FR88680E - Dispositif semiconducteur - Google Patents
Dispositif semiconducteurInfo
- Publication number
- FR88680E FR88680E FR27612A FR27612A FR88680E FR 88680 E FR88680 E FR 88680E FR 27612 A FR27612 A FR 27612A FR 27612 A FR27612 A FR 27612A FR 88680 E FR88680 E FR 88680E
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
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- H01L2924/049—Nitrides composed of metals from groups of the periodic table
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- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR27612A FR88680E (fr) | 1964-08-08 | 1965-08-06 | Dispositif semiconducteur |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0092533 | 1964-08-08 | ||
FR27612A FR88680E (fr) | 1964-08-08 | 1965-08-06 | Dispositif semiconducteur |
Publications (1)
Publication Number | Publication Date |
---|---|
FR88680E true FR88680E (fr) | 1967-03-10 |
Family
ID=63144755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR27612A Expired FR88680E (fr) | 1964-08-08 | 1965-08-06 | Dispositif semiconducteur |
Country Status (5)
Country | Link |
---|---|
CH (1) | CH422168A (fr) |
DE (1) | DE1439427A1 (fr) |
FR (1) | FR88680E (fr) |
GB (1) | GB1104515A (fr) |
NL (1) | NL6510283A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2513013A1 (fr) * | 1981-09-16 | 1983-03-18 | Licentia Gmbh | Diode a semiconducteurs sous boitier tubulaire |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2102512A5 (fr) * | 1970-08-06 | 1972-04-07 | Liaison Electr Silec | |
DE2630320A1 (de) * | 1976-07-06 | 1978-01-12 | Licentia Gmbh | Scheibenfoermige halbleiterzelle mit einem ringfoermigen gehaeuse |
FR2839952B1 (fr) | 2002-05-24 | 2004-08-06 | Oreal | Dispositif de distribution destine a equiper un recipient muni d'une valve |
DE102017203132A1 (de) * | 2017-02-06 | 2018-08-09 | Siemens Aktiengesellschaft | Leistungsmodul |
-
1964
- 1964-08-08 DE DE19641439427 patent/DE1439427A1/de active Pending
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1965
- 1965-07-22 CH CH1031165A patent/CH422168A/de unknown
- 1965-08-06 FR FR27612A patent/FR88680E/fr not_active Expired
- 1965-08-06 NL NL6510283A patent/NL6510283A/xx unknown
- 1965-08-09 GB GB34085/65A patent/GB1104515A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2513013A1 (fr) * | 1981-09-16 | 1983-03-18 | Licentia Gmbh | Diode a semiconducteurs sous boitier tubulaire |
Also Published As
Publication number | Publication date |
---|---|
NL6510283A (fr) | 1966-02-09 |
DE1439427A1 (de) | 1969-06-26 |
GB1104515A (en) | 1968-02-28 |
CH422168A (de) | 1966-10-15 |
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