US3895214A - Component removal tool - Google Patents

Component removal tool Download PDF

Info

Publication number
US3895214A
US3895214A US376329A US37632973A US3895214A US 3895214 A US3895214 A US 3895214A US 376329 A US376329 A US 376329A US 37632973 A US37632973 A US 37632973A US 3895214 A US3895214 A US 3895214A
Authority
US
United States
Prior art keywords
heads
legs
working
pair
leg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US376329A
Inventor
Robin L Winter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US376329A priority Critical patent/US3895214A/en
Application granted granted Critical
Publication of US3895214A publication Critical patent/US3895214A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0007—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components using handtools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0476—Soldering pliers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53274—Means to disassemble electrical device
    • Y10T29/53283—Means comprising hand-manipulatable implement

Definitions

  • Bartis 5 7 ABSTRACT Apparatus for removing solder-mounted components from substrate surfaces comprises plier means having a pair of relatively movable arms pivotally mounted together and forming a pair of oppositely disposed gripping handles and a pair of oppositely disposed working legs. Each working leg has a head secured thereto and electric heating means is provided for heating each of the heads.
  • the heads are characterized in that each terminates in a generally planar exposed surface arranged at an acute angle with respect to the longitudinal axis of the leg and having a generally sharpened linear tip edge mutually opposed to the sharpened tip edge of the other head.
  • the tip edges are disposed along a line generally transverse to and intermediate the longitudinal axes of the legs.
  • the forward and inward exposed surfaces of each of the heads are arranged in mutually converging relationship at an acute angle relative to the longitudinal axis of the leg to which it is secured to define a wedgeshaped configuration.
  • the heads are designed to both melt the solder and to lift the component from the substrate surface.
  • the legs are resilient biased apart by a spring between the handles. Stop means are provided to prevent contact between the tip edge portions.
  • the present invention relates generally to an improved apparatus for removing solder-mounted components from substrate surfaces, and particularly for lifting semiconductor chips from a printed circuit board. More specifically, the apparatus of the present invention may be described as a chip-lifter which is provided with the gripping action of a conventional pair of pliers and with the heating action of a pair of soldering irons. This combination provides an expeditious means for removing integrated circuit chips from printed circuit boards.
  • a means for removing solder-mounted components from substrate surfaces, such as a chip-lifter, the apparatus including plier means having a pair of relatively movable arms which are pivotally mounted together, and form a pair of oppositely disposed gripping handles and a pair of oppositely disposed working legs.
  • the conventional pivot separates the gripping handles from the working legs.
  • Each of the legs is provided with a head which has heating means provided for each of the heads, the heads being characterized in that a generally sharpened tip edge is provided along a plane arranged generally transverse to the axis of the legs.
  • Means are provided for delivering heat to the working tips, this being accomplished either by means of the direct application of heat to the tip, or by the medium of resistance heating.
  • direct heat a separate heating element is normally provided for each of the working tips, with each of the tips being, therefore, independently heated.
  • resistance heating is employed, each tip becomes an electrode, and high currents are permitted to pass between the individual tips, under low potential. The Joule heat is then adequate to cause the solder layer to become molten, thereby making it possible to lift the chip from the board surface.
  • the individual tips have a wedge-shape configuration, particularly a wedge shape which increases in thickness in a direction extending inwardly away from the center or bight zone of the jaw.
  • This wedge-shape configuration provides a lifting force necessary to remove the chip from the board, with the lifting force occurring upon closing of the working heads toward the center of the jaw.
  • FIG. 1 is a perspective view of the removal tool of the present invention, with this view illustrating the apparatus in use ona printed circuit board, the printed circuit board also being shown in FIG. 1;
  • FIG. 2 is a plan view of the apparatus of the present invention, and showing, in phantom, the arrangement of electrical leads within the confines of the gripping handles;
  • FIG. 3 is a partial elevational view of one of the working legs of the structure, this figure being taken along the line and in the direction of the arrows 3-3 of FIG. 2.
  • the component removing tool 10 includes a plier means having a pair of relatively movable arm members 11 and 12, with these arm members being pivotally mounted together about pivot pin 13.
  • the individual arm members 11 and 12 each have a gripping handle portion and a working leg portion, such as the gripping handles 14 and 15, and the working leg portions 16 and 17.
  • each working leg has a head secured thereto, particularly at the free tip thereof, the heads being shown at 19 and 20.
  • Heads 19 and 20 terminate in generally planar forward exposed surfaces 19a and 20a arranged at an acute angle with respect to the longitudinal axis of the respective leg portions and sharpened tip edges 19b and 20b respectively, with the tip edges being arranged in opposed relationship, one to another.
  • Heating means are also provided for each of the working heads, such as the heating means shown at 21 and 22.
  • heating means 21 and 22 are provided for heating the individual heads 19 and 20, and it will be appreciated that elements 21 and 22 are electrically energized. Leads are shown as at 24 and 25 in FIG. 2, these leads delivering electrical power to the heating means 21 and 22, as indicated in FIG. 2.
  • a spring bias may be provided as at 27,,the biasing means being in the form of a compression spring secured across the individual gripping handles 14 and 15.
  • the use of a bias element such as spring 27 provides a constant and smooth force to the individual heads.
  • FIGS. 2 and 3 of the drawings wherein the configuration of the heads is illustrated in detail.
  • the individual heads are wedge-shaped so as to provide the lifting force necessary to remove the component from the board, upon achieving a molten state in the solder.
  • the wedge-shaped configuration provides an increasing head thickness as one moves away from the center of the jaw formed between the individual working legs 16 and 17 of the removal tool structure.
  • the tips of the individual wedge-shaped heads are reasonably sharp, thus permitting ingress of the working head to the area between the chip and the substrate surface.
  • any convenient material may be employed, the working heads 19 and 20 preferably being fabricated from copper or brass, and with iron or steel being employed for the arm members. It will be appreciated that the materials of construction are not critical, and those skilled in the art may select appropriate materials without experimentation being required.
  • each working head becomes an electrode, and the high currents, at low potential, are permitted to pass between the heads.
  • a stop member such as the stop member 30 may be employed between the legs 16 and 17.
  • Such a stop element, interposed between the working legs, will protect the tips of the heads 19 and 20 from contact with each other.
  • Means for removing solder-mounted components from substrate surfaces comprising:
  • a. plier means having a pair of relatively movable arm members pivotally mounted together and forming a pair of oppositely disposed gripping handles and a pair of oppositely disposed working legs;
  • each of said working legs having a head secured thereto adjacent the free tip thereof and heating means for each of said heads;
  • each includes a forward exposed surface terminating in a generally sharpened linear tip edge mutually opposed to the generally sharpened tip edge of the other head said sharpened tip edges being disposed along a line generally transverse to and generally intermediate the longitudinal axes of said legs, and in that the forward exposed surface of each of said heads is generally planar and arranged at an acute angle with respect to the longitudinal axis of the leg, the forward and inward exposed surfaces of each of said heads being disposed in mutually converging relationship and at an acute angle relative to the longitudinal axis of the working leg with which the leg is secured, and with said mutually converging relationship being in a forward direction away from said working legs and toward said sharpened tip edge to define a wedge-shaped configuration.
  • the component removal structure as defined in claim 1 being particularly characterized in that resilient means are provided normally urging said working legs in a direction away from contact with each other.
  • the component removal structure as defined in claim 1 being particularly characterized in that stop means are provided for preventing mutual contact from occurring between the tip edge portions of said heads.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Apparatus for removing solder-mounted components from substrate surfaces comprises plier means having a pair of relatively movable arms pivotally mounted together and forming a pair of oppositely disposed gripping handles and a pair of oppositely disposed working legs. Each working leg has a head secured thereto and electric heating means is provided for heating each of the heads. The heads are characterized in that each terminates in a generally planar exposed surface arranged at an acute angle with respect to the longitudinal axis of the leg and having a generally sharpened linear tip edge mutually opposed to the sharpened tip edge of the other head. The tip edges are disposed along a line generally transverse to and intermediate the longitudinal axes of the legs. The forward and inward exposed surfaces of each of the heads are arranged in mutually converging relationship at an acute angle relative to the longitudinal axis of the leg to which it is secured to define a wedge-shaped configuration. The heads are designed to both melt the solder and to lift the component from the substrate surface. The legs are resilient biased apart by a spring between the handles. Stop means are provided to prevent contact between the tip edge portions.

Description

United States Patent [1 1 Winter g smviu-wm a m] July 15, 1975 COMPONENT REMOVAL TOOL [22] Filed: July 5, 1973 [21] Appl. No.: 376,329
Related U.S. Application Data [63] Continuation of Ser. No. 226,493, Feb. 15, 1972.
[52] US. Cl. 219/230; 29/203 l-l; 8l/4l7; 219/533; 228/19; 228/51 [51] Int. Cl. H05b l/00; B23k 3/00; B25b 7/00 [58] Field of Search 219/221, 227, 230, 231, 219/236, 533; 81/9.5 R, 9.5 B, 9.5 A, 415,
417, 341; 228/51, 54, 55', 29/203 H, 203 HM Primary Examiner-A. Bartis 5 7 ABSTRACT Apparatus for removing solder-mounted components from substrate surfaces comprises plier means having a pair of relatively movable arms pivotally mounted together and forming a pair of oppositely disposed gripping handles and a pair of oppositely disposed working legs. Each working leg has a head secured thereto and electric heating means is provided for heating each of the heads. The heads are characterized in that each terminates in a generally planar exposed surface arranged at an acute angle with respect to the longitudinal axis of the leg and having a generally sharpened linear tip edge mutually opposed to the sharpened tip edge of the other head. The tip edges are disposed along a line generally transverse to and intermediate the longitudinal axes of the legs. The forward and inward exposed surfaces of each of the heads are arranged in mutually converging relationship at an acute angle relative to the longitudinal axis of the leg to which it is secured to define a wedgeshaped configuration. The heads are designed to both melt the solder and to lift the component from the substrate surface. The legs are resilient biased apart by a spring between the handles. Stop means are provided to prevent contact between the tip edge portions.
3 Claims, 3 Drawing Figures COMPONENT REMOVAL TOOL CROSS-REFERENCE TO RELATED APPLICATION This is a continuation of application Ser. No. 226,493, filed Feb. 15, 1972.
BACKGROUND OF THE INVENTION The present invention relates generally to an improved apparatus for removing solder-mounted components from substrate surfaces, and particularly for lifting semiconductor chips from a printed circuit board. More specifically, the apparatus of the present invention may be described as a chip-lifter which is provided with the gripping action of a conventional pair of pliers and with the heating action of a pair of soldering irons. This combination provides an expeditious means for removing integrated circuit chips from printed circuit boards.
In the past, various apparatus have been designed for removing chips, particularly integrated circuit chips from printed circuit boards, these devices being provided with heated tips for lifting the component from the printed circuit board. Frequently, these chip-lifting devices apply heat directly to the substrate surface, and frequently damage occurs to the foil surface. The apparatus of the present invention reduces the danger of heat damage to the substrate surface, reduces the incidents of conductive foil being lifted from the substrate,
and also reduces the occurrences of electrical shorts occurring due to solder deposits.
SUMMARY OF THE INVENTION Briefly, in accordance with the present invention, a means is provided for removing solder-mounted components from substrate surfaces, such as a chip-lifter, the apparatus including plier means having a pair of relatively movable arms which are pivotally mounted together, and form a pair of oppositely disposed gripping handles and a pair of oppositely disposed working legs. The conventional pivot separates the gripping handles from the working legs. Each of the legs is provided with a head which has heating means provided for each of the heads, the heads being characterized in that a generally sharpened tip edge is provided along a plane arranged generally transverse to the axis of the legs. This structure provides a safe, efficient, and expeditious means for accomplishing removal of integrated circuit chips from printed circuit boards, while reducing the danger of damage to the components through the application of heat.
Means are provided for delivering heat to the working tips, this being accomplished either by means of the direct application of heat to the tip, or by the medium of resistance heating. When direct heat is utilized, a separate heating element is normally provided for each of the working tips, with each of the tips being, therefore, independently heated. When resistance heating is employed, each tip becomes an electrode, and high currents are permitted to pass between the individual tips, under low potential. The Joule heat is then adequate to cause the solder layer to become molten, thereby making it possible to lift the chip from the board surface.
It will be observed that the individual tips have a wedge-shape configuration, particularly a wedge shape which increases in thickness in a direction extending inwardly away from the center or bight zone of the jaw.
This wedge-shape configuration provides a lifting force necessary to remove the chip from the board, with the lifting force occurring upon closing of the working heads toward the center of the jaw.
Therefore, it is a primary object of the present invention to provide an improved means for removing solder-mounted electrical components from substrate surfaces wherein the device accomplishes safe and expeditious removal of the component from the printed circuit substrate board.
It is yet a further object of the present invention to provide an improved means for removing soldermounted electrical components from substrate surfaces, particularly integrated circuit chips from printed circuit boards, wherein the apparatus accomplishes removal without risking damage to the board surface.
It is yet a further object of the present invention to provide an improved apparatus for removing soldermounted electrical components from substrate surfaces, wherein the individual working heads of the structure have a sharpened wedge-shaped tip to provide a lifting action to lift the individual circuit chips from the board surface.
Other and further objects of the present invention will become apparent to those skilled in the art upon a study of the following specification, appended claims, and accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of the removal tool of the present invention, with this view illustrating the apparatus in use ona printed circuit board, the printed circuit board also being shown in FIG. 1;
FIG. 2 is a plan view of the apparatus of the present invention, and showing, in phantom, the arrangement of electrical leads within the confines of the gripping handles; and
FIG. 3 is a partial elevational view of one of the working legs of the structure, this figure being taken along the line and in the direction of the arrows 3-3 of FIG. 2.
DESCRIPTION OF THE PREFERRED EMBODIMENT With attention now being directed to FIG. 1 of the drawings, the component removing tool generally designated 10 includes a plier means having a pair of relatively movable arm members 11 and 12, with these arm members being pivotally mounted together about pivot pin 13. The individual arm members 11 and 12 each have a gripping handle portion and a working leg portion, such as the gripping handles 14 and 15, and the working leg portions 16 and 17. As is apparent in the drawing, each working leg has a head secured thereto, particularly at the free tip thereof, the heads being shown at 19 and 20. Heads 19 and 20 terminate in generally planar forward exposed surfaces 19a and 20a arranged at an acute angle with respect to the longitudinal axis of the respective leg portions and sharpened tip edges 19b and 20b respectively, with the tip edges being arranged in opposed relationship, one to another. Heating means are also provided for each of the working heads, such as the heating means shown at 21 and 22. In this connection, heating means 21 and 22 are provided for heating the individual heads 19 and 20, and it will be appreciated that elements 21 and 22 are electrically energized. Leads are shown as at 24 and 25 in FIG. 2, these leads delivering electrical power to the heating means 21 and 22, as indicated in FIG. 2.
If desired, a spring bias may be provided as at 27,,the biasing means being in the form of a compression spring secured across the individual gripping handles 14 and 15. The use of a bias element such as spring 27 provides a constant and smooth force to the individual heads.
Particular attention is now directed to FIGS. 2 and 3 of the drawings wherein the configuration of the heads is illustrated in detail. It will be readily apparent that the individual heads are wedge-shaped so as to provide the lifting force necessary to remove the component from the board, upon achieving a molten state in the solder. As is apparent in the drawing, the wedge-shaped configuration provides an increasing head thickness as one moves away from the center of the jaw formed between the individual working legs 16 and 17 of the removal tool structure. Also, as is apparent, the tips of the individual wedge-shaped heads are reasonably sharp, thus permitting ingress of the working head to the area between the chip and the substrate surface.
For materials of construction, any convenient material may be employed, the working heads 19 and 20 preferably being fabricated from copper or brass, and with iron or steel being employed for the arm members. It will be appreciated that the materials of construction are not critical, and those skilled in the art may select appropriate materials without experimentation being required.
As has been indicated, either direct application of heat to the working heads may be employed, or resistance heating may be employed. In instances where resistance heating is desired, each working head becomes an electrode, and the high currents, at low potential, are permitted to pass between the heads.
In order to preserve the configuration of the individual working heads, a stop member such as the stop member 30 may be employed between the legs 16 and 17. Such a stop element, interposed between the working legs, will protect the tips of the heads 19 and 20 from contact with each other.
The apparatus illustrated here is illustrative of those structures which may be prepared pursuant to the various aspects of the present invention.
I claim:
1. Means for removing solder-mounted components from substrate surfaces comprising:
a. plier means having a pair of relatively movable arm members pivotally mounted together and forming a pair of oppositely disposed gripping handles and a pair of oppositely disposed working legs;
b. each of said working legs having a head secured thereto adjacent the free tip thereof and heating means for each of said heads;
c. said heads being characterized in that each includes a forward exposed surface terminating in a generally sharpened linear tip edge mutually opposed to the generally sharpened tip edge of the other head said sharpened tip edges being disposed along a line generally transverse to and generally intermediate the longitudinal axes of said legs, and in that the forward exposed surface of each of said heads is generally planar and arranged at an acute angle with respect to the longitudinal axis of the leg, the forward and inward exposed surfaces of each of said heads being disposed in mutually converging relationship and at an acute angle relative to the longitudinal axis of the working leg with which the leg is secured, and with said mutually converging relationship being in a forward direction away from said working legs and toward said sharpened tip edge to define a wedge-shaped configuration.
2. The component removal structure as defined in claim 1 being particularly characterized in that resilient means are provided normally urging said working legs in a direction away from contact with each other.
3. The component removal structure as defined in claim 1 being particularly characterized in that stop means are provided for preventing mutual contact from occurring between the tip edge portions of said heads.

Claims (3)

1. Means for removing solder-mounted components from substrate surfaces comprising: a. plier means having a pair of relatively movable arm members pivotally mounted together and forming a pair of oppositely disposed gripping handles and a pair of oppositely disposed working legs; b. each of said working legs having a head secured thereto adjacent the free tip thereof and heating means for each of said heads; c. said heads being characterized in that each includes a forward exposed surface terminating in a generally sharpened linear tip edge mutually opposed to the generally sharpened tip edge of the other head said sharpened tip edges being disposed along a line generally transverse to and generally intermediate the longitudinal axes of said legs, and in that the forward exposed surface of each of said heads is generally planar and arranged at an acute angle with respect to the longitudinal axis of the leg, the forward and inward exposed surfaces of each of said heads being disposed in mutually converging relationship and at an acute angle relative to the longitudinal axis of the working leg with which the leg is secured, and with said mutually converging relationship being in a forward direction away from said working legs and toward said sharpened tIp edge to define a wedge-shaped configuration.
2. The component removal structure as defined in claim 1 being particularly characterized in that resilient means are provided normally urging said working legs in a direction away from contact with each other.
3. The component removal structure as defined in claim 1 being particularly characterized in that stop means are provided for preventing mutual contact from occurring between the tip edge portions of said heads.
US376329A 1972-02-15 1973-07-05 Component removal tool Expired - Lifetime US3895214A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US376329A US3895214A (en) 1972-02-15 1973-07-05 Component removal tool

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22649372A 1972-02-15 1972-02-15
US376329A US3895214A (en) 1972-02-15 1973-07-05 Component removal tool

Publications (1)

Publication Number Publication Date
US3895214A true US3895214A (en) 1975-07-15

Family

ID=26920581

Family Applications (1)

Application Number Title Priority Date Filing Date
US376329A Expired - Lifetime US3895214A (en) 1972-02-15 1973-07-05 Component removal tool

Country Status (1)

Country Link
US (1) US3895214A (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034202A (en) * 1975-05-23 1977-07-05 Nu-Concept Computer Systems, Inc. Integrated circuit pack extractor
US4078714A (en) * 1976-10-18 1978-03-14 Ernst Spirig Desoldering method and apparatus
US4626658A (en) * 1983-10-24 1986-12-02 Antex (Electronics) Limited Electrically heated tool for soldering pipe connector sleeves
US4632294A (en) * 1984-12-20 1986-12-30 International Business Machines Corporation Process and apparatus for individual pin repair in a dense array of connector pins of an electronic packaging structure
US4720035A (en) * 1986-01-17 1988-01-19 Fujitsu Limited Method of reflow bonding electronic parts on printed circuit board and apparatus used therefor
US4872604A (en) * 1987-07-09 1989-10-10 Productech Reflow Solder Equipment Inc. Heated tool with stop mechanism
US5145101A (en) * 1991-06-05 1992-09-08 Pace Incorporated Tweezer handpiece for installation and removal of electronic components with respect to a substrate and tips and tool for use therewith
US5241156A (en) * 1989-08-17 1993-08-31 Pace, Incorporated Hand-held heating device for electrical component installation/removal and improved tips for use therewith
US5246157A (en) * 1991-06-05 1993-09-21 Pace, Incorporated Tool for use with tweezer handpiece for installation and removal of electronic components with respect to a substrate
US5458730A (en) * 1992-08-14 1995-10-17 American Fluoroseal Corporation Peel package sealing machine
US5549240A (en) * 1995-02-14 1996-08-27 Cooper Industries, Inc. Surface mount device removal tool
US6607113B2 (en) * 2000-02-10 2003-08-19 Sun Microsystems, Inc. Apparatus and method for removing a soldered device from a printed circuit board
US20060107513A1 (en) * 2004-11-19 2006-05-25 Fujitsu Limited Method of removing integrated circuit chip package and detachment jig therefor
US20080190250A1 (en) * 2007-02-08 2008-08-14 Donald Nevin Heated dental pliers
CN101237956B (en) * 2005-04-08 2010-08-18 特拉华资本形成公司 Precision soldering tweezers with arms having distal ends adjustable in position
US20130134144A1 (en) * 2011-11-25 2013-05-30 Hon Hai Precision Industry Co., Ltd. Electrical soldering iron
US20150155672A1 (en) * 2013-12-04 2015-06-04 Chung-Chuan Huang Clamp device for coaxial connector
US9789678B1 (en) 2016-05-17 2017-10-17 International Business Machines Corporation Cleaving device
US20180185990A1 (en) * 2016-12-30 2018-07-05 Dave Stull Hook nose pliers system
CN111266691A (en) * 2020-03-20 2020-06-12 魏嘉轩 Handheld stable system of high-efficient welding
USD924027S1 (en) 2020-01-15 2021-07-06 Bernadette Pomar Bulb removal tool

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US928335A (en) * 1909-03-20 1909-07-20 John A Ryden Hoof-nippers.
US1022489A (en) * 1911-09-07 1912-04-09 Heller Tool Company Pincers, pliers, and the like.
US1578438A (en) * 1921-03-05 1926-03-30 Herman R Hintz Pincers
US2451463A (en) * 1947-04-12 1948-10-19 Waldemar E Zimmermann Tool for cutting insulation and stripping it from wires
US2667094A (en) * 1950-04-08 1954-01-26 Denton A Potter Insulation stripping tool for electric conductors
US3114821A (en) * 1961-01-10 1963-12-17 Stuart C Senn Electrically heated soldering plier
US3241814A (en) * 1964-05-22 1966-03-22 Foster M Forte Upholstery staple dislodging and extracting tool

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US928335A (en) * 1909-03-20 1909-07-20 John A Ryden Hoof-nippers.
US1022489A (en) * 1911-09-07 1912-04-09 Heller Tool Company Pincers, pliers, and the like.
US1578438A (en) * 1921-03-05 1926-03-30 Herman R Hintz Pincers
US2451463A (en) * 1947-04-12 1948-10-19 Waldemar E Zimmermann Tool for cutting insulation and stripping it from wires
US2667094A (en) * 1950-04-08 1954-01-26 Denton A Potter Insulation stripping tool for electric conductors
US3114821A (en) * 1961-01-10 1963-12-17 Stuart C Senn Electrically heated soldering plier
US3241814A (en) * 1964-05-22 1966-03-22 Foster M Forte Upholstery staple dislodging and extracting tool

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034202A (en) * 1975-05-23 1977-07-05 Nu-Concept Computer Systems, Inc. Integrated circuit pack extractor
US4078714A (en) * 1976-10-18 1978-03-14 Ernst Spirig Desoldering method and apparatus
US4626658A (en) * 1983-10-24 1986-12-02 Antex (Electronics) Limited Electrically heated tool for soldering pipe connector sleeves
US4632294A (en) * 1984-12-20 1986-12-30 International Business Machines Corporation Process and apparatus for individual pin repair in a dense array of connector pins of an electronic packaging structure
US4720035A (en) * 1986-01-17 1988-01-19 Fujitsu Limited Method of reflow bonding electronic parts on printed circuit board and apparatus used therefor
US4872604A (en) * 1987-07-09 1989-10-10 Productech Reflow Solder Equipment Inc. Heated tool with stop mechanism
US5241156A (en) * 1989-08-17 1993-08-31 Pace, Incorporated Hand-held heating device for electrical component installation/removal and improved tips for use therewith
US5145101A (en) * 1991-06-05 1992-09-08 Pace Incorporated Tweezer handpiece for installation and removal of electronic components with respect to a substrate and tips and tool for use therewith
US5246157A (en) * 1991-06-05 1993-09-21 Pace, Incorporated Tool for use with tweezer handpiece for installation and removal of electronic components with respect to a substrate
US5458730A (en) * 1992-08-14 1995-10-17 American Fluoroseal Corporation Peel package sealing machine
US5474637A (en) * 1992-08-14 1995-12-12 American Fluoroseal Corporation Peel package sealing machine
US5549240A (en) * 1995-02-14 1996-08-27 Cooper Industries, Inc. Surface mount device removal tool
US6607113B2 (en) * 2000-02-10 2003-08-19 Sun Microsystems, Inc. Apparatus and method for removing a soldered device from a printed circuit board
US20060107513A1 (en) * 2004-11-19 2006-05-25 Fujitsu Limited Method of removing integrated circuit chip package and detachment jig therefor
US7469457B2 (en) * 2004-11-19 2008-12-30 Fujitsu Limited Method of removing integrated circuit chip package and detachment jig therefor
CN101237956B (en) * 2005-04-08 2010-08-18 特拉华资本形成公司 Precision soldering tweezers with arms having distal ends adjustable in position
US20080190250A1 (en) * 2007-02-08 2008-08-14 Donald Nevin Heated dental pliers
US20130134144A1 (en) * 2011-11-25 2013-05-30 Hon Hai Precision Industry Co., Ltd. Electrical soldering iron
US20150155672A1 (en) * 2013-12-04 2015-06-04 Chung-Chuan Huang Clamp device for coaxial connector
US9337602B2 (en) * 2013-12-04 2016-05-10 Chung-Chuan Huang Clamp device for coaxial connector
US9789678B1 (en) 2016-05-17 2017-10-17 International Business Machines Corporation Cleaving device
US20180185990A1 (en) * 2016-12-30 2018-07-05 Dave Stull Hook nose pliers system
USD924027S1 (en) 2020-01-15 2021-07-06 Bernadette Pomar Bulb removal tool
CN111266691A (en) * 2020-03-20 2020-06-12 魏嘉轩 Handheld stable system of high-efficient welding
CN111266691B (en) * 2020-03-20 2021-10-26 鱼台银燕电控设备有限公司 Handheld stable system of high-efficient welding

Similar Documents

Publication Publication Date Title
US3895214A (en) Component removal tool
US3632973A (en) Soldering tool for removal and replacement of components having multiple soldered junctions
US4034202A (en) Integrated circuit pack extractor
US5163856A (en) Multipin connector
US6271507B2 (en) Apparatus and method for bonding conductors
US5549240A (en) Surface mount device removal tool
US4081658A (en) Electrically heated soldering device
US3640519A (en) Handling and heat-dissipating device for electrical components
JPH02187263A (en) Heater and contact joint
US3786228A (en) Electric soldering iron tip
US5098319A (en) Multipin connector
US3629541A (en) Hand-held series welding tool
US3130286A (en) Electric soldering gun tip
JP2010253503A (en) Heater chip and joining apparatus
JP2009160617A (en) Heater tip and joining device
JPH0320044Y2 (en)
US1323504A (en) Carl d
US5120924A (en) Welding method for coated metal articles
JP3754185B2 (en) Thermocompression bonding apparatus and heater tool used therefor
KR980012734A (en) Method for electrically connecting the contact member of the plug connector to the connecting line
EP0456967B1 (en) Spot welder and method for using
JP2006303132A (en) Soldering iron
US5130509A (en) Apparatus for reflow soldering
JP3860634B2 (en) High frequency direct current quenching equipment for rack bar
US1401871A (en) Soldering-iron