AU2001249535A1 - Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path - Google Patents

Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path

Info

Publication number
AU2001249535A1
AU2001249535A1 AU2001249535A AU4953501A AU2001249535A1 AU 2001249535 A1 AU2001249535 A1 AU 2001249535A1 AU 2001249535 A AU2001249535 A AU 2001249535A AU 4953501 A AU4953501 A AU 4953501A AU 2001249535 A1 AU2001249535 A1 AU 2001249535A1
Authority
AU
Australia
Prior art keywords
fixed
single process
substrate manufacturing
wafer polishing
process path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001249535A
Inventor
John M. Boyd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2001249535A1 publication Critical patent/AU2001249535A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
AU2001249535A 2000-03-31 2001-03-28 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path Abandoned AU2001249535A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/541,109 US6616801B1 (en) 2000-03-31 2000-03-31 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
US09/541,109 2000-03-31
PCT/US2001/009887 WO2001074537A1 (en) 2000-03-31 2001-03-28 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path

Publications (1)

Publication Number Publication Date
AU2001249535A1 true AU2001249535A1 (en) 2001-10-15

Family

ID=24158210

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001249535A Abandoned AU2001249535A1 (en) 2000-03-31 2001-03-28 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path

Country Status (7)

Country Link
US (1) US6616801B1 (en)
EP (1) EP1268132A1 (en)
JP (1) JP2003529924A (en)
KR (1) KR20020087443A (en)
AU (1) AU2001249535A1 (en)
TW (1) TW567548B (en)
WO (1) WO2001074537A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6511713B2 (en) * 2001-04-02 2003-01-28 Saint-Gobain Abrasives Technology Company Production of patterned coated abrasive surfaces
BRPI0709736A2 (en) * 2006-04-04 2011-07-26 Saint Gobain Abrasives Inc cured or infrared abrasive articles and manufacturing method
CN103522214A (en) * 2012-12-05 2014-01-22 郑州新安华砂轮有限公司 UV grinding wheel and production method of UV grinding wheel
CN103522215A (en) * 2012-12-08 2014-01-22 郑州新安华砂轮有限公司 UV grinding tool grease and personalized grinding tool production method
US20140323017A1 (en) * 2013-04-24 2014-10-30 Applied Materials, Inc. Methods and apparatus using energized fluids to clean chemical mechanical planarization polishing pads
US20180093411A1 (en) * 2016-09-30 2018-04-05 Applied Materials, Inc. Additive manufacturing of polishing pads on a conveyor
JP7227137B2 (en) 2017-01-20 2023-02-21 アプライド マテリアルズ インコーポレイテッド Thin plastic abrasive article for CMP applications
US11717936B2 (en) 2018-09-14 2023-08-08 Applied Materials, Inc. Methods for a web-based CMP system
KR20200068785A (en) * 2018-12-05 2020-06-16 삼성디스플레이 주식회사 Apparatus and metheod for monitoring of chemical mechanical polishing

