NL178453B - PROCEDURE FOR ELECTROSTATIC COPYING. - Google Patents

PROCEDURE FOR ELECTROSTATIC COPYING.

Info

Publication number
NL178453B
NL178453B NLAANVRAGE7804190,A NL178453DA NL178453B NL 178453 B NL178453 B NL 178453B NL 178453D A NL178453D A NL 178453DA NL 178453 B NL178453 B NL 178453B
Authority
NL
Netherlands
Prior art keywords
procedure
electrostatic copying
copying
electrostatic
Prior art date
Application number
NLAANVRAGE7804190,A
Other languages
Dutch (nl)
Original Assignee
Mita Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL178453B publication Critical patent/NL178453B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
NLAANVRAGE7804190,A 1952-05-26 PROCEDURE FOR ELECTROSTATIC COPYING. NL178453B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US290091A US2707166A (en) 1952-05-26 1952-05-26 Electrodeposition of copper from an acid bath

Publications (1)

Publication Number Publication Date
NL178453B true NL178453B (en)

Family

ID=23114498

Family Applications (2)

Application Number Title Priority Date Filing Date
NL83873D NL83873C (en) 1952-05-26
NLAANVRAGE7804190,A NL178453B (en) 1952-05-26 PROCEDURE FOR ELECTROSTATIC COPYING.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL83873D NL83873C (en) 1952-05-26

Country Status (6)

Country Link
US (1) US2707166A (en)
BE (1) BE520209A (en)
DE (1) DE947656C (en)
FR (1) FR1077492A (en)
GB (1) GB736252A (en)
NL (2) NL178453B (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE934508C (en) * 1954-04-23 1955-10-27 Dehydag Gmbh Process for the production of galvanic metal coatings
US2738318A (en) * 1954-12-28 1956-03-13 Udylite Res Corp Electrodeposition of copper from an acid bath
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
US3288690A (en) * 1962-04-16 1966-11-29 Udylite Corp Electrodeposition of copper from acidic baths
NL291575A (en) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
DE2028803C3 (en) * 1970-06-06 1980-08-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Polymeric phenazonium compounds
US4316778A (en) * 1980-09-24 1982-02-23 Rca Corporation Method for the manufacture of recording substrates for capacitance electronic discs
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
AU554236B2 (en) * 1983-06-10 1986-08-14 Omi International Corp. Electrolyte composition and process for electrodepositing copper
US4551212A (en) * 1985-03-11 1985-11-05 Rca Corporation Bath and process for the electrodeposition of micromachinable copper and additive for said bath
US7264698B2 (en) * 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6709568B2 (en) 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
US20060266648A1 (en) * 2002-12-17 2006-11-30 King Mackenzie E Process analyzer for monitoring electrochemical deposition solutions
DE10261852B3 (en) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
DE10354860B4 (en) * 2003-11-19 2008-06-26 Atotech Deutschland Gmbh Halogenated or pseudohalogenated monomeric phenazinium compounds, process for their preparation and acid bath containing these compounds and process for the electrolytic deposition of a copper precipitate
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
DE102005011708B3 (en) 2005-03-11 2007-03-01 Atotech Deutschland Gmbh A polyvinylammonium compound and process for the production thereof, and an acidic solution containing the compound and a process for electrolytically depositing a copper precipitate
EP3415664B1 (en) 2017-06-16 2019-09-18 ATOTECH Deutschland GmbH Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating
ES2800292T3 (en) 2017-11-09 2020-12-29 Atotech Deutschland Gmbh Electrodeposition compositions for the electrodeposition of copper, their use and a method for electrolytically depositing a layer of copper or copper alloy on at least one surface of a substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2326999A (en) * 1940-03-11 1943-08-17 Harshaw Chem Corp Nickel plating
US2291590A (en) * 1940-03-11 1942-07-28 Harshaw Chem Corp Electrodeposition of metals
US2563360A (en) * 1941-05-24 1951-08-07 Gen Motors Corp Electrodeposition of copper
US2489538A (en) * 1941-05-24 1949-11-29 Gen Motors Corp Electrodeposition of copper
USRE24253E (en) * 1948-05-11 1956-12-11 Method of producing a composite liquid

Also Published As

Publication number Publication date
US2707166A (en) 1955-04-26
NL83873C (en)
GB736252A (en) 1955-09-07
DE947656C (en) 1956-08-23
BE520209A (en)
FR1077492A (en) 1954-11-08

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