GB1316030A - Etchant for chemical dissolution of copper - Google Patents

Etchant for chemical dissolution of copper

Info

Publication number
GB1316030A
GB1316030A GB5939371A GB5939371A GB1316030A GB 1316030 A GB1316030 A GB 1316030A GB 5939371 A GB5939371 A GB 5939371A GB 5939371 A GB5939371 A GB 5939371A GB 1316030 A GB1316030 A GB 1316030A
Authority
GB
United Kingdom
Prior art keywords
copper
persulphate
etching
dec
ammonium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5939371A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of GB1316030A publication Critical patent/GB1316030A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

1316030 Etching MITSUBISHI GAS CHEMICAL CO Inc 21 Dec 1971 [26 Dec 1970] 59393/71 Heading B6J A composition suitable for etching copper comprises an aqueous solution containing 5-40 grams/100 c.c. of a persulphate, e.g. ammonium and/or sodium persulphite, and ammonia in a molar concentration of from 1 to 10 times the molar concentration of the persulphate. Ammonium, sodium or copper sulphate may be added to the solution together with a polar, water soluble, organic stabilizer for the persulphate selected from mono-, di- or poly-hydric alcohols, aldehydes, ketones, carbonic acids, esters, ethers, sulphoxides, amines, sulphonic acids and nonionic, cationic and anionic surface active agents. A printed circuit may be produced by masking a copper foil covered plate with solder and then etching away the exposed copper using the above solution.
GB5939371A 1970-12-26 1971-12-21 Etchant for chemical dissolution of copper Expired GB1316030A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11900570A JPS5010698B1 (en) 1970-12-26 1970-12-26

Publications (1)

Publication Number Publication Date
GB1316030A true GB1316030A (en) 1973-05-09

Family

ID=14750622

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5939371A Expired GB1316030A (en) 1970-12-26 1971-12-21 Etchant for chemical dissolution of copper

Country Status (3)

Country Link
JP (1) JPS5010698B1 (en)
DE (1) DE2163985A1 (en)
GB (1) GB1316030A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2823068A1 (en) * 1977-05-27 1978-12-14 Alfachimici Spa ACID SOLUTION FOR THE SELECTIVE ATTACK OF COPPER
US5855805A (en) * 1996-08-08 1999-01-05 Fmc Corporation Microetching and cleaning of printed wiring boards
WO2006124693A2 (en) * 2005-05-16 2006-11-23 3M Innovative Properties Company Method and composition for improving adhesion of organic polymer coatings with copper surface
CN115613032A (en) * 2022-10-11 2023-01-17 苏州华星光电技术有限公司 Etching solution
CN117328066A (en) * 2023-10-07 2024-01-02 江苏贺鸿电子有限公司 Coarsening microetching agent for circuit board and preparation method thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS526853B2 (en) * 1972-12-22 1977-02-25
DE4024909A1 (en) * 1990-08-06 1992-02-13 Kernforschungsz Karlsruhe Selective alkaline etching soln. for copper and copper alloys - useful in brasses and bronzes, even when lead is present, completely removes copper to exclusion of nickel
KR102472714B1 (en) * 2017-07-14 2022-11-29 멜텍스 가부시키가이샤 copper etchant

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2823068A1 (en) * 1977-05-27 1978-12-14 Alfachimici Spa ACID SOLUTION FOR THE SELECTIVE ATTACK OF COPPER
US5855805A (en) * 1996-08-08 1999-01-05 Fmc Corporation Microetching and cleaning of printed wiring boards
WO2006124693A2 (en) * 2005-05-16 2006-11-23 3M Innovative Properties Company Method and composition for improving adhesion of organic polymer coatings with copper surface
WO2006124693A3 (en) * 2005-05-16 2006-12-28 3M Innovative Properties Co Method and composition for improving adhesion of organic polymer coatings with copper surface
CN1865366B (en) * 2005-05-16 2010-12-15 3M创新有限公司 Method and composition for improving adhesion of organic polymer coating to copper surface
CN115613032A (en) * 2022-10-11 2023-01-17 苏州华星光电技术有限公司 Etching solution
CN117328066A (en) * 2023-10-07 2024-01-02 江苏贺鸿电子有限公司 Coarsening microetching agent for circuit board and preparation method thereof
CN117328066B (en) * 2023-10-07 2024-03-22 江苏贺鸿电子有限公司 Coarsening microetching agent for circuit board and preparation method thereof

Also Published As

Publication number Publication date
JPS5010698B1 (en) 1975-04-23
DE2163985A1 (en) 1972-07-13

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee