GB2286592B - Amine curable epoxy resins - Google Patents
Amine curable epoxy resinsInfo
- Publication number
- GB2286592B GB2286592B GB9502770A GB9502770A GB2286592B GB 2286592 B GB2286592 B GB 2286592B GB 9502770 A GB9502770 A GB 9502770A GB 9502770 A GB9502770 A GB 9502770A GB 2286592 B GB2286592 B GB 2286592B
- Authority
- GB
- United Kingdom
- Prior art keywords
- epoxy resins
- curable epoxy
- amine curable
- amine
- resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 150000001412 amines Chemical class 0.000 title 1
- 239000003822 epoxy resin Substances 0.000 title 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
- C08G59/1466—Acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Emergency Medicine (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Paints Or Removers (AREA)
- Floor Finish (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US19789894A | 1994-02-17 | 1994-02-17 | |
US20310994A | 1994-02-28 | 1994-02-28 | |
US08/334,496 US5536775A (en) | 1994-02-28 | 1994-11-04 | Amine curable compositions |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9502770D0 GB9502770D0 (en) | 1995-03-29 |
GB2286592A GB2286592A (en) | 1995-08-23 |
GB2286592B true GB2286592B (en) | 1998-04-01 |
Family
ID=27393799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9502770A Expired - Fee Related GB2286592B (en) | 1994-02-17 | 1995-02-13 | Amine curable epoxy resins |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH07286034A (it) |
DE (1) | DE19504528A1 (it) |
FR (1) | FR2716202B1 (it) |
GB (1) | GB2286592B (it) |
IT (1) | IT1278016B1 (it) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3598649B2 (ja) * | 1996-05-07 | 2004-12-08 | 東洋インキ製造株式会社 | 硬化性樹脂組成物 |
JP4665151B2 (ja) * | 2001-01-19 | 2011-04-06 | 住友金属工業株式会社 | 鋼材用防食塗料組成物およびそれを塗装した鋼材 |
DE10119127A1 (de) | 2001-04-19 | 2002-10-24 | Cognis Deutschland Gmbh | Wäßrige Beschichtungszusammensetzungen auf Basis von Epoxidharzen |
DE10119141A1 (de) | 2001-04-19 | 2002-10-24 | Cognis Deutschland Gmbh | Wäßrige Beschichtungszusammensetzungen auf Basis selbst-dispergierender Epoxidharze |
JP2004238449A (ja) * | 2003-02-05 | 2004-08-26 | Konishi Co Ltd | エポキシ樹脂系塗膜の形成方法 |
ITMI20082305A1 (it) * | 2008-12-23 | 2010-06-24 | Mondial Color S R L | Composizione per il rivestimento di utensili da taglio |
CN104159946A (zh) * | 2012-03-09 | 2014-11-19 | 建筑研究和技术有限公司 | 可胺固化的环氧树脂组合物 |
AU2013229697B2 (en) * | 2012-03-09 | 2015-12-17 | Construction Research & Technology Gmbh | Amine curable epoxy resin composition |
WO2016069161A1 (en) * | 2014-10-28 | 2016-05-06 | Blue Cube Ip Llc | Curable composition |
EP4015557A1 (en) * | 2020-12-21 | 2022-06-22 | Henkel AG & Co. KGaA | Two component (2k) epoxy formulation |
EP4159784A1 (en) * | 2021-09-30 | 2023-04-05 | Henkel AG & Co. KGaA | Two component (2k) composition based on epoxy (meth)acrylate resin |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4358477A (en) * | 1978-09-07 | 1982-11-09 | Akzo N.V. | Process of curing unsaturated epoxy coating composition with radiation and epoxy curing agent, and coated substrate |
US5055378A (en) * | 1987-11-13 | 1991-10-08 | Kabushiki Kaisha Toshiba | Solder resist composition |
EP0562860A1 (en) * | 1992-03-26 | 1993-09-29 | Sericol Limited | Radiation curable compounds and compositions |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5523143A (en) * | 1978-08-07 | 1980-02-19 | Asahi Chem Ind Co Ltd | Cold-setting resin composition |
JPS5714618A (en) * | 1980-06-30 | 1982-01-25 | Mitsubishi Gas Chem Co Inc | Resin composition |
CS224495B1 (cs) * | 1981-08-05 | 1984-01-16 | Lunak Stanislav | Tvrditelné epoxidové kompozice se zvýšenou stabilitou při skladování |
US4547562A (en) * | 1984-03-26 | 1985-10-15 | Gus Nichols | Solventless polymeric composition comprising non arylamine, polyacrylate and epoxide |
DE4027259A1 (de) * | 1990-08-29 | 1992-03-05 | Herberts Gmbh | Bindemittelzusammensetzung, deren herstellung, diese enthaltende ueberzugsmittel und deren verwendung |
DE4330684A1 (de) * | 1993-09-10 | 1995-03-16 | Ruetgerswerke Ag | Härtbare Bindemittel |
-
1995
- 1995-02-11 DE DE19504528A patent/DE19504528A1/de not_active Withdrawn
- 1995-02-13 GB GB9502770A patent/GB2286592B/en not_active Expired - Fee Related
- 1995-02-15 IT IT95RM000085A patent/IT1278016B1/it active IP Right Grant
- 1995-02-16 JP JP7027952A patent/JPH07286034A/ja active Pending
- 1995-02-16 FR FR9501908A patent/FR2716202B1/fr not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4358477A (en) * | 1978-09-07 | 1982-11-09 | Akzo N.V. | Process of curing unsaturated epoxy coating composition with radiation and epoxy curing agent, and coated substrate |
US5055378A (en) * | 1987-11-13 | 1991-10-08 | Kabushiki Kaisha Toshiba | Solder resist composition |
EP0562860A1 (en) * | 1992-03-26 | 1993-09-29 | Sericol Limited | Radiation curable compounds and compositions |
Non-Patent Citations (1)
Title |
---|
WPI Abstract Accession No. 93-392738/49 and JP520095087 A * |
Also Published As
Publication number | Publication date |
---|---|
ITRM950085A1 (it) | 1996-08-15 |
FR2716202B1 (fr) | 1997-08-14 |
JPH07286034A (ja) | 1995-10-31 |
FR2716202A1 (fr) | 1995-08-18 |
IT1278016B1 (it) | 1997-11-17 |
GB2286592A (en) | 1995-08-23 |
ITRM950085A0 (it) | 1995-02-15 |
GB9502770D0 (en) | 1995-03-29 |
DE19504528A1 (de) | 1995-08-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20010213 |