GB1213726A - Improvements relating to electrical circuit assemblies - Google Patents

Improvements relating to electrical circuit assemblies

Info

Publication number
GB1213726A
GB1213726A GB4093/68A GB409368A GB1213726A GB 1213726 A GB1213726 A GB 1213726A GB 4093/68 A GB4093/68 A GB 4093/68A GB 409368 A GB409368 A GB 409368A GB 1213726 A GB1213726 A GB 1213726A
Authority
GB
United Kingdom
Prior art keywords
conductors
plate
assembly
transmission lines
pillars
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4093/68A
Inventor
Ronald Naylor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti PLC filed Critical Ferranti PLC
Priority to GB4093/68A priority Critical patent/GB1213726A/en
Priority to US793444*A priority patent/US3585455A/en
Publication of GB1213726A publication Critical patent/GB1213726A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

1,213,726. Circuit assemblies. FERRANTI Ltd. 23 Jan., 1969 [26 Jan., 1968], No.4093/88. Heading H1R. In a circuit assembly 10 comprising a plurality of electrical devices 12 mounted on a substrate 11 and interconnected by signal conductors 13 a common metal conductive member 16 is arranged parallel to and spaced from the conductors 13 so as to form matched signal transmission lines. In the -embodiment shown four silicon wafers 12 are mounted on ceramic substrate 11, conductors 13 being of gold underlaid with a nickel chromium alloy, by gold pillars 15. Metal conductive plate member 16 is provided with mounting pillars 17 at positions where the electrical interconnections between plate 16 and signal conductors 13 are required and to form the transmission lines the plate 16 is positioned over the substrate and the pillars 17 bonded to the conductors 13 or pads 18. Portion 19 is connected to earth. The assembly is completed by potting, the potting material permeating between the plate 16 and conductors 13 to form a dielectric. The externally-extending leads 14 of the assembly are also in the form of matched transmission lines since they co-operate with portion 19 of plate 16 or with leads 22. Instead of using potting compound to form the dielectric the assembly may be in an hermetically sealed container, Fig. 4 (not shown), filled with a rarefied gas.
GB4093/68A 1968-01-26 1968-01-26 Improvements relating to electrical circuit assemblies Expired GB1213726A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB4093/68A GB1213726A (en) 1968-01-26 1968-01-26 Improvements relating to electrical circuit assemblies
US793444*A US3585455A (en) 1968-01-26 1969-01-23 Circuit assemblies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4093/68A GB1213726A (en) 1968-01-26 1968-01-26 Improvements relating to electrical circuit assemblies

Publications (1)

Publication Number Publication Date
GB1213726A true GB1213726A (en) 1970-11-25

Family

ID=9770613

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4093/68A Expired GB1213726A (en) 1968-01-26 1968-01-26 Improvements relating to electrical circuit assemblies

Country Status (2)

Country Link
US (1) US3585455A (en)
GB (1) GB1213726A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2484171A1 (en) * 1980-06-04 1981-12-11 Commissariat Energie Atomique ULTRA-FAST HYBRID LINEAR AMPLIFIER
FR2507409A1 (en) * 1981-06-03 1982-12-10 Radiotechnique Compelec Optimised microwave FET amplifier - has several passive microstrip components on alumina plate connected to FET electrodes through plated holes
FR2516702A1 (en) * 1981-11-18 1983-05-20 Dassault Electronique Pressure resistant case for hybrid circuit - has small alumina columns forming brace between cover and substrate to withstand pressures up to 10 Bars
US4959752A (en) * 1988-10-24 1990-09-25 Digital Equipment Corporation Electronic module RFI/EMI shielding

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592364B2 (en) * 1979-04-27 1984-01-18 富士通株式会社 collective resistance module
US4475145A (en) * 1982-07-12 1984-10-02 Rockwell International Corporation Circuit board heatsink assembly and technique
US4459639A (en) * 1982-07-12 1984-07-10 Rockwell International Corporation Circuit board heatsink clamping assembly and technique
US4667267A (en) * 1985-01-22 1987-05-19 Rogers Corporation Decoupling capacitor for pin grid array package
DE3521572A1 (en) * 1985-06-15 1986-12-18 Brown, Boveri & Cie Ag, 6800 Mannheim PERFORMANCE SEMICONDUCTOR MODULE WITH CERAMIC SUBSTRATE
EP0206771B1 (en) * 1985-06-20 1992-03-11 Kabushiki Kaisha Toshiba Packaged semiconductor device
US4855868A (en) * 1987-01-20 1989-08-08 Harding Ade Yemi S K Preformed packaging arrangement for energy dissipating devices
US4829403A (en) * 1987-01-20 1989-05-09 Harding Ade Yemi S K Packaging arrangement for energy dissipating devices
US4831495A (en) * 1987-07-20 1989-05-16 Harding Ade Yemi S K Unitized packaging arrangement for an energy dissipating device
US5006820A (en) * 1989-07-03 1991-04-09 Motorola, Inc. Low reflection input configuration for integrated circuit packages
JPH088131B2 (en) * 1989-08-25 1996-01-29 矢崎総業株式会社 Filter connector with flexible terminal
US5031069A (en) * 1989-12-28 1991-07-09 Sundstrand Corporation Integration of ceramic capacitor
DE4031203A1 (en) * 1990-10-04 1992-04-09 Bosch Gmbh Robert THICK LAYER HYBRID ARRANGEMENT WITH EXTERNAL CONTACTS
US5306874A (en) * 1991-07-12 1994-04-26 W.I.T. Inc. Electrical interconnect and method of its manufacture
US5311059A (en) * 1992-01-24 1994-05-10 Motorola, Inc. Backplane grounding for flip-chip integrated circuit
DE4212948A1 (en) * 1992-04-18 1993-10-21 Telefunken Microelectron Semiconductor module, in particular remote control receiver module
DE4340847A1 (en) * 1993-11-26 1995-06-01 Optosys Gmbh Berlin Chip module with chip on substrate material
US5774342A (en) * 1996-09-26 1998-06-30 Delco Electronics Corporation Electronic circuit with integrated terminal pins
US5763900A (en) * 1996-12-05 1998-06-09 Taiwan Liton Electronic Co. Ltd. Infrared transceiver package
US6373126B1 (en) * 2000-04-26 2002-04-16 Advanced Micro Devices, Inc. Method for reducing IC package delamination by use of internal baffles
DE102014211524B4 (en) 2014-06-17 2022-10-20 Robert Bosch Gmbh Electronic module with a device for dissipating heat generated by a semiconductor device arranged in a plastic housing and method for producing an electronic module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3211922A (en) * 1965-10-12 Strip transmission line heat radiator
NL275288A (en) * 1961-02-28
US3189847A (en) * 1961-05-29 1965-06-15 Ibm D. c. power distribution system
US3418533A (en) * 1965-12-24 1968-12-24 Olivetti & Co Spa Modular structure for electronic integrated circuits
US3390308A (en) * 1966-03-31 1968-06-25 Itt Multiple chip integrated circuit assembly
US3365620A (en) * 1966-06-13 1968-01-23 Ibm Circuit package with improved modular assembly and cooling apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2484171A1 (en) * 1980-06-04 1981-12-11 Commissariat Energie Atomique ULTRA-FAST HYBRID LINEAR AMPLIFIER
EP0042319A1 (en) * 1980-06-04 1981-12-23 COMMISSARIAT A L'ENERGIE ATOMIQUE Etablissement de Caractère Scientifique Technique et Industriel Ultrafast linear hybrid amplifier
FR2507409A1 (en) * 1981-06-03 1982-12-10 Radiotechnique Compelec Optimised microwave FET amplifier - has several passive microstrip components on alumina plate connected to FET electrodes through plated holes
FR2516702A1 (en) * 1981-11-18 1983-05-20 Dassault Electronique Pressure resistant case for hybrid circuit - has small alumina columns forming brace between cover and substrate to withstand pressures up to 10 Bars
US4959752A (en) * 1988-10-24 1990-09-25 Digital Equipment Corporation Electronic module RFI/EMI shielding

Also Published As

Publication number Publication date
US3585455A (en) 1971-06-15

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee