GB2260545A - Method of manufacturing printed wiring boards - Google Patents
Method of manufacturing printed wiring boards Download PDFInfo
- Publication number
- GB2260545A GB2260545A GB9207722A GB9207722A GB2260545A GB 2260545 A GB2260545 A GB 2260545A GB 9207722 A GB9207722 A GB 9207722A GB 9207722 A GB9207722 A GB 9207722A GB 2260545 A GB2260545 A GB 2260545A
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed wiring
- solder resist
- marking
- wiring boards
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention enables easy visual inspection of the solder resist and marking in high density or high performance printed wiring boards. The solder resist is formed by means of an ink including a conventional solder resist ink containing 5 to 15 wt% of a fluorescent dye and a fluorescent pigment, respectively applied thereto, while marking is performed by means of an ink including a conventional marking ink containing 5 to 15% of a fluorescent pigment applied thereto.
Description
"METHOD OF MANUFACTURING PRINTED WIRING BOARDS"
The present invention relates to a method of manufacturing printed wiring boards.
In the conventional method of manufacturing printed wiring boards, commonly used is a copper-clad laminate whose copper foil is etched to form a printed wiring circuit thereon. In the later steps, solder resists are formed on the substrate for the purpose of further providing a plurality of layers of printed wiring circuit, electrical components are mounted onto the printed wiring circuit, insulation is effected between adjacent circuits, protecting the circuits or the like. Moreover, marking (for example, symbol marking) is applied to the substrate for the purpose of indicating the nature of the components, the component numbers, the positions where the components are to be mounted, and letters or signs for a load map or the like.
Recently, electronic equipment has become markedly subject to increase in density, improvements in performance, and reduction in size and weight.
Regarding mounting components as well, the increase in the density of semiconductor elements (IC) accelerates a tendency toward the surface mounting type of package, or the multi-pin type package. Also in the printed wiring boards, with the increased demand for higher density or further fining, it is getting difficult to visually inspect, for example, the degree of impregnation of ink into the edge, and the bleeding into the lands or thin spots during the provision of solder resist and marking in the manufacturing process of the printed wiring boards, and to inspect the bleeding of the ink during the marking printing.
The present invention seeks to provide a method of manufacturing printed wiring boards capable of eliminating the difficulty in the visual inspection which will be caused at the time of forming a solder resist and marking in the conventional manufacturing method for the printed wiring boards.
The method of manufacturing printed wiring boards according to the present invention is characterised in that it comprises the steps of forming a printed wiring circuit on one or both sides of a substrate, applying a solder resist thereon, and providing marking printing thereon, wherein
a solder resist ink containing a fluorescent material is applied to form said solder resist; and
a marking printing ink containing a fluorescent material is used for executing said marking printing.
According to the method of manufacturing printed wiring boards of the present invention, there are used a solder resist ink and a marking ink each containing a fluorescent material for the provision of solder resist and marking printing, respectively, to thereby irradiate light or heat to facilitate the visual inspection or mechanical inspection of impregnation of ink into the edge, bleeding of ink into the land, or bleeding in marking.
In order that the invention may be better understood an embodiment thereof will now be described by way of example only and with reference to the accompanying drawing in which Figure 1 is an explanatory drawing showing a classification chart of the methods of manufacturing printed wiring boards according to the present invention.
Figure 1 shows a classification chart of the manufacturing processes, that is, of the typical methods for the manufacture of PWB s. Other circuit formation methods such as electrically conductive paste printing or die-stamping are also available.
For the application of the solder resist (undercoating or overcoating) in the above-mentioned method of manufacturing printed wiring boards, an ink prepared on the basis of the following recipe is complemented with a fluorescent dye and fluorescent pigment of 5 to 15 wt% serving as a fluorescent material. The materials listed below are applicable as the fluorescent material including a fluorescent dye and a fluorescent pigment.
The application thereof can be implemented by a process suitable for the method of manufacturing printed wiring boards to be employed, for example, by screen printing.
Formulation Example 1 wt%
Epoxy 28
Polyethylene glycol acrylate 40
Benzoin alkyl ether 4
TiO2 (Titanium oxide) 5
SiO2 (Silicon dioxide) 3
Diphenyl disulfide 2.0
Pigment (Cyanine green) 0.4
Diethylhydroxylamine 0.1
Dimethyl hydroxan (Foam stabiliser) 2.0
Formulation Example 2 wt%
Epoxy acrylate 40
Polyurethane acrylate 40
Bensoin alkyl ether 4 CaC03 (Calcium carbonate) 5
SiO2 (Silicon dioxide) 3
Pigment (Cyanine green) 0.4
Benzothiazole 0.05
Benzophenone 2.6
Dimethyl hydroxan (Foam stabiliser) 1.5
Fluorescent Dye
Acridine Orange NO
Methylene Blue
Rosamine
Tripaflarine
Fluorescent Pigment
Lumogen L Yellow
Lumogen Water Blue
Lumogen L Blue
Lumogen Yellow Orange
The formation of the solder resist in accordance with the above method made it possible to obtain the following functions and effects in particular.
The application of the fluorescent material facilitates a visual distinction between the circuit pattern and the solder resist due to its fluorescent effect, thereby enabling the exposure of the edge and bleeding to be easily confirmed.