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3753269A (en) 1971-05-21 1973-08-21 R Budman Abrasive cloth cleaner
US4318250A (en) 1980-03-31 1982-03-09 St. Florian Company, Ltd. Wafer grinder
SU1194665A1 (en) * 1984-02-20 1985-11-30 Украинский Филиал Всесоюзного Научно-Исследовательского Института Абразивов И Шлифования Method of manufacturing abrasive cloth
US4720939A (en) 1986-05-23 1988-01-26 Simpson Products, Inc. Wide belt sander cleaning device
JPS63267155A (en) 1987-04-24 1988-11-04 Babcock Hitachi Kk Polishing device
US5014468A (en) 1989-05-05 1991-05-14 Norton Company Patterned coated abrasive for fine surface finishing
US5257478A (en) 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5104421B1 (en) 1990-03-23 1993-11-16 Fujimi Abrasives Co.,Ltd. Polishing method of goods and abrasive pad therefor
US5081051A (en) 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
DE69206685T2 (en) 1991-06-06 1996-07-04 Commissariat Energie Atomique Polishing machine with a tensioned fine grinding belt and an improved workpiece carrier head
US5484323A (en) 1991-07-22 1996-01-16 Smith; Robert K. Belt cleaner
US5197999A (en) 1991-09-30 1993-03-30 National Semiconductor Corporation Polishing pad for planarization
JP3036348B2 (en) 1994-03-23 2000-04-24 三菱マテリアル株式会社 Truing device for wafer polishing pad
US5547417A (en) 1994-03-21 1996-08-20 Intel Corporation Method and apparatus for conditioning a semiconductor polishing pad
US5622526A (en) 1994-03-28 1997-04-22 J. D. Phillips Corporation Apparatus for trueing CBN abrasive belts and grinding wheels
US5536202A (en) 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
ES2137459T3 (en) 1994-08-09 1999-12-16 Ontrak Systems Inc LINEAR POLISHING AND METHOD FOR PLANNING SEMICONDUCTIVE PILLS.
US5593344A (en) 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
US5575707A (en) 1994-10-11 1996-11-19 Ontrak Systems, Inc. Polishing pad cluster for polishing a semiconductor wafer
US5674122A (en) * 1994-10-27 1997-10-07 Minnesota Mining And Manufacturing Company Abrasive articles and methods for their manufacture
US5643044A (en) 1994-11-01 1997-07-01 Lund; Douglas E. Automatic chemical and mechanical polishing system for semiconductor wafers
TW400567B (en) 1995-04-10 2000-08-01 Matsushita Electric Ind Co Ltd The polishing device and its polishing method for the substrate
US5908530A (en) 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5655951A (en) 1995-09-29 1997-08-12 Micron Technology, Inc. Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
US5611943A (en) 1995-09-29 1997-03-18 Intel Corporation Method and apparatus for conditioning of chemical-mechanical polishing pads
JP2830907B2 (en) 1995-12-06 1998-12-02 日本電気株式会社 Semiconductor substrate polishing equipment
US5762536A (en) 1996-04-26 1998-06-09 Lam Research Corporation Sensors for a linear polisher
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US5725417A (en) 1996-11-05 1998-03-10 Micron Technology, Inc. Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates
US5871390A (en) 1997-02-06 1999-02-16 Lam Research Corporation Method and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishing
EP1015177A1 (en) 1997-04-04 2000-07-05 Obsidian, Inc. Polishing media magazine for improved polishing
US5899798A (en) 1997-07-25 1999-05-04 Obsidian Inc. Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing
US6196896B1 (en) 1997-10-31 2001-03-06 Obsidian, Inc. Chemical mechanical polisher
US5897426A (en) 1998-04-24 1999-04-27 Applied Materials, Inc. Chemical mechanical polishing with multiple polishing pads
US6299508B1 (en) * 1998-08-05 2001-10-09 3M Innovative Properties Company Abrasive article with integrally molded front surface protrusions containing a grinding aid and methods of making and using
US6306019B1 (en) 1999-12-30 2001-10-23 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6361414B1 (en) 2000-06-30 2002-03-26 Lam Research Corporation Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
US6435952B1 (en) 2000-06-30 2002-08-20 Lam Research Corporation Apparatus and method for qualifying a chemical mechanical planarization process

Also Published As

Publication number Publication date
TW567548B (en) 2003-12-21
JP2003529924A (en) 2003-10-07
KR20020087443A (en) 2002-11-22
WO2001074537A9 (en) 2002-12-27
EP1268132A1 (en) 2003-01-02
WO2001074537A1 (en) 2001-10-11
US6616801B1 (en) 2003-09-09

Similar Documents

Publication Publication Date Title
AU2002321815A1 (en) Method and apparatus for process control in the semiconductor manufacturing
AU2001250876A1 (en) Method and apparatus for planarizing a semiconductor contactor
AU2001267703A1 (en) Apparatus and method for investigating semiconductor wafers
AU2003253873A1 (en) Apparatus and method for backfilling a semiconductor wafer process chamber
EP1130626A3 (en) Method and apparatus for manufacturing semiconductor device
AU3361797A (en) Method and apparatus for contactless treatment of a semiconductor substrate in wafer form
AU3521700A (en) Method and apparatus for processing a wafer
GB9914484D0 (en) Polishing apparatus and method for polishing a substrate
AU2001287255A1 (en) Apparatus and method for electrochemically processing a microelectronic workpiece
AU3530000A (en) Apparatus and method for determining the active dopant profile in a semiconductor wafer
AU2002211485A1 (en) Wafer cleaning module and method for cleaning the surface of a substrate
AU1072700A (en) An apparatus for integrated monitoring of wafers and for process control in the semiconductor manufacturing and method for use thereof
AU2001271923A1 (en) Apparatus and method for processing a microelectronic workpiece using metrology
GB2360043B (en) Method and apparatus for loading substrate in semiconductor manufacturing apparatus
AU2001292880A1 (en) Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers
WO2002011947A3 (en) Method for processing a semiconductor wafer using double-side polishing
AU2001271573A1 (en) A conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
AU2002329860A1 (en) Method and apparatus for sensing a wafer in a carrier
AU2001249535A1 (en) Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
AU2001230409A1 (en) A method and apparatus for implanting semiconductor wafer substrates
AU2002366146A1 (en) Apparatus for molding a semiconductor wafer and process therefor
AU2001271795A1 (en) Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures
EP1291132A3 (en) Semiconductor wafer polishing apparatus and polishing method
AU2001232914A1 (en) Process and apparatus for cleaning silicon wafers
AU2002350152A1 (en) Integrated dry-wet processing apparatus and method for removing material on semiconductor wafers using dry-wet processes