GB1159456A - Improvements in and relating to Methods and Apparatus for Testing Bonded Joints - Google Patents
Improvements in and relating to Methods and Apparatus for Testing Bonded JointsInfo
- Publication number
- GB1159456A GB1159456A GB50092/66A GB5009266A GB1159456A GB 1159456 A GB1159456 A GB 1159456A GB 50092/66 A GB50092/66 A GB 50092/66A GB 5009266 A GB5009266 A GB 5009266A GB 1159456 A GB1159456 A GB 1159456A
- Authority
- GB
- United Kingdom
- Prior art keywords
- modules
- firing
- module
- sticks
- blast
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M99/00—Subject matter not provided for in other groups of this subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/20—Investigating the presence of flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Manufacturing & Machinery (AREA)
- Testing Relating To Insulation (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
1,159,456. Testing bonded joints. INTERNATIONAL BUSINESS MACHINES CORP. Nov. 9, 1966 [Nov. 15, 1965(2); April 25, 1966], No. 50092/66. Heading G1S. An apparatus and method for testing a bonded joint between an electrical component and a substrate comprises subjecting the bonded joint to a blast of a fluid medium and monitoring the bonded joint for changes in electrical resistance during said blast. In the embodiments described the components under test are micro-miniature electronic devices attached to a printed circuit board. In one embodiment Fig. 3 the modules 411 under test are placed on firing sticks 419 which are fed sequentially between rollers 432N, 432S, 433N, 433S, 434N and 434S. While passing between the rollers the modules are subjected to a blast of air under pressure so that a weak bond can be detected. The module is placed in circuit with a source of current so that if the bond is broken the break is detected since no current will flow in the circuit or if the bond is just weakened the resistance of the circuit will be decreased. In a second embodiment Fig. 11 the modules 11 are placed on firing sticks 12 and fed along conveyors 41 at the end of which they are placed on sprockett wheel 52 which convey them to a carrier table 24. At the carrier table 24 the modules are removed from the firing sticks and placed in recesses in the table 24. As the table 24 rotates the modules are moved through various stations, at one of which the module is subjected to a blast of air from a nozzle mounted on the table 36. If the module is not faulty it is removed from the table 24 at the next station and placed on a firing stick which has been moved into place by conveyors parallel to the first conveyors and further sprocket wheels. If the module is faulty, detected as described above in connection with first embodiment it passes the next station and at the next after that it is removed from the table and placed in a disposal chute. The functions of the apparatus are controlled electrically in such a way that if a faulty module is detected, the means which removes the modules on to the firing sticks after testing is not actuated and also the firing stick is not progressed.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US50783365A | 1965-11-15 | 1965-11-15 | |
| US507848A US3413839A (en) | 1965-11-15 | 1965-11-15 | Method of and apparatus for mechanically testing the quality of bonded joints |
| US544993A US3371780A (en) | 1966-04-25 | 1966-04-25 | Apparatus for mechanically and electrically testing the quality of bonded joints |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1159456A true GB1159456A (en) | 1969-07-23 |
Family
ID=27414359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB50092/66A Expired GB1159456A (en) | 1965-11-15 | 1968-11-09 | Improvements in and relating to Methods and Apparatus for Testing Bonded Joints |
Country Status (5)
| Country | Link |
|---|---|
| BE (1) | BE689412A (en) |
| CH (1) | CH470671A (en) |
| FR (1) | FR1498864A (en) |
| GB (1) | GB1159456A (en) |
| SE (1) | SE331716B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3852665A (en) * | 1972-02-17 | 1974-12-03 | Bunker Ramo | Apparatus for testing potentiometers |
| FR2471601A1 (en) * | 1979-12-14 | 1981-06-19 | Commissariat Energie Atomique | METHOD AND DEVICE FOR NON-DESTRUCTIVE CONTROL OF STITCHES |
| US5349869A (en) * | 1993-04-05 | 1994-09-27 | General Electric Company | Welded nickel alloy double-cantilever beam crack growth sensor and method for its fabrication |
| CN111398790A (en) * | 2020-04-29 | 2020-07-10 | 苏州创瑞机电科技有限公司 | Optical chip module testing device |
-
1966
- 1966-11-02 FR FR8113A patent/FR1498864A/en not_active Expired
- 1966-11-08 BE BE689412D patent/BE689412A/xx unknown
- 1966-11-11 CH CH1629666A patent/CH470671A/en not_active IP Right Cessation
- 1966-11-15 SE SE15631/66A patent/SE331716B/xx unknown
-
1968
- 1968-11-09 GB GB50092/66A patent/GB1159456A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| BE689412A (en) | 1967-04-14 |
| SE331716B (en) | 1971-01-11 |
| CH470671A (en) | 1969-05-14 |
| DE1640492B1 (en) | 1971-02-04 |
| FR1498864A (en) | 1967-10-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |