JPS5010698B1 - - Google Patents
Info
- Publication number
- JPS5010698B1 JPS5010698B1 JP11900570A JP11900570A JPS5010698B1 JP S5010698 B1 JPS5010698 B1 JP S5010698B1 JP 11900570 A JP11900570 A JP 11900570A JP 11900570 A JP11900570 A JP 11900570A JP S5010698 B1 JPS5010698 B1 JP S5010698B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11900570A JPS5010698B1 (en) | 1970-12-26 | 1970-12-26 | |
GB5939371A GB1316030A (en) | 1970-12-26 | 1971-12-21 | Etchant for chemical dissolution of copper |
DE19712163985 DE2163985A1 (en) | 1970-12-26 | 1971-12-22 | Process for the chemical dissolution of copper |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11900570A JPS5010698B1 (en) | 1970-12-26 | 1970-12-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5010698B1 true JPS5010698B1 (en) | 1975-04-23 |
Family
ID=14750622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11900570A Pending JPS5010698B1 (en) | 1970-12-26 | 1970-12-26 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS5010698B1 (en) |
DE (1) | DE2163985A1 (en) |
GB (1) | GB1316030A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019013160A1 (en) * | 2017-07-14 | 2019-01-17 | メルテックス株式会社 | Copper etching liquid |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS526853B2 (en) * | 1972-12-22 | 1977-02-25 | ||
IT1083401B (en) * | 1977-05-27 | 1985-05-21 | Alfachimici Spa | ACID SOLUTION FOR SELECTIVE COPPER ATTACK |
DE4024909A1 (en) * | 1990-08-06 | 1992-02-13 | Kernforschungsz Karlsruhe | Selective alkaline etching soln. for copper and copper alloys - useful in brasses and bronzes, even when lead is present, completely removes copper to exclusion of nickel |
US5855805A (en) * | 1996-08-08 | 1999-01-05 | Fmc Corporation | Microetching and cleaning of printed wiring boards |
CN1865366B (en) * | 2005-05-16 | 2010-12-15 | 3M创新有限公司 | Method and composition for improving adhesion of organic polymer coating to copper surface |
CN115613032A (en) * | 2022-10-11 | 2023-01-17 | 苏州华星光电技术有限公司 | Etching solution |
CN117328066B (en) * | 2023-10-07 | 2024-03-22 | 江苏贺鸿电子有限公司 | Coarsening microetching agent for circuit board and preparation method thereof |
-
1970
- 1970-12-26 JP JP11900570A patent/JPS5010698B1/ja active Pending
-
1971
- 1971-12-21 GB GB5939371A patent/GB1316030A/en not_active Expired
- 1971-12-22 DE DE19712163985 patent/DE2163985A1/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019013160A1 (en) * | 2017-07-14 | 2019-01-17 | メルテックス株式会社 | Copper etching liquid |
Also Published As
Publication number | Publication date |
---|---|
DE2163985A1 (en) | 1972-07-13 |
GB1316030A (en) | 1973-05-09 |