GB1034484A - Improvements in or relating to the electrodeposition of copper - Google Patents

Improvements in or relating to the electrodeposition of copper

Info

Publication number
GB1034484A
GB1034484A GB14632/63A GB1463263A GB1034484A GB 1034484 A GB1034484 A GB 1034484A GB 14632/63 A GB14632/63 A GB 14632/63A GB 1463263 A GB1463263 A GB 1463263A GB 1034484 A GB1034484 A GB 1034484A
Authority
GB
United Kingdom
Prior art keywords
compounds
group
copper
compound
poly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB14632/63A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Udylite Research Corp
Original Assignee
Udylite Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Udylite Research Corp filed Critical Udylite Research Corp
Publication of GB1034484A publication Critical patent/GB1034484A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

Copper plating baths include a poly-ether compound containing at least 3 and preferably 6 ether groups and no aliphatic chain exceeding 6 C atoms together with an organic sulphide group which may be linked to an -SO3H group. Alternatively the polyether and the S-compound may be added as separate compounds. The polyethers include polymers of 1:3 dioxolane as described in Specification 1,020,168, preferably of mol. wt. about 5000. They may contain the group (-C2H4OC2H4O-)x where x is 3 or more, or (-C3H6OC3H6O-)y where y is 3 to 10. The S-compounds include thiols, phenyl disulphides, and have present halogen, alkoxy, and other groups. Phenazine dyes may also be added. The copper salt may be sulphate, fluoborate, or a copper alkyl sulphonate or di-sulphonate. The poly-ethers having a terminal OH group form compounds with alcohols, chlorhydrin, nitriles, sulphonic acids, amides, alkanolamines and other compounds. The S-compound when added as a separate compound, preferably has a sulphonic group which may be used as a salt e.g. of triethanolamine, guanidine, ethylene diamine, or pyridine. A range of examples of poly-ethers and S-compounds are given with graphic formulae. In plating iron and steel, a preliminary flash coat of Cu or Ni is desirable. Preferably phosphorized copper anodes are used in the main plating process.
GB14632/63A 1962-04-16 1963-04-11 Improvements in or relating to the electrodeposition of copper Expired GB1034484A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US187926A US3267010A (en) 1962-04-16 1962-04-16 Electrodeposition of copper from acidic baths

Publications (1)

Publication Number Publication Date
GB1034484A true GB1034484A (en) 1966-06-29

Family

ID=22691053

Family Applications (1)

Application Number Title Priority Date Filing Date
GB14632/63A Expired GB1034484A (en) 1962-04-16 1963-04-11 Improvements in or relating to the electrodeposition of copper

Country Status (6)

Country Link
US (1) US3267010A (en)
DE (1) DE1521062B2 (en)
FR (1) FR1361558A (en)
GB (1) GB1034484A (en)
NL (1) NL291575A (en)
SE (1) SE301576B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2141141A (en) * 1983-06-10 1984-12-12 Omi Int Corp Electrodepositing copper
EP1897975A1 (en) * 2006-09-07 2008-03-12 Enthone, Inc. Deposition of conductive polymer and metallization of non-conductive substrates
EP1897973A1 (en) * 2006-09-07 2008-03-12 Enthone, Inc. Deposition of conductive polymer and metallization of non-conductive substrates
US8366901B2 (en) 2006-09-07 2013-02-05 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3373095A (en) * 1967-06-05 1968-03-12 Dayton Bright Copper Company Electroplating of copper
US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper
DE2039831C3 (en) * 1970-06-06 1979-09-06 Schering Ag, 1000 Berlin Und 4619 Bergkamen Acid bath for the galvanic deposition of shiny copper coatings
US3715289A (en) * 1971-02-08 1973-02-06 Stauffer Chemical Co Brightener composition for acid copper electroplating baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
US3966565A (en) * 1972-12-14 1976-06-29 M & T Chemicals Inc. Electrodeposition of copper
US3956079A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956078A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956120A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956084A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3940320A (en) * 1972-12-14 1976-02-24 M & T Chemicals Inc. Electrodeposition of copper
US4014760A (en) * 1974-11-21 1977-03-29 M & T Chemicals Inc. Electrodeposition of copper
US4036710A (en) * 1974-11-21 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4036711A (en) * 1975-12-18 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4316778A (en) * 1980-09-24 1982-02-23 Rca Corporation Method for the manufacture of recording substrates for capacitance electronic discs
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
AU554236B2 (en) * 1983-06-10 1986-08-14 Omi International Corp. Electrolyte composition and process for electrodepositing copper
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
US4551212A (en) * 1985-03-11 1985-11-05 Rca Corporation Bath and process for the electrodeposition of micromachinable copper and additive for said bath
US4673467A (en) * 1986-09-02 1987-06-16 Cbs Inc. Method of manufacturing fine-grained copper substrate for optical information carrier
DE4032864A1 (en) * 1990-10-13 1992-04-16 Schering Ag ACIDIC BATH FOR THE GALVANIC DEPOSITION OF COPPER COVERS AND METHODS USING THIS COMBINATION
DE4126502C1 (en) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
US6203582B1 (en) * 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US5980706A (en) * 1996-07-15 1999-11-09 Semitool, Inc. Electrode semiconductor workpiece holder
US6358388B1 (en) * 1996-07-15 2002-03-19 Semitool, Inc. Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover
US6454926B1 (en) * 1997-09-30 2002-09-24 Semitool Inc. Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas
US6936153B1 (en) 1997-09-30 2005-08-30 Semitool, Inc. Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face
DE19758121C2 (en) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Aqueous bath and method for electrolytic deposition of copper layers
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6197181B1 (en) 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
TWI223678B (en) 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US7247229B2 (en) * 1999-06-28 2007-07-24 Eltech Systems Corporation Coatings for the inhibition of undesirable oxidation in an electrochemical cell
JP2001073182A (en) * 1999-07-15 2001-03-21 Boc Group Inc:The Improved acidic copper electroplating solution
US6596148B1 (en) 1999-08-04 2003-07-22 Mykrolis Corporation Regeneration of plating baths and system therefore
US6391209B1 (en) 1999-08-04 2002-05-21 Mykrolis Corporation Regeneration of plating baths
US6942779B2 (en) * 2000-05-25 2005-09-13 Mykrolis Corporation Method and system for regenerating of plating baths
ATE385863T1 (en) * 2000-08-18 2008-03-15 Ti Group Automotive Sys Ltd METHOD FOR PLATING A METAL STRIP TO PRODUCE A MULTI-WALLED TUBE
US6652731B2 (en) * 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
JP3964263B2 (en) * 2002-05-17 2007-08-22 株式会社デンソー Blind via hole filling method and through electrode forming method
US7025866B2 (en) * 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
DE10261852B3 (en) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
US20040211657A1 (en) * 2003-04-11 2004-10-28 Ingelbrecht Hugo Gerard Eduard Method of purifying 2,6-xylenol and method of producing poly(arylene ether) therefrom
DE10337669B4 (en) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Aqueous, acid solution and process for the electrodeposition of copper coatings and use of the solution
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
DE10354860B4 (en) * 2003-11-19 2008-06-26 Atotech Deutschland Gmbh Halogenated or pseudohalogenated monomeric phenazinium compounds, process for their preparation and acid bath containing these compounds and process for the electrolytic deposition of a copper precipitate
KR101134610B1 (en) * 2004-08-18 2012-04-09 에바라 유지라이토 가부시키가이샤 Additive for copper plating and process for producing electronic circuit substrate therewith
DE102005011708B3 (en) 2005-03-11 2007-03-01 Atotech Deutschland Gmbh A polyvinylammonium compound and process for the production thereof, and an acidic solution containing the compound and a process for electrolytically depositing a copper precipitate
JP5525762B2 (en) * 2008-07-01 2014-06-18 上村工業株式会社 Electroless plating solution, electroless plating method using the same, and method for manufacturing wiring board
TWI433964B (en) 2010-10-08 2014-04-11 Water Star Inc Multi-layer mixed metal oxide electrode and method for making same
CN102523785B (en) * 2012-01-19 2013-10-02 南京农业大学 Application of safranine T in seed dye mark tracing aspect
EP3415664B1 (en) * 2017-06-16 2019-09-18 ATOTECH Deutschland GmbH Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating
US11668017B2 (en) 2018-07-30 2023-06-06 Water Star, Inc. Current reversal tolerant multilayer material, method of making the same, use as an electrode, and use in electrochemical processes

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL178453B (en) * 1952-05-26 Mita Industrial Co Ltd PROCEDURE FOR ELECTROSTATIC COPYING.
DE1075398B (en) * 1954-03-22 1960-02-11 DEHYDAG Deutsche Hydrierwerke G.m.b.H., Düsseldorf Bath for the galvanic production of metal coatings
BE556462A (en) * 1956-06-15
US3021266A (en) * 1957-08-12 1962-02-13 Barnet D Ostrow Additive for copper plating bath
US3030282A (en) * 1961-05-02 1962-04-17 Metal & Thermit Corp Electrodeposition of copper
DE1133610B (en) * 1959-06-06 1962-07-19 Dehydag Gmbh Acid galvanic copper baths

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2141141A (en) * 1983-06-10 1984-12-12 Omi Int Corp Electrodepositing copper
EP1897975A1 (en) * 2006-09-07 2008-03-12 Enthone, Inc. Deposition of conductive polymer and metallization of non-conductive substrates
EP1897973A1 (en) * 2006-09-07 2008-03-12 Enthone, Inc. Deposition of conductive polymer and metallization of non-conductive substrates
US8366901B2 (en) 2006-09-07 2013-02-05 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates

Also Published As

Publication number Publication date
SE301576B (en) 1968-06-10
US3267010A (en) 1966-08-16
FR1361558A (en) 1964-05-22
DE1521062B2 (en) 1971-11-18
NL291575A (en)
DE1521062A1 (en) 1969-08-14

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