GB1503136A - Semiconductor device assembly - Google Patents
Semiconductor device assemblyInfo
- Publication number
- GB1503136A GB1503136A GB3189076A GB3189076A GB1503136A GB 1503136 A GB1503136 A GB 1503136A GB 3189076 A GB3189076 A GB 3189076A GB 3189076 A GB3189076 A GB 3189076A GB 1503136 A GB1503136 A GB 1503136A
- Authority
- GB
- United Kingdom
- Prior art keywords
- glass
- support
- window
- weight
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000011521 glass Substances 0.000 abstract 4
- 239000000919 ceramic Substances 0.000 abstract 2
- 229910004298 SiO 2 Inorganic materials 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 238000005816 glass manufacturing process Methods 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910000833 kovar Inorganic materials 0.000 abstract 1
- ZPPSOOVFTBGHBI-UHFFFAOYSA-N lead(2+);oxido(oxo)borane Chemical compound [Pb+2].[O-]B=O.[O-]B=O ZPPSOOVFTBGHBI-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
- 239000000565 sealant Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000005361 soda-lime glass Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/078—Glass compositions containing silica with 40% to 90% silica, by weight containing an oxide of a divalent metal, e.g. an oxide of zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/18—Circuits for erasing optically
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Glass Compositions (AREA)
- Read Only Memory (AREA)
- Non-Volatile Memory (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
1503136 Semiconductor device assembly OWENS-ILLINOIS Inc 30 July 1976 [1 Aug 1975] 31890/76 Heading H1K A semiconductor device assembly comprises a member element 11 positioned in a cavity 10a in a ceramic support 10 carrying electrical addressing circuitry connected to the element, and a soda-lime-silica glass window for U.V. radiation sealed to the support and overlapping the said cavity, said glass comprising 65-75% by weight of SiO 2 , 5-15% by weight of CaO, and 5-15% by weight of Na 2 O. The glass further contains up to about 20% of glass making oxides e.g. of Al, B, Mg, Zn which do not materially increase U.V. absorption and composition of glass is adjusted so that its coefficient of thermal expansion using between 65-90 x 10<SP>-7</SP> 1‹ C. (0-300‹ C.) approximates that of the ceramic support, e.g. of alumina. U.V. transmission or at least about 30% at 2500Š by the window permits the erasure of a programme stored in the element. A sealant 15 applied to the window and/or the support, e.g. by spraying, screenprinting, is either a lead-borate solder glass or is an epoxy resin. An optional kovar, gold or silver gasket 14 may be in the form of a trim layer deposited on to the support or the window.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US60168275A | 1975-08-01 | 1975-08-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1503136A true GB1503136A (en) | 1978-03-08 |
Family
ID=24408384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3189076A Expired GB1503136A (en) | 1975-08-01 | 1976-07-30 | Semiconductor device assembly |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5219077A (en) |
| DE (1) | DE2633086B2 (en) |
| GB (1) | GB1503136A (en) |
| NL (1) | NL7608475A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2174538A (en) * | 1985-04-24 | 1986-11-05 | Stanley Bracey | Semiconductor package |
| EP1391934A2 (en) * | 2002-08-23 | 2004-02-25 | Z/I Imaging GmbH | Sensor module |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52150971A (en) * | 1976-06-11 | 1977-12-15 | Hitachi Ltd | Semiconductor device for memory |
| DE2936615C2 (en) * | 1979-09-11 | 1985-03-28 | Brown, Boveri & Cie Ag, 6800 Mannheim | Protective device |
| JPS5732656A (en) * | 1980-08-05 | 1982-02-22 | Fujitsu Ltd | Semiconductor device |
| DE3041596C2 (en) * | 1980-09-22 | 1983-12-15 | Remo Dipl.-El.-Ing. Balzers Vogelsang | Plug-in unit with plug-in card and multiple plug |
| JPS58129642U (en) * | 1982-02-26 | 1983-09-02 | 鳴海製陶株式会社 | Ceramic package with window |
| JPS58159697U (en) * | 1982-04-15 | 1983-10-24 | 富士通株式会社 | EPROM package |
| WO1984001057A1 (en) * | 1982-09-09 | 1984-03-15 | Plessey Overseas | Optical device |
| FR2566962B1 (en) * | 1984-06-29 | 1987-03-06 | Thomson Csf | INTEGRATED PHOTOSENSITIVE CIRCUIT COMPRISING A TRANSPARENT PLATE PASTED ON ITS PHOTOSENSITIVE AREA |
| JPS61172352A (en) * | 1985-01-26 | 1986-08-04 | Kyocera Corp | Semiconductor package |
| AU7219898A (en) * | 1997-04-29 | 1998-11-24 | Pilkingon Plc | Glass compositions used in plasma displays |
-
1976
- 1976-07-22 DE DE19762633086 patent/DE2633086B2/en not_active Withdrawn
- 1976-07-30 GB GB3189076A patent/GB1503136A/en not_active Expired
- 1976-07-30 NL NL7608475A patent/NL7608475A/en not_active Application Discontinuation
- 1976-07-31 JP JP9087676A patent/JPS5219077A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2174538A (en) * | 1985-04-24 | 1986-11-05 | Stanley Bracey | Semiconductor package |
| EP1391934A2 (en) * | 2002-08-23 | 2004-02-25 | Z/I Imaging GmbH | Sensor module |
| EP1391934A3 (en) * | 2002-08-23 | 2006-06-07 | Z/I Imaging Ltd. | Sensor module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5219077A (en) | 1977-01-14 |
| DE2633086A1 (en) | 1977-02-10 |
| NL7608475A (en) | 1977-02-03 |
| DE2633086B2 (en) | 1977-12-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |