GB2349742B - Method and apparatus for processing a wafer to remove an unnecessary substance therefrom - Google Patents

Method and apparatus for processing a wafer to remove an unnecessary substance therefrom

Info

Publication number
GB2349742B
GB2349742B GB0007920A GB0007920A GB2349742B GB 2349742 B GB2349742 B GB 2349742B GB 0007920 A GB0007920 A GB 0007920A GB 0007920 A GB0007920 A GB 0007920A GB 2349742 B GB2349742 B GB 2349742B
Authority
GB
United Kingdom
Prior art keywords
wafer
remove
processing
unnecessary substance
substance therefrom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0007920A
Other versions
GB2349742A (en
GB0007920D0 (en
Inventor
Kaori Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of GB0007920D0 publication Critical patent/GB0007920D0/en
Publication of GB2349742A publication Critical patent/GB2349742A/en
Application granted granted Critical
Publication of GB2349742B publication Critical patent/GB2349742B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
GB0007920A 1999-04-01 2000-03-31 Method and apparatus for processing a wafer to remove an unnecessary substance therefrom Expired - Fee Related GB2349742B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11095187A JP2000294527A (en) 1999-04-01 1999-04-01 Method for processing wafer and its processor

Publications (3)

Publication Number Publication Date
GB0007920D0 GB0007920D0 (en) 2000-05-17
GB2349742A GB2349742A (en) 2000-11-08
GB2349742B true GB2349742B (en) 2001-05-30

Family

ID=14130761

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0007920A Expired - Fee Related GB2349742B (en) 1999-04-01 2000-03-31 Method and apparatus for processing a wafer to remove an unnecessary substance therefrom

Country Status (2)

Country Link
JP (1) JP2000294527A (en)
GB (1) GB2349742B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003297947A (en) * 2002-04-01 2003-10-17 Hitachi Ltd Semiconductor integrated circuit device and its manufacturing method
JP2006139271A (en) * 2005-10-24 2006-06-01 Hoya Corp Apparatus and method for removing unwanted film, and method for manufacturing photomask blank
WO2008048259A2 (en) 2006-10-16 2008-04-24 Materials And Technologies Corporation Wet processing using a fluid meniscus, apparatus and method
US8221552B2 (en) 2007-03-30 2012-07-17 Lam Research Corporation Cleaning of bonded silicon electrodes
JP2011100978A (en) * 2009-10-07 2011-05-19 Sumco Corp Method and device for cleaning semiconductor substrate
JP6306540B2 (en) * 2015-06-19 2018-04-04 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
CN105080892B (en) * 2015-07-30 2017-04-05 上海华力微电子有限公司 A kind of cleaning device and cleaning method of wafer holder
CN106783683B (en) * 2016-12-19 2019-08-09 安徽天裕汽车零部件制造有限公司 A kind of wafer-scanning cleaning swinging arm device
JP7138539B2 (en) * 2018-10-18 2022-09-16 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
CN110743865B (en) * 2019-10-29 2020-12-11 韶关市洁盟超声科技有限公司 Utilize automatic air-dried device of lid behind high-efficient washing wrist-watch of ultrasonic wave

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4544446A (en) * 1984-07-24 1985-10-01 J. T. Baker Chemical Co. VLSI chemical reactor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4544446A (en) * 1984-07-24 1985-10-01 J. T. Baker Chemical Co. VLSI chemical reactor

Also Published As

Publication number Publication date
JP2000294527A (en) 2000-10-20
GB2349742A (en) 2000-11-08
GB0007920D0 (en) 2000-05-17

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20050331