FR88680E - Dispositif semiconducteur - Google Patents

Dispositif semiconducteur

Info

Publication number
FR88680E
FR88680E FR27612A FR27612A FR88680E FR 88680 E FR88680 E FR 88680E FR 27612 A FR27612 A FR 27612A FR 27612 A FR27612 A FR 27612A FR 88680 E FR88680 E FR 88680E
Authority
FR
France
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR27612A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Priority to FR27612A priority Critical patent/FR88680E/fr
Application granted granted Critical
Publication of FR88680E publication Critical patent/FR88680E/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR27612A 1964-08-08 1965-08-06 Dispositif semiconducteur Expired FR88680E (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR27612A FR88680E (fr) 1964-08-08 1965-08-06 Dispositif semiconducteur

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES0092533 1964-08-08
FR27612A FR88680E (fr) 1964-08-08 1965-08-06 Dispositif semiconducteur

Publications (1)

Publication Number Publication Date
FR88680E true FR88680E (fr) 1967-03-10

Family

ID=63144755

Family Applications (1)

Application Number Title Priority Date Filing Date
FR27612A Expired FR88680E (fr) 1964-08-08 1965-08-06 Dispositif semiconducteur

Country Status (5)

Country Link
CH (1) CH422168A (fr)
DE (1) DE1439427A1 (fr)
FR (1) FR88680E (fr)
GB (1) GB1104515A (fr)
NL (1) NL6510283A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2513013A1 (fr) * 1981-09-16 1983-03-18 Licentia Gmbh Diode a semiconducteurs sous boitier tubulaire

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2102512A5 (fr) * 1970-08-06 1972-04-07 Liaison Electr Silec
DE2630320A1 (de) * 1976-07-06 1978-01-12 Licentia Gmbh Scheibenfoermige halbleiterzelle mit einem ringfoermigen gehaeuse
FR2839952B1 (fr) 2002-05-24 2004-08-06 Oreal Dispositif de distribution destine a equiper un recipient muni d'une valve
DE102017203132A1 (de) * 2017-02-06 2018-08-09 Siemens Aktiengesellschaft Leistungsmodul

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2513013A1 (fr) * 1981-09-16 1983-03-18 Licentia Gmbh Diode a semiconducteurs sous boitier tubulaire

Also Published As

Publication number Publication date
NL6510283A (fr) 1966-02-09
DE1439427A1 (de) 1969-06-26
GB1104515A (en) 1968-02-28
CH422168A (de) 1966-10-15

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