GB1018622A - Improvements in or relating to welding techniques for use in the manufacture of electronic assemblies - Google Patents

Improvements in or relating to welding techniques for use in the manufacture of electronic assemblies

Info

Publication number
GB1018622A
GB1018622A GB605962A GB605962A GB1018622A GB 1018622 A GB1018622 A GB 1018622A GB 605962 A GB605962 A GB 605962A GB 605962 A GB605962 A GB 605962A GB 1018622 A GB1018622 A GB 1018622A
Authority
GB
United Kingdom
Prior art keywords
foil
component
lead
electrodes
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB605962A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PETER ALAN BARNET
General Electric Co PLC
Original Assignee
PETER ALAN BARNET
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PETER ALAN BARNET, General Electric Co PLC filed Critical PETER ALAN BARNET
Priority to GB605962A priority Critical patent/GB1018622A/en
Publication of GB1018622A publication Critical patent/GB1018622A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering

Abstract

1,018,622. Welding by pressure. GENERAL ELECTRIC CO. Ltd., and P. A. BARNET. Feb. 15, 1963 [Feb. 16, 1962; Sept. 24, 1962], Nos. 6059/62 and 36306/62. Heading B3R. The leads of electronic components are welded to portions of the conductors of a printed-circuit pattern, the conductors being mounted on an insulating substrate beyond which the portions extend, by electrodes engaging opposite sides of the members to be welded. In a known method the lead 2 of an electronic component 1 to be connected to a printed-circuit pattern formed in a layer 4 of copper foil on an insulating layer 5 is engaged by an electrode 9 and through a hole 7 provided in the insulating layer 5 an electrode 9 is engaged with the copper foil. Current passed between the electrodes welds the lead to the foil. According to the invention the layer of copper foil projects beyond the insulating material and the component lead and foil are gripped between the electrodes. To dissipate heat generated one metal block is placed in contact with the component and other components on the board 6 and another metal block is contacted with the other side of the board. Fins may be provided on the upper block to bend the leads down into contact with the foil 4. A hood into which cold air is blown may be arranged over the component.
GB605962A 1962-02-16 1962-02-16 Improvements in or relating to welding techniques for use in the manufacture of electronic assemblies Expired GB1018622A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB605962A GB1018622A (en) 1962-02-16 1962-02-16 Improvements in or relating to welding techniques for use in the manufacture of electronic assemblies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB605962A GB1018622A (en) 1962-02-16 1962-02-16 Improvements in or relating to welding techniques for use in the manufacture of electronic assemblies

Publications (1)

Publication Number Publication Date
GB1018622A true GB1018622A (en) 1966-01-26

Family

ID=9807665

Family Applications (1)

Application Number Title Priority Date Filing Date
GB605962A Expired GB1018622A (en) 1962-02-16 1962-02-16 Improvements in or relating to welding techniques for use in the manufacture of electronic assemblies

Country Status (1)

Country Link
GB (1) GB1018622A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3578940A (en) * 1969-02-20 1971-05-18 Arvin Ind Inc Welding process
WO2000049841A1 (en) * 1999-02-18 2000-08-24 Siemens Aktiengesellschaft Electrical connection method and connection site

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3578940A (en) * 1969-02-20 1971-05-18 Arvin Ind Inc Welding process
WO2000049841A1 (en) * 1999-02-18 2000-08-24 Siemens Aktiengesellschaft Electrical connection method and connection site
US6533620B2 (en) 1999-02-18 2003-03-18 Siemens Aktiengesellschaft Electrical connection method and connection site

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