GB2295722B - Method of packaging integrated circuits - Google Patents

Method of packaging integrated circuits

Info

Publication number
GB2295722B
GB2295722B GB9424178A GB9424178A GB2295722B GB 2295722 B GB2295722 B GB 2295722B GB 9424178 A GB9424178 A GB 9424178A GB 9424178 A GB9424178 A GB 9424178A GB 2295722 B GB2295722 B GB 2295722B
Authority
GB
United Kingdom
Prior art keywords
integrated circuits
packaging integrated
packaging
circuits
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9424178A
Other versions
GB2295722A (en
GB9424178D0 (en
Inventor
Derek Thomson
Andrew Beaumont
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions UK Ltd
Original Assignee
Motorola Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Ltd filed Critical Motorola Ltd
Priority to GB9424178A priority Critical patent/GB2295722B/en
Publication of GB9424178D0 publication Critical patent/GB9424178D0/en
Publication of GB2295722A publication Critical patent/GB2295722A/en
Application granted granted Critical
Publication of GB2295722B publication Critical patent/GB2295722B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
GB9424178A 1994-11-30 1994-11-30 Method of packaging integrated circuits Expired - Fee Related GB2295722B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9424178A GB2295722B (en) 1994-11-30 1994-11-30 Method of packaging integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9424178A GB2295722B (en) 1994-11-30 1994-11-30 Method of packaging integrated circuits

Publications (3)

Publication Number Publication Date
GB9424178D0 GB9424178D0 (en) 1995-01-18
GB2295722A GB2295722A (en) 1996-06-05
GB2295722B true GB2295722B (en) 1997-12-17

Family

ID=10765214

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9424178A Expired - Fee Related GB2295722B (en) 1994-11-30 1994-11-30 Method of packaging integrated circuits

Country Status (1)

Country Link
GB (1) GB2295722B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009058796A1 (en) 2009-12-18 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Optoelectronic component and method for producing an optoelectronic component
DE202014010573U1 (en) 2014-12-02 2016-01-07 Ifm Electronic Gmbh A plastic encapsulated electronic assembly for a capacitive sensor
DE102014224628B4 (en) * 2014-12-02 2020-12-24 Ifm Electronic Gmbh Method for producing an electronic assembly overmolded with plastic, an electronic assembly of this type, and a capacitive sensor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4163072A (en) * 1977-06-07 1979-07-31 Bell Telephone Laboratories, Incorporated Encapsulation of circuits
EP0258098A1 (en) * 1986-07-25 1988-03-02 Fujitsu Limited Encapsulated semiconductor device and method of producing the same
US4784872A (en) * 1984-11-17 1988-11-15 Messerschmitt-Boelkow-Blohm Gmbh Process for encapsulating microelectronic semi-conductor and layer type circuits
US5019419A (en) * 1988-11-30 1991-05-28 Toshiba Silicone Co. Ltd. Process for producing an electronic part
US5097317A (en) * 1989-09-08 1992-03-17 Mitsubishi Denki Kabushiki Kaisha Resin-sealed semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4163072A (en) * 1977-06-07 1979-07-31 Bell Telephone Laboratories, Incorporated Encapsulation of circuits
US4784872A (en) * 1984-11-17 1988-11-15 Messerschmitt-Boelkow-Blohm Gmbh Process for encapsulating microelectronic semi-conductor and layer type circuits
EP0258098A1 (en) * 1986-07-25 1988-03-02 Fujitsu Limited Encapsulated semiconductor device and method of producing the same
US5019419A (en) * 1988-11-30 1991-05-28 Toshiba Silicone Co. Ltd. Process for producing an electronic part
US5097317A (en) * 1989-09-08 1992-03-17 Mitsubishi Denki Kabushiki Kaisha Resin-sealed semiconductor device

Also Published As

Publication number Publication date
GB2295722A (en) 1996-06-05
GB9424178D0 (en) 1995-01-18

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19981130