GB2353649B - A method for improving focusing of an image to be projected onto a semiconductor wafer in a semiconductor manufacturing process - Google Patents
A method for improving focusing of an image to be projected onto a semiconductor wafer in a semiconductor manufacturing processInfo
- Publication number
- GB2353649B GB2353649B GB0009095A GB0009095A GB2353649B GB 2353649 B GB2353649 B GB 2353649B GB 0009095 A GB0009095 A GB 0009095A GB 0009095 A GB0009095 A GB 0009095A GB 2353649 B GB2353649 B GB 2353649B
- Authority
- GB
- United Kingdom
- Prior art keywords
- image
- manufacturing process
- projected onto
- semiconductor wafer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7026—Focusing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IE1999/0781A IE83663B1 (en) | 1999-08-24 | A method for improving focusing of an image to be projected onto a semiconductor wafer in a semiconductor manufacturing process | |
IES990721 IES990721A2 (en) | 1999-08-24 | 1999-08-24 | A method for improving focusing of an image to be projected onto a semiconductor wafer in a semiconductor manufacturing process |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0009095D0 GB0009095D0 (en) | 2000-05-31 |
GB2353649A GB2353649A (en) | 2001-02-28 |
GB2353649B true GB2353649B (en) | 2003-10-29 |
Family
ID=26320261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0009095A Expired - Fee Related GB2353649B (en) | 1999-08-24 | 2000-04-13 | A method for improving focusing of an image to be projected onto a semiconductor wafer in a semiconductor manufacturing process |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2353649B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5690785A (en) * | 1995-03-13 | 1997-11-25 | Yamaha Corporation | Lithography control on uneven surface |
US5744814A (en) * | 1997-03-24 | 1998-04-28 | Nec Corporation | Method and apparatus for scanning exposure having thickness measurements of a film surface |
US5748323A (en) * | 1997-01-23 | 1998-05-05 | Advanced Micro Devices | Method and apparatus for wafer-focusing |
-
2000
- 2000-04-13 GB GB0009095A patent/GB2353649B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5690785A (en) * | 1995-03-13 | 1997-11-25 | Yamaha Corporation | Lithography control on uneven surface |
US5748323A (en) * | 1997-01-23 | 1998-05-05 | Advanced Micro Devices | Method and apparatus for wafer-focusing |
US5744814A (en) * | 1997-03-24 | 1998-04-28 | Nec Corporation | Method and apparatus for scanning exposure having thickness measurements of a film surface |
Also Published As
Publication number | Publication date |
---|---|
GB2353649A (en) | 2001-02-28 |
GB0009095D0 (en) | 2000-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) |
Free format text: REGISTERED BETWEEN 20100624 AND 20100630 |
|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20190413 |