GB1075198A - Electrical component assemblies - Google Patents
Electrical component assembliesInfo
- Publication number
- GB1075198A GB1075198A GB3180665A GB3180665A GB1075198A GB 1075198 A GB1075198 A GB 1075198A GB 3180665 A GB3180665 A GB 3180665A GB 3180665 A GB3180665 A GB 3180665A GB 1075198 A GB1075198 A GB 1075198A
- Authority
- GB
- United Kingdom
- Prior art keywords
- wires
- strip
- joined
- strips
- capacitors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000000712 assembly Effects 0.000 title abstract 2
- 238000000429 assembly Methods 0.000 title abstract 2
- 239000003990 capacitor Substances 0.000 abstract 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 abstract 4
- 238000007598 dipping method Methods 0.000 abstract 3
- 239000011810 insulating material Substances 0.000 abstract 2
- 238000012986 modification Methods 0.000 abstract 2
- 230000004048 modification Effects 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 238000005476 soldering Methods 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000002390 adhesive tape Substances 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 125000006850 spacer group Chemical group 0.000 abstract 1
- 229910052715 tantalum Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
1,075,198. Soldering. STANDARD TELEPHONES & CABLES Ltd. July 26, 1965, No. 31806/65. Heading B3R. [Also in Divisions B8 and H1] In making an assembly of a batch of electrical components, each having a body portion joined to and supported from a pair of straight lead wires, a first set of wires threaded through apertures in a strip of insulating material is joined one to a component and a second set of wires mounted on a second strip of insulating material is also joined one to a component. A length of manilla sheet is scored longitudinally with fold lines (10), (11), Fig. 2 (not shown), spaced apart by a distance related to the diameter of the components, to form a pair of strips (7), (8) and a number of pairs of holes are provided in each strip through which straight lead wires (4), (5) are threaded, the wires (4) being parallel and normal to the strip axis while the wires (5) are parallel but inclined to the strip axis. Bead-type solid tantalum capacitors (2) having short tantalum wire anodes (3) have these wire anodes (3) welded in overlapping relation to the wires (5), the sheet is then folded so that the strips are face to face and the wires (4) are adjacent the cathode forming sides of the capacitors. The wires (4) may be joined to the capacitors by dipping the assembly in a solder bath while the strips (7), (8) are pressed together. In a modification, both sets of wires are normal to the strip axis when a straight lap weld is formed on each tantalum wire (3) and in this case the strips are initially separate being joined by adhesive tape (17), Fig. 3 (not shown), with a spacer strip (16) or by stapling. In a further modification the capacitors are of disc form (18), Fig. 5 (not shown), both sets of wires are oblique to the strip axes but oppositely inclined and the wires are joined to the front and back surfaces of the components respectively, by dipping in a solder bath, an adhesive band (17) being used to clamp the strips for soldering. The finished assemblies are adapted for batch processing, e.g. dipping in encapsulating wax or colour coding and individual components may be separately tested without removal while the assembly is in a form for packaging and bulk supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3180665A GB1075198A (en) | 1965-07-26 | 1965-07-26 | Electrical component assemblies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3180665A GB1075198A (en) | 1965-07-26 | 1965-07-26 | Electrical component assemblies |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1075198A true GB1075198A (en) | 1967-07-12 |
Family
ID=10328694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3180665A Expired GB1075198A (en) | 1965-07-26 | 1965-07-26 | Electrical component assemblies |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1075198A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110427698A (en) * | 2019-08-01 | 2019-11-08 | 西安电子科技大学 | A kind of movable leadframe joint welding interconnection point regulation method towards electromagnetic transmission performance |
-
1965
- 1965-07-26 GB GB3180665A patent/GB1075198A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110427698A (en) * | 2019-08-01 | 2019-11-08 | 西安电子科技大学 | A kind of movable leadframe joint welding interconnection point regulation method towards electromagnetic transmission performance |
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