GB2217107B - Workpiece processing apparatus - Google Patents

Workpiece processing apparatus

Info

Publication number
GB2217107B
GB2217107B GB8906751A GB8906751A GB2217107B GB 2217107 B GB2217107 B GB 2217107B GB 8906751 A GB8906751 A GB 8906751A GB 8906751 A GB8906751 A GB 8906751A GB 2217107 B GB2217107 B GB 2217107B
Authority
GB
United Kingdom
Prior art keywords
processing apparatus
workpiece processing
workpiece
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB8906751A
Other versions
GB2217107A (en
GB8906751D0 (en
Inventor
Yoshiki Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of GB8906751D0 publication Critical patent/GB8906751D0/en
Publication of GB2217107A publication Critical patent/GB2217107A/en
Application granted granted Critical
Publication of GB2217107B publication Critical patent/GB2217107B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
GB8906751A 1988-03-24 1989-03-23 Workpiece processing apparatus Expired - Lifetime GB2217107B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6820288A JP2559617B2 (en) 1988-03-24 1988-03-24 Substrate processing equipment

Publications (3)

Publication Number Publication Date
GB8906751D0 GB8906751D0 (en) 1989-05-10
GB2217107A GB2217107A (en) 1989-10-18
GB2217107B true GB2217107B (en) 1992-09-23

Family

ID=13366973

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8906751A Expired - Lifetime GB2217107B (en) 1988-03-24 1989-03-23 Workpiece processing apparatus

Country Status (3)

Country Link
JP (1) JP2559617B2 (en)
DE (1) DE3909669A1 (en)
GB (1) GB2217107B (en)

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JP2652894B2 (en) * 1989-11-22 1997-09-10 キヤノン株式会社 Wafer transfer device
GB9006471D0 (en) * 1990-03-22 1990-05-23 Surface Tech Sys Ltd Loading mechanisms
DE4024973C2 (en) * 1990-08-07 1994-11-03 Ibm Arrangement for storing, transporting and introducing substrates
JP2697364B2 (en) * 1991-04-30 1998-01-14 株式会社村田製作所 Heat treatment system
KR940003241B1 (en) * 1991-05-23 1994-04-16 금성일렉트론 주식회사 Lead frame auto-supply equipment for semiconductor
DE4127341C2 (en) * 1991-08-19 2000-03-09 Leybold Ag Device for automatic casting, coating, painting, checking and sorting workpieces
KR950001245Y1 (en) * 1991-09-13 1995-02-24 금성일렉트론 주식회사 Apparatus for autotransmitting device of handler
DE4139549A1 (en) * 1991-11-30 1993-06-03 Leybold Ag DEVICE FOR THE TRANSPORT OF SUBSTRATES
JPH0722490A (en) * 1993-06-30 1995-01-24 Mitsubishi Electric Corp Device and method for automatically arranging lots
JP3069945B2 (en) * 1995-07-28 2000-07-24 東京エレクトロン株式会社 Processing equipment
KR970023964A (en) * 1995-10-13 1997-05-30 김광호 Transfer transfer device of stocker for semiconductor manufacturing
US5734629A (en) * 1995-12-28 1998-03-31 Rimage Corporation CD transporter
TW317644B (en) * 1996-01-26 1997-10-11 Tokyo Electron Co Ltd
JP3218425B2 (en) * 1996-03-25 2001-10-15 東京エレクトロン株式会社 Processing method and processing apparatus
TW333658B (en) * 1996-05-30 1998-06-11 Tokyo Electron Co Ltd The substrate processing method and substrate processing system
US6062798A (en) * 1996-06-13 2000-05-16 Brooks Automation, Inc. Multi-level substrate processing apparatus
US6203582B1 (en) * 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US6091498A (en) * 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6672820B1 (en) 1996-07-15 2004-01-06 Semitool, Inc. Semiconductor processing apparatus having linear conveyer system
US6645355B2 (en) 1996-07-15 2003-11-11 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
JP3779393B2 (en) * 1996-09-06 2006-05-24 東京エレクトロン株式会社 Processing system
TW353777B (en) * 1996-11-08 1999-03-01 Tokyo Electron Ltd Treatment device
US6099643A (en) * 1996-12-26 2000-08-08 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing a substrate providing an efficient arrangement and atmospheric isolation of chemical treatment section
DE69708108T2 (en) * 1997-11-21 2002-03-14 Tapematic Spa Optical disk processing machine and method for transporting optical disks during processing
DE19964235B4 (en) * 1998-03-12 2006-08-24 Tokyo Electron Ltd. Conveying procedure of semiconductor wafer, LCD substrate during semiconductor device manufacture - involves conveying wafer to processing units for processing according to predetermined procedure and taking them out of processing units, using respective arms
DE19910478C2 (en) 1998-03-12 2002-02-28 Tokyo Electron Ltd Substrate transport method and substrate processing system
US6244931B1 (en) * 1999-04-02 2001-06-12 Applied Materials, Inc. Buffer station on CMP system
US6401324B1 (en) * 2000-08-07 2002-06-11 Toshiharu Tom Miyano Machine tool assembly and method of performing machining operations using the machine tool assembly
JP3616748B2 (en) * 2000-11-07 2005-02-02 東京エレクトロン株式会社 Development processing method, development processing apparatus, and processing apparatus
JP4180787B2 (en) 2000-12-27 2008-11-12 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
DE10227213B4 (en) * 2002-06-18 2004-07-22 Asys Automatic Systems Gmbh & Co. Kg Transfer device for microsystems
US7077585B2 (en) 2002-07-22 2006-07-18 Yoshitake Ito Developing method and apparatus for performing development processing properly and a solution processing method enabling enhanced uniformity in the processing
JP4414921B2 (en) 2005-03-23 2010-02-17 東京エレクトロン株式会社 Coating and developing apparatus and coating and developing method
DE102005039453B4 (en) * 2005-08-18 2007-06-28 Asys Automatic Systems Gmbh & Co. Kg Machining plant of modular construction for flat substrates
JP4519037B2 (en) * 2005-08-31 2010-08-04 東京エレクトロン株式会社 Heating device and coating / developing device
JP5006122B2 (en) * 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
JP4505006B2 (en) * 2007-09-28 2010-07-14 大日本スクリーン製造株式会社 Substrate processing equipment
JP4505005B2 (en) * 2007-09-28 2010-07-14 大日本スクリーン製造株式会社 Substrate processing equipment
JP4499147B2 (en) * 2007-11-21 2010-07-07 大日本スクリーン製造株式会社 Substrate processing equipment
JP5128918B2 (en) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
JP5179170B2 (en) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
JP5001828B2 (en) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
US8757026B2 (en) * 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
JP4887329B2 (en) * 2008-05-19 2012-02-29 東京エレクトロン株式会社 Substrate processing system
JP5608148B2 (en) * 2011-11-25 2014-10-15 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ Substrate processing equipment
KR20190090064A (en) * 2011-12-22 2019-07-31 카티바, 인크. Gas enclosure system
JP6058999B2 (en) * 2012-12-11 2017-01-11 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ Substrate processing apparatus and substrate processing method
US9245783B2 (en) 2013-05-24 2016-01-26 Novellus Systems, Inc. Vacuum robot with linear translation carriage

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2056169A (en) * 1979-07-27 1981-03-11 Hitachi Ltd Manufacturing system for semiconductor devices
US4454003A (en) * 1983-01-06 1984-06-12 Systems Engineering & Manufacturing Corp. Printed circuit board component conveyor apparatus and process
EP0189279A2 (en) * 1985-01-22 1986-07-30 Applied Materials, Inc. Semiconductor processing system
WO1987006566A1 (en) * 1986-04-22 1987-11-05 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus
EP0244950A2 (en) * 1986-04-04 1987-11-11 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
EP0244951A2 (en) * 1986-04-04 1987-11-11 Materials Research Corporation Method and apparatus for handling and processing wafer like materials
GB2194500A (en) * 1986-07-04 1988-03-09 Canon Kk A wafer handling apparatus
EP0273791A1 (en) * 1986-11-28 1988-07-06 Commissariat A L'energie Atomique Device for the storage and transport of objects in an environment with a high degree of purity
EP0322205A2 (en) * 1987-12-23 1989-06-28 Texas Instruments Incorporated Automated photolithographic work cell

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DE375601C (en) * 1923-05-15 Claudius Dornier Dipl Ing Flying boat with tension screw
JPS6041045U (en) * 1983-08-26 1985-03-23 東京エレクトロン株式会社 semiconductor wafer prober
JPS60162341A (en) * 1984-02-02 1985-08-24 Fuji Photo Film Co Ltd Bar code display device for telephone number
JPH0734426B2 (en) * 1986-06-25 1995-04-12 日本電気株式会社 Resist material coating and developing device
JPH0230194B2 (en) * 1986-07-04 1990-07-04 Kyanon Kk HANDOTAISEIZOSOCHI

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2056169A (en) * 1979-07-27 1981-03-11 Hitachi Ltd Manufacturing system for semiconductor devices
US4454003A (en) * 1983-01-06 1984-06-12 Systems Engineering & Manufacturing Corp. Printed circuit board component conveyor apparatus and process
EP0189279A2 (en) * 1985-01-22 1986-07-30 Applied Materials, Inc. Semiconductor processing system
EP0244950A2 (en) * 1986-04-04 1987-11-11 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
EP0244951A2 (en) * 1986-04-04 1987-11-11 Materials Research Corporation Method and apparatus for handling and processing wafer like materials
WO1987006566A1 (en) * 1986-04-22 1987-11-05 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus
GB2194500A (en) * 1986-07-04 1988-03-09 Canon Kk A wafer handling apparatus
EP0273791A1 (en) * 1986-11-28 1988-07-06 Commissariat A L'energie Atomique Device for the storage and transport of objects in an environment with a high degree of purity
EP0322205A2 (en) * 1987-12-23 1989-06-28 Texas Instruments Incorporated Automated photolithographic work cell

Also Published As

Publication number Publication date
JPH01241840A (en) 1989-09-26
GB2217107A (en) 1989-10-18
JP2559617B2 (en) 1996-12-04
DE3909669A1 (en) 1989-10-05
GB8906751D0 (en) 1989-05-10
DE3909669C2 (en) 1992-06-04

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20080323