TW453470U - Heat dissipation structure - Google Patents

Heat dissipation structure

Info

Publication number
TW453470U
TW453470U TW88219270U TW88219270U TW453470U TW 453470 U TW453470 U TW 453470U TW 88219270 U TW88219270 U TW 88219270U TW 88219270 U TW88219270 U TW 88219270U TW 453470 U TW453470 U TW 453470U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation structure
heat
dissipation
Prior art date
Application number
TW88219270U
Other languages
Chinese (zh)
Inventor
Guo-Ji Yu
Original Assignee
Alpha Top Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Top Corp filed Critical Alpha Top Corp
Priority to TW88219270U priority Critical patent/TW453470U/en
Publication of TW453470U publication Critical patent/TW453470U/en

Links

TW88219270U 1999-11-11 1999-11-11 Heat dissipation structure TW453470U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88219270U TW453470U (en) 1999-11-11 1999-11-11 Heat dissipation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88219270U TW453470U (en) 1999-11-11 1999-11-11 Heat dissipation structure

Publications (1)

Publication Number Publication Date
TW453470U true TW453470U (en) 2001-09-01

Family

ID=21656039

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88219270U TW453470U (en) 1999-11-11 1999-11-11 Heat dissipation structure

Country Status (1)

Country Link
TW (1) TW453470U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112449516A (en) * 2019-08-29 2021-03-05 动态Ad有限责任公司 Sensor housing
CN113157054A (en) * 2020-01-22 2021-07-23 凌华科技股份有限公司 Memory slot shock-resistant and heat-radiating structure
CN113885275A (en) * 2021-10-09 2022-01-04 北京睿智奥恒视觉科技有限公司 Industrial camera with heat radiation structure
TWI821022B (en) * 2022-06-10 2023-11-01 神基科技股份有限公司 Water-proofing electronic device and fan device thereof
US11950397B2 (en) 2019-08-27 2024-04-02 Motional Ad Llc Cooling solutions for autonomous vehicles

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11950397B2 (en) 2019-08-27 2024-04-02 Motional Ad Llc Cooling solutions for autonomous vehicles
CN112449516A (en) * 2019-08-29 2021-03-05 动态Ad有限责任公司 Sensor housing
CN112449516B (en) * 2019-08-29 2022-08-26 动态Ad有限责任公司 Sensor shell
US11940234B2 (en) 2019-08-29 2024-03-26 Motional Ad Llc Sensor housing
CN113157054A (en) * 2020-01-22 2021-07-23 凌华科技股份有限公司 Memory slot shock-resistant and heat-radiating structure
CN113885275A (en) * 2021-10-09 2022-01-04 北京睿智奥恒视觉科技有限公司 Industrial camera with heat radiation structure
CN113885275B (en) * 2021-10-09 2023-08-11 北京睿智奥恒视觉科技有限公司 Industrial camera with heat radiation structure
TWI821022B (en) * 2022-06-10 2023-11-01 神基科技股份有限公司 Water-proofing electronic device and fan device thereof

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees