GB2370040B - Thermally conductive materials in a hydrophobic compound for thermal management - Google Patents
Thermally conductive materials in a hydrophobic compound for thermal managementInfo
- Publication number
- GB2370040B GB2370040B GB0204971A GB0204971A GB2370040B GB 2370040 B GB2370040 B GB 2370040B GB 0204971 A GB0204971 A GB 0204971A GB 0204971 A GB0204971 A GB 0204971A GB 2370040 B GB2370040 B GB 2370040B
- Authority
- GB
- United Kingdom
- Prior art keywords
- thermally conductive
- conductive materials
- thermal management
- hydrophobic compound
- hydrophobic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/29386—Base material with a principal constituent of the material being a non metallic, non metalloid inorganic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/29393—Base material with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US40016999A | 1999-09-21 | 1999-09-21 | |
PCT/US2000/025811 WO2001021393A1 (en) | 1999-09-21 | 2000-09-20 | Thermally conductive materials in a hydrophobic compound for thermal management |
Publications (4)
Publication Number | Publication Date |
---|---|
GB0204971D0 GB0204971D0 (en) | 2002-04-17 |
GB2370040A GB2370040A (en) | 2002-06-19 |
GB2370040A8 GB2370040A8 (en) | 2002-06-19 |
GB2370040B true GB2370040B (en) | 2003-10-29 |
Family
ID=23582496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0204971A Expired - Fee Related GB2370040B (en) | 1999-09-21 | 2000-09-20 | Thermally conductive materials in a hydrophobic compound for thermal management |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP2003509578A (en) |
AU (1) | AU3886801A (en) |
DE (1) | DE10085011T1 (en) |
GB (1) | GB2370040B (en) |
WO (1) | WO2001021393A1 (en) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6673434B2 (en) | 1999-12-01 | 2004-01-06 | Honeywell International, Inc. | Thermal interface materials |
US7101565B2 (en) | 2002-02-05 | 2006-09-05 | Corpak Medsystems, Inc. | Probiotic/prebiotic composition and delivery method |
US20050016714A1 (en) | 2003-07-09 | 2005-01-27 | Chung Deborah D.L. | Thermal paste for improving thermal contacts |
KR101155940B1 (en) | 2003-11-05 | 2012-07-05 | 다우 코닝 코포레이션 | Thermally conductive grease and methods and devices in which said grease is used |
EP1568733A1 (en) * | 2004-02-20 | 2005-08-31 | Abb Research Ltd. | Porous inorganic filler particles having an organopolysiloxane coating for use in curable casting compositions |
JP5114111B2 (en) * | 2006-09-07 | 2013-01-09 | 日東シンコー株式会社 | Resin composition, heat conductive sheet, high heat conductive adhesive sheet with metal foil, and high heat conductive adhesive sheet with metal plate |
JP5114112B2 (en) * | 2006-09-07 | 2013-01-09 | 日東シンコー株式会社 | Resin composition, heat conductive sheet, high heat conductive adhesive sheet with metal foil, and high heat conductive adhesive sheet with metal plate |
US7527859B2 (en) * | 2006-10-08 | 2009-05-05 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and compositions made therewith |
US8093713B2 (en) * | 2007-02-09 | 2012-01-10 | Infineon Technologies Ag | Module with silicon-based layer |
DE102007023555A1 (en) * | 2007-05-21 | 2008-11-27 | Siemens Ag | Hydrophobic surface coating for electronic and electrical components as well as uses for it |
KR101725336B1 (en) | 2009-03-16 | 2017-04-10 | 다우 코닝 코포레이션 | Thermally conductive grease and methods and devices in which said grease is used |
JP5152108B2 (en) * | 2009-06-18 | 2013-02-27 | Jsr株式会社 | Thermally conductive resin composition and thermally conductive film |
WO2013089861A1 (en) * | 2011-12-12 | 2013-06-20 | Texas State University-San Marcos | Varistor-transistor hybrid devices |
CN104364900A (en) * | 2012-04-17 | 2015-02-18 | 莫门蒂夫性能材料股份有限公司 | Thermally conductive polymer compostions to reduce molding cycle time |
KR101412774B1 (en) * | 2012-07-27 | 2014-07-02 | 서울대학교산학협력단 | Porous boron nitride and method for preparing the same |
JP5934064B2 (en) * | 2012-09-06 | 2016-06-15 | ダイセルポリマー株式会社 | Additive for thermoplastic resin |
WO2014065910A1 (en) * | 2012-10-26 | 2014-05-01 | Laird Technologies, Inc. | Thermally conductive polymer composites containing magnesium silicate and boron nitride |
JPWO2015105106A1 (en) * | 2014-01-08 | 2017-03-23 | Jnc株式会社 | Resin composition for thermally conductive sheet, thermally conductive sheet, resin-coated metal, electronic device |
US20170055339A1 (en) * | 2014-04-30 | 2017-02-23 | Rogers Corporation | Thermally conductive composites and methods of manufacture thereof, and articles containing the composites |
TWI631179B (en) * | 2014-05-21 | 2018-08-01 | Toyobo Co., Ltd. | Polyamine resin composition and method for improving heat aging resistance of polyamine resin |
US10392499B2 (en) * | 2014-06-19 | 2019-08-27 | Lg Innotek Co., Ltd. | Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition |
EP3023456B1 (en) * | 2014-11-18 | 2019-06-19 | Miba Gleitlager Austria GmbH | Sliding bearing element |
WO2017086289A1 (en) * | 2015-11-19 | 2017-05-26 | 東洋紡株式会社 | High-melt-viscosity polyamide resin composition |
CN108884267B (en) | 2016-02-01 | 2022-02-22 | 卡博特公司 | Thermally conductive polymer compositions containing carbon black |
EP3526303A4 (en) * | 2016-10-12 | 2020-09-09 | Honeywell International Inc. | Thermal interface materials including coloring agent |
CN106385161B (en) * | 2016-10-31 | 2018-10-12 | 江苏科岭能源科技有限公司 | A kind of high-power air-cooled permanent-magnet speed governor |
CN108638608A (en) * | 2018-05-09 | 2018-10-12 | 苏州明上***科技有限公司 | A kind of high-hardness metal material |
CN109439188B (en) * | 2018-11-15 | 2020-09-11 | 北京林业大学 | Super-hydrophobic photo-thermal coating and preparation method thereof |
CN109880043B (en) * | 2019-01-07 | 2021-04-20 | 江苏大学 | Preparation method and anti-ultraviolet application of nano iron titanate modified polyurethane prepolymer |
US11411263B2 (en) * | 2019-03-06 | 2022-08-09 | Laird Technologies, Inc. | Thermal management and/or EMI mitigation materials including coated fillers |
JP7435294B2 (en) | 2020-06-17 | 2024-02-21 | 株式会社豊田中央研究所 | High thermal conductivity grease composition |
US20240150638A1 (en) * | 2021-03-12 | 2024-05-09 | Tatsuta Electric Wire & Cable Co., Ltd. | Thermally Conductive Sheet |
TW202407077A (en) * | 2022-06-22 | 2024-02-16 | 德商漢高股份有限及兩合公司 | Thermal interface materials with soft filler dispersions |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0279769A2 (en) * | 1987-02-17 | 1988-08-24 | Rogers Corporation | Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material |
US4869954A (en) * | 1987-09-10 | 1989-09-26 | Chomerics, Inc. | Thermally conductive materials |
US4882225A (en) * | 1985-07-29 | 1989-11-21 | Shiseido Company Ltd. | Modified powder or particulate material |
US5194480A (en) * | 1991-05-24 | 1993-03-16 | W. R. Grace & Co.-Conn. | Thermally conductive elastomer |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
US5234712A (en) * | 1992-06-08 | 1993-08-10 | The Dow Chemical Company | Method of making moisture resistant aluminum nitride powder and powder produced thereby |
GB2301818A (en) * | 1995-06-05 | 1996-12-18 | Gen Electric | Method for rendering inorganic powder hydrophobic |
JPH11134944A (en) * | 1997-10-28 | 1999-05-21 | Fujikura Ltd | Highly thermally conductive insulating material and superconductive cable |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08183906A (en) * | 1994-12-28 | 1996-07-16 | Shin Etsu Chem Co Ltd | Suspension of boron nitride |
JP3290127B2 (en) * | 1998-01-27 | 2002-06-10 | 松下電工株式会社 | Heat conductive silicone rubber composition and heat dissipation sheet comprising the heat conductive silicone rubber composition |
-
2000
- 2000-09-20 AU AU38868/01A patent/AU3886801A/en not_active Abandoned
- 2000-09-20 GB GB0204971A patent/GB2370040B/en not_active Expired - Fee Related
- 2000-09-20 DE DE10085011T patent/DE10085011T1/en not_active Ceased
- 2000-09-20 WO PCT/US2000/025811 patent/WO2001021393A1/en active Application Filing
- 2000-09-20 JP JP2001524797A patent/JP2003509578A/en not_active Withdrawn
-
2006
- 2006-05-15 JP JP2006135616A patent/JP2006241470A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4882225A (en) * | 1985-07-29 | 1989-11-21 | Shiseido Company Ltd. | Modified powder or particulate material |
EP0279769A2 (en) * | 1987-02-17 | 1988-08-24 | Rogers Corporation | Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material |
US4869954A (en) * | 1987-09-10 | 1989-09-26 | Chomerics, Inc. | Thermally conductive materials |
US5194480A (en) * | 1991-05-24 | 1993-03-16 | W. R. Grace & Co.-Conn. | Thermally conductive elastomer |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
US5234712A (en) * | 1992-06-08 | 1993-08-10 | The Dow Chemical Company | Method of making moisture resistant aluminum nitride powder and powder produced thereby |
GB2301818A (en) * | 1995-06-05 | 1996-12-18 | Gen Electric | Method for rendering inorganic powder hydrophobic |
JPH11134944A (en) * | 1997-10-28 | 1999-05-21 | Fujikura Ltd | Highly thermally conductive insulating material and superconductive cable |
Also Published As
Publication number | Publication date |
---|---|
GB0204971D0 (en) | 2002-04-17 |
JP2003509578A (en) | 2003-03-11 |
AU3886801A (en) | 2001-04-24 |
WO2001021393A1 (en) | 2001-03-29 |
GB2370040A (en) | 2002-06-19 |
GB2370040A8 (en) | 2002-06-19 |
DE10085011T1 (en) | 2003-01-16 |
JP2006241470A (en) | 2006-09-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20110920 |