SG10201510015PA - Improvements in coating technology - Google Patents

Improvements in coating technology

Info

Publication number
SG10201510015PA
SG10201510015PA SG10201510015PA SG10201510015PA SG10201510015PA SG 10201510015P A SG10201510015P A SG 10201510015PA SG 10201510015P A SG10201510015P A SG 10201510015PA SG 10201510015P A SG10201510015P A SG 10201510015PA SG 10201510015P A SG10201510015P A SG 10201510015PA
Authority
SG
Singapore
Prior art keywords
coating technology
coating
technology
Prior art date
Application number
SG10201510015PA
Inventor
Laura Ashfield
Allan Rein Berzins
Alan Boardman
Stephen Geoffrey Warren
Original Assignee
Johnson Matthey Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Plc filed Critical Johnson Matthey Plc
Publication of SG10201510015PA publication Critical patent/SG10201510015PA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/567Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
SG10201510015PA 2011-01-12 2012-01-12 Improvements in coating technology SG10201510015PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB1100447.0A GB201100447D0 (en) 2011-01-12 2011-01-12 Improvements in coating technology
US201161437281P 2011-01-28 2011-01-28

Publications (1)

Publication Number Publication Date
SG10201510015PA true SG10201510015PA (en) 2016-01-28

Family

ID=43664099

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201510015PA SG10201510015PA (en) 2011-01-12 2012-01-12 Improvements in coating technology
SG2013051248A SG191820A1 (en) 2011-01-12 2012-01-12 Improvements in coating technology

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2013051248A SG191820A1 (en) 2011-01-12 2012-01-12 Improvements in coating technology

Country Status (8)

Country Link
US (1) US20130334056A1 (en)
EP (1) EP2663670A2 (en)
CN (1) CN103492618A (en)
BR (1) BR112013017516A2 (en)
GB (1) GB201100447D0 (en)
MX (1) MX2013008146A (en)
SG (2) SG10201510015PA (en)
WO (1) WO2012095667A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104152953A (en) * 2014-08-29 2014-11-19 昆明贵金属研究所 Main salt for phosphoric acid tank electroplating platinum and synthetic method thereof
JP6620103B2 (en) * 2014-09-04 2019-12-11 日本高純度化学株式会社 Palladium plating solution and palladium film obtained using the same
CN105386096A (en) * 2015-09-21 2016-03-09 无锡清杨机械制造有限公司 Alkaline plating Pt electroplating bath and electroplating method thereof
CN105154931A (en) * 2015-09-21 2015-12-16 无锡清杨机械制造有限公司 Platinum electroplating solution comprising dihydrogen dinitrosulfatoplatinate and electroplating method adopting platinum electroplating solution
CN105132964A (en) * 2015-09-21 2015-12-09 无锡清杨机械制造有限公司 Platinum electroplating solution for phosphate system and electroplating method adopting platinum electroplating solution
CN106435666B (en) * 2016-11-22 2018-12-18 中国科学院金属研究所 A method of high-temperature alloy surface deposition layer is prepared using neutral platinum plating solution
CN107235479B (en) * 2017-05-19 2019-08-09 王晓波 The synthetic method of four ammino platinum of hydrogen phosphate
US10612149B1 (en) * 2019-09-05 2020-04-07 Chow Sang Sang Jewellery Company Limited Platinum electrodeposition bath and uses thereof
GB202020071D0 (en) 2020-12-18 2021-02-03 Johnson Matthey Plc Electroplating solutions
CN113423194B (en) * 2021-04-27 2023-05-23 厦门理工学院 Blind hole filling method for roll-to-roll copper foil
CN114182315B (en) * 2022-02-14 2022-05-17 深圳市顺信精细化工有限公司 Corrosion-resistant combined electroplated layer and electroplating method
CN114411215B (en) * 2022-03-15 2023-12-05 深圳市顺信精细化工有限公司 Platinum electroplating solution and electroplating method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1217170B (en) * 1962-09-05 1966-05-18 Dehydag Gmbh Galvanic nickel baths
GB1431548A (en) * 1972-09-21 1976-04-07 Engelhard Ind Ltd Electrodeposition of plantinum
US4009087A (en) * 1974-11-21 1977-02-22 M&T Chemicals Inc. Electrodeposition of copper
US4038161A (en) * 1976-03-05 1977-07-26 R. O. Hull & Company, Inc. Acid copper plating and additive composition therefor
US4121982A (en) * 1978-02-03 1978-10-24 American Chemical & Refining Company Incorporated Gold alloy plating bath and method
US4234500A (en) * 1979-03-07 1980-11-18 Engelhard Minerals & Chemicals Corporation Ethylenediamine platinum(II) and 1,2-diamino-cyclohexane platinum(II) pyrophosphate complexes
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
GB8821005D0 (en) 1988-09-07 1988-10-05 Johnson Matthey Plc Improvements in plating
NL9002866A (en) * 1990-12-24 1992-07-16 Stork Screens Bv METHOD FOR FORMING A LOW INTERNAL STRESS Sieve MATERIAL AND SO THEREFORE OBTAINED Sieve MATERIAL.
JP2001073182A (en) * 1999-07-15 2001-03-21 Boc Group Inc:The Improved acidic copper electroplating solution
JP4392640B2 (en) * 2000-10-11 2010-01-06 石原薬品株式会社 Non-cyanide gold-tin alloy plating bath
KR100363011B1 (en) * 2002-03-28 2002-11-30 Hanwha Chemical Corp Electrolyte composition for electrolysis of brine and electrolysis method of brine using the same
DE102008050135B4 (en) * 2008-10-04 2010-08-05 Umicore Galvanotechnik Gmbh Process for depositing platinum rhodium layers with improved brightness

Also Published As

Publication number Publication date
CN103492618A (en) 2014-01-01
GB201100447D0 (en) 2011-02-23
WO2012095667A3 (en) 2013-10-03
WO2012095667A2 (en) 2012-07-19
BR112013017516A2 (en) 2024-01-23
MX2013008146A (en) 2013-12-16
EP2663670A2 (en) 2013-11-20
US20130334056A1 (en) 2013-12-19
SG191820A1 (en) 2013-08-30

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