JPH05110233A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH05110233A JPH05110233A JP29499091A JP29499091A JPH05110233A JP H05110233 A JPH05110233 A JP H05110233A JP 29499091 A JP29499091 A JP 29499091A JP 29499091 A JP29499091 A JP 29499091A JP H05110233 A JPH05110233 A JP H05110233A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- solder resist
- wiring board
- marking
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はプリント配線板の製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board.
【0002】[0002]
【従来の技術】従来のプリント配線板の製造方法として
は、通常銅張積層板を用いるとともにこれの銅箔をエッ
チングしてプリント配線回路を形成し、かつ後工程にお
ける複数層のプリント配線回路あるいはプリント配線回
路に対する部品の実装および回路間の絶縁および回路保
護等の目的によってソルダーレジストが形成され、さら
に、部品の種類、部品番号、部品の取り付け位置、ロー
ドマップなどの文字や記号を表示する目的によってマー
キング(シンボルマーク)が施されることにより製造さ
れている。2. Description of the Related Art As a conventional method for manufacturing a printed wiring board, a copper clad laminate is usually used, and a copper wiring is etched to form a printed wiring circuit. A solder resist is formed for the purpose of mounting components to the printed wiring circuit, insulation between circuits, and circuit protection, and also for displaying characters and symbols such as component type, component number, component mounting position, and road map. It is manufactured by marking (symbol mark) by.
【0003】[0003]
【発明が解決しようとする課題】しかるに、電子機器
は、年々高密度化、高性能化および小型軽量化が進み、
かつ実装部品面においても半導体素子(IC)の高密度
化に伴って、表面実装パッケージ、多ピン型パッケージ
へと移行し、プリント配線板においても高密度化、ファ
イン化の要求が高まるにつれて、前記プリント配線板の
製造工程におけるソルダーレジストおよびマーキングに
も、例えばソルダーレジスト形成時のエッヂへのインク
の入り具合や、ランドへのニジミ,カスレ等の目視検査
が困難となって居ることに加えてマーキング印刷におい
てもインクのニジミ等の検査が困難となってきている欠
点を有するものである。However, electronic devices are becoming higher in density, higher in performance, smaller in size, and lighter in weight year after year.
In addition, in terms of mounting components, as the density of semiconductor elements (ICs) has increased, surface mount packages and multi-pin packages have been used, and the demand for higher density and finer printed wiring boards has increased. For solder resist and marking in the manufacturing process of printed wiring boards, for example, it is difficult to perform visual inspection such as the condition of ink entering the edge when solder resist is formed and bleeding and scraping on land. Even in printing, it has a drawback that it is becoming difficult to inspect ink for blurring.
【0004】因って、本発明は前記従来のプリント配線
板の製造方法におけるソルダーレジストおよびマーキン
グの形成時における目視検査の困難性を解消し得るプリ
ント配線板の製造方法の提供を目的とするものである。Therefore, an object of the present invention is to provide a method of manufacturing a printed wiring board which can eliminate the difficulty of visual inspection at the time of forming the solder resist and the marking in the conventional method of manufacturing a printed wiring board. Is.
【0005】[0005]
【課題を解決するための手段】本発明のプリント配線板
の製造方法は、基板の片面または両面にプリント配線回
路を形成するとともにソルダーレジストを塗布し、かつ
マーキング印刷を施して形成するプリント配線板の製造
方法において、前記ソルダーレジストを蛍光性物質を含
有するソルダーレジストインクを塗布して形成するとと
もに前記マーキング印刷を蛍光性物質を含有するマーキ
ング印刷インクにて印刷することを特徴とするものであ
る。A method of manufacturing a printed wiring board according to the present invention is a printed wiring board formed by forming a printed wiring circuit on one side or both sides of a substrate, applying a solder resist, and performing marking printing. In the manufacturing method, the solder resist is formed by applying a solder resist ink containing a fluorescent substance, and the marking print is printed with a marking printing ink containing a fluorescent substance. .
【0006】[0006]
【作用】本発明のプリント配線板の製造方法によれば、
ソルダーレジストおよびマーキング印刷において、蛍光
性物質を含有するソルダーレジストインクおよびマーキ
ングインクにて形成することにより、光または熱ネネル
ギーの照射によってインクのエッヂへの入り込み、ラン
ドへのニジミあるいはマーキングのニジミ等の目視ある
いは機械検査を容易にすることができる。According to the method of manufacturing a printed wiring board of the present invention,
In solder resist and marking printing, by forming with a solder resist ink and a marking ink containing a fluorescent substance, the penetration of ink into the edge by irradiation of light or thermal energy, bleeding of land or marking bleeding etc. Visual or mechanical inspection can be facilitated.
【0007】[0007]
【実施例】以下本発明のプリント配線板の製造方法の実
施例を以下に説明する。EXAMPLES Examples of the method for manufacturing a printed wiring board according to the present invention will be described below.
【0008】本発明におけるプリント配線板の製造工程
は、従来公知の工程を経て製造される。しかして、その
製造工程、例えば代表的なPWBの製造方法の分類を示
すのが図1である。また、その他の回路形成法、例えば
導電ペースト印刷法やダイスタンピング法による製造方
法を挙げることができる。そこで、前記したプリント配
線板の製造方法において実施例されるソルダーレジスト
(アンダーコート,オーバーコート)の実施に当たって
は、以下の配合例1および2に蛍光性物質としての蛍光
性染料および蛍光性顔料を5〜15重量%添加したイン
クにて形成するものである。尚、前記蛍光性物質として
の蛍光性染料と蛍光性顔料については以下に列記するも
のを適用し得る。また、その塗布方法についても前記プ
リント配線板の各種製造方法に適応する方法にて、例え
ばスクリーン印刷法等により実施するものである。The manufacturing process of the printed wiring board in the present invention is carried out through conventionally known processes. FIG. 1 shows the classification of the manufacturing process, for example, a typical PWB manufacturing method. Further, other circuit forming methods such as a conductive paste printing method and a die stamping method can be mentioned. Therefore, in carrying out the solder resist (undercoat, overcoat) used in the method for producing a printed wiring board described above, a fluorescent dye and a fluorescent pigment as fluorescent substances were added to the following formulation examples 1 and 2. The ink is formed by adding 5 to 15% by weight. The fluorescent dyes and fluorescent pigments as the fluorescent substance may be those listed below. The coating method is also a method adapted to various manufacturing methods of the printed wiring board, for example, screen printing method.
【0009】 配合例1 重量% エポキシアクリレート 28 ポリエチレングリコールアクリレート 40 ベンゾインアルキルエーテル 4 TiO2 (酸化チタン) 5 SiO2 (酸化珪素) 3 ジフェルジサルファイド 2.0 顔料 (シアニングリーン) 0.4 ジエチルヒドロキシアミン 0.1 ジメチルヒドロキサン(整泡剤) 2.0Formulation Example 1 Wt% Epoxy acrylate 28 Polyethylene glycol acrylate 40 Benzoin alkyl ether 4 TiO 2 (titanium oxide) 5 SiO 2 (silicon oxide) 3 Diferdisulfide 2.0 Pigment (cyanine green) 0.4 Diethylhydroxy Amine 0.1 Dimethylhydroxane (foam stabilizer) 2.0
【0010】 配合例2 重量% エポキシアクリレート 40 ポリウレタンアクリレート 40 ベンゾインアルキルエーテル 4 CaCO3 (炭酸カルシウム) 5 SiO2 (酸化珪素) 3 顔料 (シアニングリーン) 0.4 ベンゾチアゾール 0.05 ベンゾンフェノン 2.6 ジメチルヒドロキサン(整泡剤) 1.5Formulation Example 2 wt% epoxy acrylate 40 polyurethane acrylate 40 benzoin alkyl ether 4 CaCO 3 (calcium carbonate) 5 SiO 2 (silicon oxide) 3 pigment (cyanine green) 0.4 benzothiazole 0.05 benzonephenone 2. 6 Dimethylhydroxane (foam stabilizer) 1.5
【0011】 蛍光性染料 Acridine Orange NO Methylene Blue Rosamine TripaflarineFluorescent Dyes Acridine Orange NO Methylene Blue Rosamine Tripaflarine
【0012】 蛍光性顔料 Lumogen L Yellow Lumogen Water Blue Lumogen L Blue Lumogen Yellow OrangeFluorescent Pigment Lumogen L Yellow Lumogen Water Blue Lumogen L Blue Lumogen Yellow Orange
【0013】しかして、以上の方法によりソルダーレジ
ストを形成することにより特に以下の作用効果を得るこ
とができた。蛍光性物質を混入することによってその蛍
光作用により回路パターンとソルダーレジストとの区別
が目視でも容易となり、エッヂ部の露出およびニジミの
確認が容易となった。片面2層以上両面4層以上の基板
においてもソルダーレジスト(絶縁層)の形成状態が目
視ではっきり分かり、層間絶縁不良の低下が可能となっ
た。さらに、前記プリント配線板の製造工程おけるクー
キングの形成に当たって、は以下の配合例3に前記した
ソルダーレジストインクに添加した蛍光性物質として列
記した前記蛍光性染料および蛍光性顔料のうちのいずれ
かのものをそれぞれ5〜15重量%添加したものを使用
して印刷するものである。尚、印刷方法については従来
の印刷方法により実施例することができる。By forming the solder resist by the above method, the following effects can be obtained. By mixing the fluorescent substance, the fluorescent effect facilitates the visual distinction between the circuit pattern and the solder resist, and the exposure of the edge portion and the bleeding can be easily confirmed. Even in a substrate having two layers or more on one side and four layers or more on both sides, the formation state of the solder resist (insulating layer) was clearly visible, and the interlayer insulation failure could be reduced. Further, in forming the cooking in the manufacturing process of the printed wiring board, any one of the fluorescent dye and the fluorescent pigment listed as the fluorescent substance added to the solder resist ink described in Formulation Example 3 below should be used. The printing is performed by using the materials added with 5 to 15% by weight. The printing method can be implemented by a conventional printing method.
【0014】 配合例3 重量% エポキシアクリレート 20〜30 ポリエチレングリコールアクリレート 20〜30 フィラー 32 顔料 10〜11 添加剤 4Formulation Example 3 wt% Epoxy acrylate 20-30 Polyethylene glycol acrylate 20-30 Filler 32 Pigment 10-11 Additive 4
【0015】以上の方法により形成したマーキングによ
れば細かい文字や数字もインク中の蛍光性物質の蛍光作
用によって文字や数字の目視もより一層はっきりと確認
することができた。According to the marking formed by the above method, even the fine letters and numbers can be visually confirmed more clearly by the fluorescent action of the fluorescent substance in the ink.
【0016】[0016]
【発明の効果】本発明によれば、プリント配線板の製造
工程におけるソルダーレジストおよびマーキングの検査
が目視によっても容易に行え、プリント配線板の高密
度,高性能化等にも充分に対応し得るものである。According to the present invention, the inspection of the solder resist and the marking in the manufacturing process of the printed wiring board can be easily performed by visual inspection, and the high density and high performance of the printed wiring board can be sufficiently dealt with. It is a thing.
【図1】本発明におけるプリント配線板の製造方法の分
類を示す説明図。FIG. 1 is an explanatory view showing classification of methods for manufacturing a printed wiring board according to the present invention.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 川上 伸 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Shin Kawakami 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Japan CMK Corporation
Claims (3)
路を形成するとともにソルダーレジストを塗布し、かつ
マーキング印刷を施して形成するプリント配線板の製造
方法において、 前記ソルダーレジストを蛍光性物質を含有するソルダー
レジストインクを塗布して形成するとともに前記マーキ
ング印刷を蛍光性物質を含有するマーキング印刷インク
にて印刷することを特徴とするプリント配線板の製造方
法。1. A method for manufacturing a printed wiring board, wherein a printed wiring circuit is formed on one side or both sides of a substrate, a solder resist is applied, and marking printing is performed. The solder resist contains a fluorescent substance. A method for manufacturing a printed wiring board, which comprises applying a solder resist ink to form the marking printing, and printing the marking printing with a marking printing ink containing a fluorescent substance.
法または写真印刷法により形成することを特徴とする請
求項1記載のプリント配線板の製造方法。2. The method for manufacturing a printed wiring board according to claim 1, wherein the solder resist is formed by a screen printing method or a photo printing method.
面または両面に形成される1層または複数の層のプリン
ト配線回路の上側または層間に形成することを特徴とす
る請求項1記載のプリント配線板の製造方法。3. The printed wiring board according to claim 1, wherein the solder resist is formed on an upper side or an interlayer of a printed wiring circuit of one layer or a plurality of layers formed on one side or both sides of the substrate. Manufacturing method.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29499091A JPH05110233A (en) | 1991-10-15 | 1991-10-15 | Manufacture of printed wiring board |
GB9207722A GB2260545A (en) | 1991-10-15 | 1992-04-08 | Method of manufacturing printed wiring boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29499091A JPH05110233A (en) | 1991-10-15 | 1991-10-15 | Manufacture of printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05110233A true JPH05110233A (en) | 1993-04-30 |
Family
ID=17814922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29499091A Pending JPH05110233A (en) | 1991-10-15 | 1991-10-15 | Manufacture of printed wiring board |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH05110233A (en) |
GB (1) | GB2260545A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011074180A (en) * | 2009-09-30 | 2011-04-14 | Taiyo Holdings Co Ltd | Resin composition and printed-wiring board using the same |
JP2013135193A (en) * | 2011-12-27 | 2013-07-08 | Goo Chemical Co Ltd | Printed wiring board |
JP2013135192A (en) * | 2011-12-27 | 2013-07-08 | Goo Chemical Co Ltd | Resin composition for solder resist and resin composition for marking ink |
JP2016027596A (en) * | 2014-06-26 | 2016-02-18 | 株式会社リコー | Flexible circuit board |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2804530C2 (en) * | 1978-02-03 | 1986-04-30 | Hoechst Ag, 6230 Frankfurt | Use of water-soluble benzoxanthene dyes for fluorescent inks |
US4240945A (en) * | 1979-01-31 | 1980-12-23 | Albert Gabrick | Solder mask composition |
US4540595A (en) * | 1982-02-01 | 1985-09-10 | International Business Machines Corporation | Article identification material and method and apparatus for using it |
US4670298A (en) * | 1985-12-09 | 1987-06-02 | Northern Telecom Limited | Fluorescent solder paste mixture |
CA1312040C (en) * | 1985-12-19 | 1992-12-29 | Joseph Victor Koleske | Conformal coatings cured with actinic radiation |
GB8616878D0 (en) * | 1986-07-10 | 1986-08-20 | De La Rue Thomas & Co Ltd | Coating compositions |
JPH06103783B2 (en) * | 1987-03-16 | 1994-12-14 | 日本シイエムケイ株式会社 | Printing ink for solder resist of printed wiring board |
-
1991
- 1991-10-15 JP JP29499091A patent/JPH05110233A/en active Pending
-
1992
- 1992-04-08 GB GB9207722A patent/GB2260545A/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011074180A (en) * | 2009-09-30 | 2011-04-14 | Taiyo Holdings Co Ltd | Resin composition and printed-wiring board using the same |
JP2013135193A (en) * | 2011-12-27 | 2013-07-08 | Goo Chemical Co Ltd | Printed wiring board |
JP2013135192A (en) * | 2011-12-27 | 2013-07-08 | Goo Chemical Co Ltd | Resin composition for solder resist and resin composition for marking ink |
JP2016027596A (en) * | 2014-06-26 | 2016-02-18 | 株式会社リコー | Flexible circuit board |
Also Published As
Publication number | Publication date |
---|---|
GB2260545A (en) | 1993-04-21 |
GB9207722D0 (en) | 1992-05-27 |
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