CH470671A - Method and device for testing the soldered connections of circuit boards - Google Patents

Method and device for testing the soldered connections of circuit boards

Info

Publication number
CH470671A
CH470671A CH1629666A CH1629666A CH470671A CH 470671 A CH470671 A CH 470671A CH 1629666 A CH1629666 A CH 1629666A CH 1629666 A CH1629666 A CH 1629666A CH 470671 A CH470671 A CH 470671A
Authority
CH
Switzerland
Prior art keywords
testing
circuit boards
soldered connections
soldered
connections
Prior art date
Application number
CH1629666A
Other languages
German (de)
Inventor
Clark Kendall
Joseph Schuelke Walter
Walter Bowers Ronald
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US507848A external-priority patent/US3413839A/en
Priority claimed from US544993A external-priority patent/US3371780A/en
Application filed by Ibm filed Critical Ibm
Publication of CH470671A publication Critical patent/CH470671A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/20—Investigating the presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/52—Testing for short-circuits, leakage current or ground faults
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/54—Testing for continuity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Relating To Insulation (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CH1629666A 1965-11-15 1966-11-11 Method and device for testing the soldered connections of circuit boards CH470671A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US50783365A 1965-11-15 1965-11-15
US507848A US3413839A (en) 1965-11-15 1965-11-15 Method of and apparatus for mechanically testing the quality of bonded joints
US544993A US3371780A (en) 1966-04-25 1966-04-25 Apparatus for mechanically and electrically testing the quality of bonded joints

Publications (1)

Publication Number Publication Date
CH470671A true CH470671A (en) 1969-05-14

Family

ID=27414359

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1629666A CH470671A (en) 1965-11-15 1966-11-11 Method and device for testing the soldered connections of circuit boards

Country Status (5)

Country Link
BE (1) BE689412A (en)
CH (1) CH470671A (en)
FR (1) FR1498864A (en)
GB (1) GB1159456A (en)
SE (1) SE331716B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3852665A (en) * 1972-02-17 1974-12-03 Bunker Ramo Apparatus for testing potentiometers
FR2471601A1 (en) * 1979-12-14 1981-06-19 Commissariat Energie Atomique METHOD AND DEVICE FOR NON-DESTRUCTIVE CONTROL OF STITCHES
US5349869A (en) * 1993-04-05 1994-09-27 General Electric Company Welded nickel alloy double-cantilever beam crack growth sensor and method for its fabrication
CN111398790A (en) * 2020-04-29 2020-07-10 苏州创瑞机电科技有限公司 Optical chip module testing device

Also Published As

Publication number Publication date
BE689412A (en) 1967-04-14
SE331716B (en) 1971-01-11
DE1640492B1 (en) 1971-02-04
GB1159456A (en) 1969-07-23
FR1498864A (en) 1967-10-20

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Legal Events

Date Code Title Description
PL Patent ceased