GB1515361A - Metal finishing of metallic foils by electrodeposition - Google Patents

Metal finishing of metallic foils by electrodeposition

Info

Publication number
GB1515361A
GB1515361A GB3276/75A GB327675A GB1515361A GB 1515361 A GB1515361 A GB 1515361A GB 3276/75 A GB3276/75 A GB 3276/75A GB 327675 A GB327675 A GB 327675A GB 1515361 A GB1515361 A GB 1515361A
Authority
GB
United Kingdom
Prior art keywords
electro
nodular
layer
electrodeposition
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3276/75A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ELECTROFOILS Ltd
Original Assignee
ELECTROFOILS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ELECTROFOILS Ltd filed Critical ELECTROFOILS Ltd
Priority to GB3276/75A priority Critical patent/GB1515361A/en
Publication of GB1515361A publication Critical patent/GB1515361A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Abstract

1515361 Multi-layer electro-plating ELECTROFOILS Ltd 9 July 1975 [24 Jan 1975] 3276/75 Heading C7B A metallic foil carries a nodular electro-deposited metal layer bearing an electro-deposited encapsulating pyrophosphate Cu layer, this double layer sequence being repeated at least once, with an optional outer electro-deposited metal layer over the whole. The foil may be Al or Cu (rolled or electro-formed), and the nodular and outer metals a Cu/Cu oxide alloy with Bi, Te and/or Se (from a sulphate bath) or a Zn/Bi alloy. Bi and/or Te may be present in amount at least 20 mg/m<SP>2</SP> while for Se the amount is 2mg/m<SP>2</SP>. An anode of Pb/Sb (97/3) is useful in the nodular deposition. The product may be used in printed circuit boards.
GB3276/75A 1975-07-09 1975-07-09 Metal finishing of metallic foils by electrodeposition Expired GB1515361A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3276/75A GB1515361A (en) 1975-07-09 1975-07-09 Metal finishing of metallic foils by electrodeposition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3276/75A GB1515361A (en) 1975-07-09 1975-07-09 Metal finishing of metallic foils by electrodeposition

Publications (1)

Publication Number Publication Date
GB1515361A true GB1515361A (en) 1978-06-21

Family

ID=9755283

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3276/75A Expired GB1515361A (en) 1975-07-09 1975-07-09 Metal finishing of metallic foils by electrodeposition

Country Status (1)

Country Link
GB (1) GB1515361A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4468293A (en) * 1982-03-05 1984-08-28 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US4515671A (en) * 1983-01-24 1985-05-07 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US4532014A (en) * 1984-11-13 1985-07-30 Olin Corporation Laser alignment system
US4549950A (en) * 1984-11-13 1985-10-29 Olin Corporation Systems for producing electroplated and/or treated metal foil
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
US4552627A (en) * 1984-11-13 1985-11-12 Olin Corporation Preparation for improving the adhesion properties of metal foils
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
GB2185757A (en) * 1986-01-27 1987-07-29 John Edwin Thorpe Dendritic surface treatment of metal layers
EP0245305A1 (en) * 1985-10-24 1987-11-19 Enthone, Incorporated Copper oxide treatment in printed circuit board
EP1175132A1 (en) * 1999-12-15 2002-01-23 Mitsui Mining & Smelting Co., Ltd. Surface-treated copper foil and method for manufacturing the surface-treated copper foil
WO2007045688A1 (en) * 2005-10-20 2007-04-26 Wolf-Dieter Franz Production of silky matter of metal surfaces

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4468293A (en) * 1982-03-05 1984-08-28 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US4515671A (en) * 1983-01-24 1985-05-07 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US4532014A (en) * 1984-11-13 1985-07-30 Olin Corporation Laser alignment system
US4549950A (en) * 1984-11-13 1985-10-29 Olin Corporation Systems for producing electroplated and/or treated metal foil
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
US4552627A (en) * 1984-11-13 1985-11-12 Olin Corporation Preparation for improving the adhesion properties of metal foils
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
EP0245305A1 (en) * 1985-10-24 1987-11-19 Enthone, Incorporated Copper oxide treatment in printed circuit board
EP0245305A4 (en) * 1985-10-24 1989-05-23 Enthone Copper oxide treatment in printed circuit board.
GB2185757A (en) * 1986-01-27 1987-07-29 John Edwin Thorpe Dendritic surface treatment of metal layers
GB2185757B (en) * 1986-01-27 1989-11-01 John Edwin Thorpe Dendritic surface treatment of copper layers
EP1175132A1 (en) * 1999-12-15 2002-01-23 Mitsui Mining & Smelting Co., Ltd. Surface-treated copper foil and method for manufacturing the surface-treated copper foil
EP1175132A4 (en) * 1999-12-15 2006-01-18 Mitsui Mining & Smelting Co Surface-treated copper foil and method for manufacturing the surface-treated copper foil
WO2007045688A1 (en) * 2005-10-20 2007-04-26 Wolf-Dieter Franz Production of silky matter of metal surfaces
EP1780311A1 (en) * 2005-10-20 2007-05-02 Wolf-Dieter Franz Manufacturing process for satin-matt surface
US8105473B2 (en) 2005-10-20 2012-01-31 Wolf-Dieter Franz Production of satin metal surfaces

Similar Documents

Publication Publication Date Title
IE791383L (en) Copper foil with electro deposited metal coatings.
JPH06169169A (en) Printed circuit copper foil and manufacture thereof
GB1349696A (en)
GB1515361A (en) Metal finishing of metallic foils by electrodeposition
JPH08236930A (en) Copper foil for printed circuit and its manufacture
GB1462001A (en) Method of electrolytically nodularizing a metal surface
DE3262272D1 (en) Process for the galvanic deposit of a zinc-nickel-alloy layer on a metal object, in particular on steel strip
JPS5741389A (en) Cathode for electrolyzing aqueous alkali metal halide and its manufacture
GB1289511A (en)
JPS57140891A (en) Pretreating solution for silver plating
JPS6396299A (en) Insoluble anode made of lead alloy
JPS57140882A (en) Bright electroplating method for tin or solder
JPS56150199A (en) Preparation of tin plated steel plate with excellent corrosion resistance of processed part
JPS56166384A (en) Anode coated with lead dioxide
GB1433850A (en) Packaging material
JPS57114695A (en) Production of zinc plated steeel plate of superior blackening resistance and intergranular corrosion resistance
JP2529557B2 (en) Lead alloy insoluble anode
JPS57177984A (en) Cathode for electrolysis
ZA793517B (en) Insoluble electrodes incorporating a precious metal alloy layer and baths and bath constituents for the electrodeposition of precious metal alloys
GB1263351A (en) Process for preparing the surface of aluminium
JPS5798698A (en) Coloring method for aluminum or aluminum alloy
Dahms Method for Galvanic Deposition of Copper
JPS52148539A (en) Electrolytic plating
GB1531454A (en) Electroplated copper foil
Florian Process for Electroplating a Zinc--Nickel Alloy on a Steel Strip

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee