 (en) | Manufacture of printed circuits | |
| GB1332041A (en) | Process for forming a conductive coating on a substrate |