GB1433850A - Packaging material - Google Patents
Packaging materialInfo
- Publication number
- GB1433850A GB1433850A GB3874674A GB3874674A GB1433850A GB 1433850 A GB1433850 A GB 1433850A GB 3874674 A GB3874674 A GB 3874674A GB 3874674 A GB3874674 A GB 3874674A GB 1433850 A GB1433850 A GB 1433850A
- Authority
- GB
- United Kingdom
- Prior art keywords
- magnetic
- coating
- plating
- ferromagnetic
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
Abstract
1433850 Electro-plating magnetic and non- magnetic coatings FUJI PHOTO FILM CO Ltd 4 Sept 1974 [4 Sept 1973] 38746/74 Heading C7B A non-magnetic and a ferromagnetic metallic coating are electro-plated on a non-magnetic metallic substrate, e.g. Cu, Zn, or Sn, by immersing it in an aqueous plating bath containing at least one salt of one or more ferromagnetic metals, e.g. Ni or Co,optionally with a compound of Cr and/or P, passing an electric current having a density of 0À3 to 1À5 A/dm<SP>2</SP> between the substrate and a counter electrode in the bath to cause a non- magnetic coating to be deposited, and increasing the current to a density of 0À8 to 10 A/dm<SP>2</SP> to cause a ferromagnetic coating to be deposited from the same bath. The sizes of the deposited particles are preferably 500Š to 0À1 micron in the ferromagnetic coating and 100Š to 0À1 micron in the non-magnetic coating. Preferably the bath may contain Ni(BF 4 ) or <SP>2</SP>NiSO 4 and NiCl 2 (or the corresponding Co salt), with H 3 BO 3 and NaH 2 PO 2 ; one or more compounds of Cu, Zn, Au or Sn, which selectively deposit in the non-magnetic coating, may also be present. The substrate may be provided with a subbing layer of Cu, Zn or Sn plated from corresponding sulphate baths. For Ni plating, Ni anodes may be used; for Co plating, a Pt- or Rhplated Cu, Sn or Zn anodes may be used.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9964173A JPS5713637B2 (en) | 1973-09-04 | 1973-09-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1433850A true GB1433850A (en) | 1976-04-28 |
Family
ID=14252671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3874674A Expired GB1433850A (en) | 1973-09-04 | 1974-09-04 | Packaging material |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS5713637B2 (en) |
DE (1) | DE2442300A1 (en) |
GB (1) | GB1433850A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4652348A (en) * | 1985-10-06 | 1987-03-24 | Technion Research & Development Foundation Ltd. | Method for the production of alloys possessing high elastic modulus and improved magnetic properties by electrodeposition |
US4869971A (en) * | 1986-05-22 | 1989-09-26 | Nee Chin Cheng | Multilayer pulsed-current electrodeposition process |
WO2002055762A2 (en) * | 2000-11-03 | 2002-07-18 | Shipley Company, L.L.C. | Electrochemical co-deposition of metals for electronic device manufacture |
EP1925696A3 (en) * | 2006-11-01 | 2010-02-24 | KOREA University, Industry & Academy Collaboration Foundation of Korea University, Industry & Academy Collaboration Foundation | Iron-gold barcode nanowire and manufacturing method thereof |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4699695A (en) * | 1984-07-20 | 1987-10-13 | Rieger Franz Metallveredelung | Nickel plating bath |
JPH023423U (en) * | 1988-06-20 | 1990-01-10 |
-
1973
- 1973-09-04 JP JP9964173A patent/JPS5713637B2/ja not_active Expired
-
1974
- 1974-09-04 GB GB3874674A patent/GB1433850A/en not_active Expired
- 1974-09-04 DE DE2442300A patent/DE2442300A1/en not_active Withdrawn
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4652348A (en) * | 1985-10-06 | 1987-03-24 | Technion Research & Development Foundation Ltd. | Method for the production of alloys possessing high elastic modulus and improved magnetic properties by electrodeposition |
US4869971A (en) * | 1986-05-22 | 1989-09-26 | Nee Chin Cheng | Multilayer pulsed-current electrodeposition process |
WO2002055762A2 (en) * | 2000-11-03 | 2002-07-18 | Shipley Company, L.L.C. | Electrochemical co-deposition of metals for electronic device manufacture |
WO2002055762A3 (en) * | 2000-11-03 | 2003-07-17 | Shipley Co Llc | Electrochemical co-deposition of metals for electronic device manufacture |
EP1925696A3 (en) * | 2006-11-01 | 2010-02-24 | KOREA University, Industry & Academy Collaboration Foundation of Korea University, Industry & Academy Collaboration Foundation | Iron-gold barcode nanowire and manufacturing method thereof |
US9175412B2 (en) | 2006-11-01 | 2015-11-03 | Korea University, Industry & Academy Collaboration Foundation Of Korea University, Industry & Academy Collaboration Foundation | Iron-gold barcode nanowire and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS5050237A (en) | 1975-05-06 |
JPS5713637B2 (en) | 1982-03-18 |
DE2442300A1 (en) | 1975-03-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |