GB2370040A - Thermally conductive materials in a hydrophobic compound for thermal management - Google Patents
Thermally conductive materials in a hydrophobic compound for thermal managementInfo
- Publication number
- GB2370040A GB2370040A GB0204971A GB0204971A GB2370040A GB 2370040 A GB2370040 A GB 2370040A GB 0204971 A GB0204971 A GB 0204971A GB 0204971 A GB0204971 A GB 0204971A GB 2370040 A GB2370040 A GB 2370040A
- Authority
- GB
- United Kingdom
- Prior art keywords
- thermally conductive
- heat source
- hydrophobic compound
- present
- moisture resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/29386—Base material with a principal constituent of the material being a non metallic, non metalloid inorganic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/29393—Base material with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Abstract
The present invention is directed to a moisture resistant, thermally conductive material (16) comprising a particulate filler comprising thermally conductive particles having a hydrophobic compound coating and a binder effective to join together the filler particles. The present invention also includes an electronic apparatus comprising a heat source (12), a heat sink (14), and a layer (16) of the moisture resistant, thermally conductive interface material disposed between and in contact with the heat source (12) and the heat sink (14). Still, the present invention is directed to a moisture resistant, thermally conductive material comprising particles of agglomerated boron nitride having a hydrophobic compound coating. Yet, the present invention includes a method of removing heat from a heat source comprising providing a heat sink proximate the heat source and disposing a layer of the moisture resistant, thermally conductive material between and in contact with the heat source and the heat sink.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US40016999A | 1999-09-21 | 1999-09-21 | |
PCT/US2000/025811 WO2001021393A1 (en) | 1999-09-21 | 2000-09-20 | Thermally conductive materials in a hydrophobic compound for thermal management |
Publications (4)
Publication Number | Publication Date |
---|---|
GB0204971D0 GB0204971D0 (en) | 2002-04-17 |
GB2370040A8 GB2370040A8 (en) | 2002-06-19 |
GB2370040A true GB2370040A (en) | 2002-06-19 |
GB2370040B GB2370040B (en) | 2003-10-29 |
Family
ID=23582496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0204971A Expired - Fee Related GB2370040B (en) | 1999-09-21 | 2000-09-20 | Thermally conductive materials in a hydrophobic compound for thermal management |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP2003509578A (en) |
AU (1) | AU3886801A (en) |
DE (1) | DE10085011T1 (en) |
GB (1) | GB2370040B (en) |
WO (1) | WO2001021393A1 (en) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6673434B2 (en) * | 1999-12-01 | 2004-01-06 | Honeywell International, Inc. | Thermal interface materials |
US7101565B2 (en) | 2002-02-05 | 2006-09-05 | Corpak Medsystems, Inc. | Probiotic/prebiotic composition and delivery method |
US20050016714A1 (en) | 2003-07-09 | 2005-01-27 | Chung Deborah D.L. | Thermal paste for improving thermal contacts |
JP4828429B2 (en) | 2003-11-05 | 2011-11-30 | ダウ・コーニング・コーポレイション | Thermally conductive grease, and method and device using the grease |
EP1568733A1 (en) * | 2004-02-20 | 2005-08-31 | Abb Research Ltd. | Porous inorganic filler particles having an organopolysiloxane coating for use in curable casting compositions |
JP5114111B2 (en) * | 2006-09-07 | 2013-01-09 | 日東シンコー株式会社 | Resin composition, heat conductive sheet, high heat conductive adhesive sheet with metal foil, and high heat conductive adhesive sheet with metal plate |
JP5114112B2 (en) * | 2006-09-07 | 2013-01-09 | 日東シンコー株式会社 | Resin composition, heat conductive sheet, high heat conductive adhesive sheet with metal foil, and high heat conductive adhesive sheet with metal plate |
US7527859B2 (en) * | 2006-10-08 | 2009-05-05 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and compositions made therewith |
US8093713B2 (en) * | 2007-02-09 | 2012-01-10 | Infineon Technologies Ag | Module with silicon-based layer |
DE102007023555A1 (en) * | 2007-05-21 | 2008-11-27 | Siemens Ag | Hydrophobic surface coating for electronic and electrical components as well as uses for it |
JP5651676B2 (en) | 2009-03-16 | 2015-01-14 | ダウ コーニング コーポレーションDow Corning Corporation | Thermally conductive grease, and method and device using the grease |
JP5152108B2 (en) * | 2009-06-18 | 2013-02-27 | Jsr株式会社 | Thermally conductive resin composition and thermally conductive film |
WO2013089861A1 (en) * | 2011-12-12 | 2013-06-20 | Texas State University-San Marcos | Varistor-transistor hybrid devices |
EP2839507A4 (en) * | 2012-04-17 | 2015-12-02 | Momentive Performance Mat Inc | Thermally conductive polymer compostions to reduce molding cycle time |
KR101412774B1 (en) * | 2012-07-27 | 2014-07-02 | 서울대학교산학협력단 | Porous boron nitride and method for preparing the same |
JP5934064B2 (en) * | 2012-09-06 | 2016-06-15 | ダイセルポリマー株式会社 | Additive for thermoplastic resin |
WO2014065910A1 (en) * | 2012-10-26 | 2014-05-01 | Laird Technologies, Inc. | Thermally conductive polymer composites containing magnesium silicate and boron nitride |
JPWO2015105106A1 (en) * | 2014-01-08 | 2017-03-23 | Jnc株式会社 | Resin composition for thermally conductive sheet, thermally conductive sheet, resin-coated metal, electronic device |
US20170055339A1 (en) * | 2014-04-30 | 2017-02-23 | Rogers Corporation | Thermally conductive composites and methods of manufacture thereof, and articles containing the composites |
CN106459579B (en) | 2014-05-21 | 2018-12-25 | 东洋纺株式会社 | The heat-resistant aging method for improving of Amilan polyamide resin composition and polyamide |
WO2015194901A1 (en) * | 2014-06-19 | 2015-12-23 | Lg Innotek Co., Ltd. | Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition |
EP3023456B1 (en) * | 2014-11-18 | 2019-06-19 | Miba Gleitlager Austria GmbH | Sliding bearing element |
WO2017086289A1 (en) * | 2015-11-19 | 2017-05-26 | 東洋紡株式会社 | High-melt-viscosity polyamide resin composition |
MX2018009122A (en) | 2016-02-01 | 2018-11-09 | Cabot Corp | Thermally conductive polymer compositions containing carbon black. |
KR20190067176A (en) * | 2016-10-12 | 2019-06-14 | 허니웰 인터내셔날 인코포레이티드 | A thermal interface material comprising a colorant |
CN106385161B (en) * | 2016-10-31 | 2018-10-12 | 江苏科岭能源科技有限公司 | A kind of high-power air-cooled permanent-magnet speed governor |
CN108638608A (en) * | 2018-05-09 | 2018-10-12 | 苏州明上***科技有限公司 | A kind of high-hardness metal material |
CN109439188B (en) * | 2018-11-15 | 2020-09-11 | 北京林业大学 | Super-hydrophobic photo-thermal coating and preparation method thereof |
CN109880043B (en) * | 2019-01-07 | 2021-04-20 | 江苏大学 | Preparation method and anti-ultraviolet application of nano iron titanate modified polyurethane prepolymer |
JP7435294B2 (en) | 2020-06-17 | 2024-02-21 | 株式会社豊田中央研究所 | High thermal conductivity grease composition |
KR20230156884A (en) * | 2021-03-12 | 2023-11-15 | 타츠타 전선 주식회사 | thermal conductive sheet |
WO2023250071A1 (en) * | 2022-06-22 | 2023-12-28 | Henkel Ag & Co. Kgaa | Thermal interface materials with soft filler dispersions |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4869954A (en) * | 1987-09-10 | 1989-09-26 | Chomerics, Inc. | Thermally conductive materials |
US4882225A (en) * | 1985-07-29 | 1989-11-21 | Shiseido Company Ltd. | Modified powder or particulate material |
US5194480A (en) * | 1991-05-24 | 1993-03-16 | W. R. Grace & Co.-Conn. | Thermally conductive elastomer |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
US5234712A (en) * | 1992-06-08 | 1993-08-10 | The Dow Chemical Company | Method of making moisture resistant aluminum nitride powder and powder produced thereby |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4849284A (en) * | 1987-02-17 | 1989-07-18 | Rogers Corporation | Electrical substrate material |
JPH08183906A (en) * | 1994-12-28 | 1996-07-16 | Shin Etsu Chem Co Ltd | Suspension of boron nitride |
DE19620942A1 (en) * | 1995-06-05 | 1996-12-12 | Gen Electric | Efficient process for hydrophobicizing inorganic powder |
JPH11134944A (en) * | 1997-10-28 | 1999-05-21 | Fujikura Ltd | Highly thermally conductive insulating material and superconductive cable |
JP3290127B2 (en) * | 1998-01-27 | 2002-06-10 | 松下電工株式会社 | Heat conductive silicone rubber composition and heat dissipation sheet comprising the heat conductive silicone rubber composition |
-
2000
- 2000-09-20 DE DE10085011T patent/DE10085011T1/en not_active Ceased
- 2000-09-20 GB GB0204971A patent/GB2370040B/en not_active Expired - Fee Related
- 2000-09-20 JP JP2001524797A patent/JP2003509578A/en not_active Withdrawn
- 2000-09-20 AU AU38868/01A patent/AU3886801A/en not_active Abandoned
- 2000-09-20 WO PCT/US2000/025811 patent/WO2001021393A1/en active Application Filing
-
2006
- 2006-05-15 JP JP2006135616A patent/JP2006241470A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4882225A (en) * | 1985-07-29 | 1989-11-21 | Shiseido Company Ltd. | Modified powder or particulate material |
US4869954A (en) * | 1987-09-10 | 1989-09-26 | Chomerics, Inc. | Thermally conductive materials |
US5194480A (en) * | 1991-05-24 | 1993-03-16 | W. R. Grace & Co.-Conn. | Thermally conductive elastomer |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
US5234712A (en) * | 1992-06-08 | 1993-08-10 | The Dow Chemical Company | Method of making moisture resistant aluminum nitride powder and powder produced thereby |
Also Published As
Publication number | Publication date |
---|---|
GB2370040B (en) | 2003-10-29 |
JP2003509578A (en) | 2003-03-11 |
GB2370040A8 (en) | 2002-06-19 |
JP2006241470A (en) | 2006-09-14 |
WO2001021393A1 (en) | 2001-03-29 |
AU3886801A (en) | 2001-04-24 |
GB0204971D0 (en) | 2002-04-17 |
DE10085011T1 (en) | 2003-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20110920 |