Similarly, in a substrate having at least two layers on one side thereof and at least four layers in total on both sides thereof, it is possible to visually distinguish the state of formation of solder resist (or insulating layer) and to reduce the defective insulation between layers.
Moreover, at the formation of marking in the process for the manufacture of printed wiring boards, the following formulation example is to be supplemented with any one of the fluorescent dyes and fluorescent pigments of 5 to 15 wt%, respectively, which are listed as fluorescent materials to be applied to the solder resist ink.
It should be noted that a conventional printing method can be employed for execution.
Formulation Example 3 wt%
Epoxy acrylate 20 to 30
Polyethylene glycol acrylate 20 to 30
Filler 32
Pigment 10 to 11
Additive 4
The marking formed in accordance with the above process presented letters and numbers which could be visually identified more clearly due to the fluorescent effect of the fluorescent material present in the ink.
According to the above-described method, inspection of the solder resist and marking in the process for the manufacture of printed wiring boards can be visually performed without any difficulty to ensure that it is capable of sufficiently coping with a higher density or performance of the printed wiring boards.
Claims (4)
1. A method of manufacturing printed wiring boards, said method comprising the steps of forming a printed wiring circuit on one or both sides of a substrate, applying a solder resist thereon, and providing marking printing thereon, wherein:
a solder resist ink containing a fluorescent material is applied to form said solder resist; and
a marking printing ink containing a fluorescent material is used for executing said marking printing.
2. A method according to claim 1, wherein said solder resist is formed by means of screen printing or photographic printing.
3. A method according to claim 1, wherein said solder resist is formed on a single layer of or on a plurality of layers of printed wiring circuit to be formed on one or both sides of said substrate, or is formed between the layers of printed wiring circuit.
4. A method according to claim 1, substantially as hereinbefore described.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29499091A JPH05110233A (en) | 1991-10-15 | 1991-10-15 | Manufacture of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB9207722D0 GB9207722D0 (en) | 1992-05-27 |
| GB2260545A true GB2260545A (en) | 1993-04-21 |
Family
ID=17814922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9207722A Withdrawn GB2260545A (en) | 1991-10-15 | 1992-04-08 | Method of manufacturing printed wiring boards |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH05110233A (en) |
| GB (1) | GB2260545A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5227283B2 (en) * | 2009-09-30 | 2013-07-03 | 太陽ホールディングス株式会社 | Resin composition and printed wiring board using the same |
| JP2013135192A (en) * | 2011-12-27 | 2013-07-08 | Goo Chemical Co Ltd | Resin composition for solder resist and resin composition for marking ink |
| JP2013135193A (en) * | 2011-12-27 | 2013-07-08 | Goo Chemical Co Ltd | Printed wiring board |
| JP6451259B2 (en) * | 2014-06-26 | 2019-01-16 | 株式会社リコー | Flexible circuit board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4240945A (en) * | 1979-01-31 | 1980-12-23 | Albert Gabrick | Solder mask composition |
| US4242139A (en) * | 1978-02-03 | 1980-12-30 | Hoechst Aktiengesellschaft | Water soluble benzoxanthene dyestuffs for fluorescent inks |
| US4540595A (en) * | 1982-02-01 | 1985-09-10 | International Business Machines Corporation | Article identification material and method and apparatus for using it |
| US4670298A (en) * | 1985-12-09 | 1987-06-02 | Northern Telecom Limited | Fluorescent solder paste mixture |
| EP0233358A2 (en) * | 1985-12-19 | 1987-08-26 | Union Carbide Corporation | Polymer compositions curable by actinic radiation |
| EP0253543A1 (en) * | 1986-07-10 | 1988-01-20 | THOMAS DE LA RUE & COMPANY LIMITED | Printing ink |
| EP0282638A2 (en) * | 1987-03-16 | 1988-09-21 | Nippon CMK Corp. | Printing ink for solder resist in printed circuit board |
-
1991
- 1991-10-15 JP JP29499091A patent/JPH05110233A/en active Pending
-
1992
- 1992-04-08 GB GB9207722A patent/GB2260545A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4242139A (en) * | 1978-02-03 | 1980-12-30 | Hoechst Aktiengesellschaft | Water soluble benzoxanthene dyestuffs for fluorescent inks |
| US4240945A (en) * | 1979-01-31 | 1980-12-23 | Albert Gabrick | Solder mask composition |
| US4540595A (en) * | 1982-02-01 | 1985-09-10 | International Business Machines Corporation | Article identification material and method and apparatus for using it |
| US4670298A (en) * | 1985-12-09 | 1987-06-02 | Northern Telecom Limited | Fluorescent solder paste mixture |
| EP0233358A2 (en) * | 1985-12-19 | 1987-08-26 | Union Carbide Corporation | Polymer compositions curable by actinic radiation |
| EP0253543A1 (en) * | 1986-07-10 | 1988-01-20 | THOMAS DE LA RUE & COMPANY LIMITED | Printing ink |
| EP0282638A2 (en) * | 1987-03-16 | 1988-09-21 | Nippon CMK Corp. | Printing ink for solder resist in printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| US4292230 US4271258 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05110233A (en) | 1993-04-30 |
| GB9207722D0 (en) | 1992-05-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |