GB847930A - Improvements in or relating to the electrolytic etching or plating of semi-conductive bodies - Google Patents
Improvements in or relating to the electrolytic etching or plating of semi-conductive bodiesInfo
- Publication number
- GB847930A GB847930A GB33678/56A GB3367856A GB847930A GB 847930 A GB847930 A GB 847930A GB 33678/56 A GB33678/56 A GB 33678/56A GB 3367856 A GB3367856 A GB 3367856A GB 847930 A GB847930 A GB 847930A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrolyte
- potential
- semi
- area
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000866 electrolytic etching Methods 0.000 title abstract 2
- 238000009713 electroplating Methods 0.000 title abstract 2
- 239000003792 electrolyte Substances 0.000 abstract 6
- 239000000969 carrier Substances 0.000 abstract 3
- 239000004793 Polystyrene Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 238000007654 immersion Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 229920002223 polystyrene Polymers 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 238000004347 surface barrier Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/12—Etching of semiconducting materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Nitrogen Condensed Heterocyclic Rings (AREA)
Abstract
847,930. Electrolytic etching and plating of semi-conductors. PHILCO CORPORATION. Nov. 5, 1956 [Nov. 4, 1955], No. 33678/56. Drawings to Specification. Class 41 A body of a semi-conductive material is locally etched or plated electrolytically by applying an electrolyte to the surface of the body to be so treated, and applying a potential between the electrolyte and a potential barrierforming element contiguous with said body and spaced from said surface, the applied potential being such that an area of said surface defined by the area of said element is suffused with minority carriers from said element and that the potential of said surface with respect to the electrolyte is of the same sign as said minority carriers so that etching or plating occurs only in the area suffused by said minority carriers. The treating electrolyte may be applied to the carrier either as a jet or by immersion therein of the body to be treated while isolating from the electrolyte the surfaces of the body other than that to be treated e.g. by means of a wax or polystyrene resist. The potential barrier-forming element may be a P-N junction, a rectifying area contact between an unstressed surface region of the semi-conductive body and an overlying material in intimate engagement therewith (a " surface-barrier contact) or a further electrolyte which may be applied as a jet. Specifications 805,292 and 824,484 are referred to. Reference has been directed by the Comptroller to Specification 805,291.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US352055XA | 1955-11-04 | 1955-11-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB847930A true GB847930A (en) | 1960-09-14 |
Family
ID=21881286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB33678/56A Expired GB847930A (en) | 1955-11-04 | 1956-11-05 | Improvements in or relating to the electrolytic etching or plating of semi-conductive bodies |
Country Status (5)
Country | Link |
---|---|
CH (1) | CH352055A (en) |
DE (1) | DE1051985B (en) |
FR (1) | FR1159064A (en) |
GB (1) | GB847930A (en) |
NL (2) | NL211922A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB871161A (en) * | 1959-05-13 | 1961-06-21 | Ass Elect Ind | Improvements relating to the production of junction transistors |
NL251614A (en) * | 1959-05-28 | 1900-01-01 | ||
NL252383A (en) * | 1960-06-07 | |||
DE1221363B (en) * | 1964-04-25 | 1966-07-21 | Telefunken Patent | Method for reducing the sheet resistance of semiconductor components |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2497770A (en) * | 1948-12-29 | 1950-02-14 | Bell Telephone Labor Inc | Transistor-microphone |
-
0
- NL NL105577D patent/NL105577C/xx active
- NL NL211922D patent/NL211922A/xx unknown
-
1956
- 1956-10-12 FR FR1159064D patent/FR1159064A/en not_active Expired
- 1956-11-03 CH CH352055D patent/CH352055A/en unknown
- 1956-11-05 DE DEP17335A patent/DE1051985B/en active Pending
- 1956-11-05 GB GB33678/56A patent/GB847930A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR1159064A (en) | 1958-06-23 |
NL211922A (en) | |
DE1051985B (en) | 1959-03-05 |
CH352055A (en) | 1961-02-15 |
NL105577C (en) |
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