GB822628A - A process for the electrolytic deposition of copper from an aqueous copper solution - Google Patents

A process for the electrolytic deposition of copper from an aqueous copper solution

Info

Publication number
GB822628A
GB822628A GB3216656A GB3216656A GB822628A GB 822628 A GB822628 A GB 822628A GB 3216656 A GB3216656 A GB 3216656A GB 3216656 A GB3216656 A GB 3216656A GB 822628 A GB822628 A GB 822628A
Authority
GB
United Kingdom
Prior art keywords
copper
diamine
aqueous
agent
electrolytic deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3216656A
Inventor
Hendricus Andreas V Oosterhout
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
METALLIC INDUSTRY NV
Original Assignee
METALLIC INDUSTRY NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL100908D priority Critical patent/NL100908C/xx
Priority to NL199518D priority patent/NL199518A/xx
Priority to DE1956N0011780 priority patent/DE1036003B/en
Application filed by METALLIC INDUSTRY NV filed Critical METALLIC INDUSTRY NV
Priority to GB3216656A priority patent/GB822628A/en
Priority to US623295A priority patent/US2887442A/en
Publication of GB822628A publication Critical patent/GB822628A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

822,628. Electroplating with copper. METALLIC INDUSTRY N.V. Oct. 22, 1956, No. 32166/56. Class 41. Copper is electrodeposited from an aqueous copper salt solution containing at least one mol. per litre of a diamine having a boiling-point between 100‹ and 150‹ C. Examples of suitable amines are ethylene diamine, its N: Nldimethyl and -diethyl derivatives, and propylene diamine. To reduce the disadvantage of the volatility of the amine, which should be present in excess, there may be added to the bath monoamino carboxylic acids having a higher dissociation constant, e.g. glycine, α- or #-alanine, glutamic acid, or γ-aminobutyric acid. An anionic wetting-agent, e.g. sodium lauryl sulphate, may also be used. Specific examples are given employing copper sulphate, a diamine, and an amino acid together with a wetting agent to give baths of pH about 8.5 from which at 58‹ C. there was obtained a bright deposit of copper which could be nickel-plated without polishing.
GB3216656A 1956-10-22 1956-10-22 A process for the electrolytic deposition of copper from an aqueous copper solution Expired GB822628A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
NL100908D NL100908C (en) 1956-10-22
NL199518D NL199518A (en) 1956-10-22
DE1956N0011780 DE1036003B (en) 1956-10-22 1956-01-31 Process for the electrolytic deposition of copper from aqueous copper salt solutions
GB3216656A GB822628A (en) 1956-10-22 1956-10-22 A process for the electrolytic deposition of copper from an aqueous copper solution
US623295A US2887442A (en) 1956-10-22 1956-11-20 Process for the electrolytic deposition of copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3216656A GB822628A (en) 1956-10-22 1956-10-22 A process for the electrolytic deposition of copper from an aqueous copper solution

Publications (1)

Publication Number Publication Date
GB822628A true GB822628A (en) 1959-10-28

Family

ID=10334326

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3216656A Expired GB822628A (en) 1956-10-22 1956-10-22 A process for the electrolytic deposition of copper from an aqueous copper solution

Country Status (3)

Country Link
DE (1) DE1036003B (en)
GB (1) GB822628A (en)
NL (2) NL199518A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3775264A (en) * 1971-11-10 1973-11-27 Wire & Cable Co Ltd Plating copper on aluminum
US3775265A (en) * 1970-05-25 1973-11-27 Canada Wire & Cable Co Ltd Method of plating copper on aluminum

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2411674A (en) * 1943-03-04 1946-11-26 Little Inc A Art of electrodeposition of copper

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3775265A (en) * 1970-05-25 1973-11-27 Canada Wire & Cable Co Ltd Method of plating copper on aluminum
US3775264A (en) * 1971-11-10 1973-11-27 Wire & Cable Co Ltd Plating copper on aluminum

Also Published As

Publication number Publication date
NL199518A (en)
DE1036003B (en) 1958-08-07
NL100908C (en)

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