FR3128815A1 - Refroidissement d'un dispositif électronique - Google Patents

Refroidissement d'un dispositif électronique Download PDF

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Publication number
FR3128815A1
FR3128815A1 FR2111527A FR2111527A FR3128815A1 FR 3128815 A1 FR3128815 A1 FR 3128815A1 FR 2111527 A FR2111527 A FR 2111527A FR 2111527 A FR2111527 A FR 2111527A FR 3128815 A1 FR3128815 A1 FR 3128815A1
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France
Prior art keywords
thermally conductive
cover
substrate
face
chip
Prior art date
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Pending
Application number
FR2111527A
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English (en)
Inventor
Younes BOUTALEB
Romain Coffy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Grenoble 2 SAS
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STMicroelectronics Grenoble 2 SAS
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Filing date
Publication date
Application filed by STMicroelectronics Grenoble 2 SAS filed Critical STMicroelectronics Grenoble 2 SAS
Priority to FR2111527A priority Critical patent/FR3128815A1/fr
Priority to US17/970,327 priority patent/US20230140705A1/en
Priority to CN202211334915.7A priority patent/CN116072626A/zh
Priority to CN202222858835.3U priority patent/CN220439602U/zh
Publication of FR3128815A1 publication Critical patent/FR3128815A1/fr
Pending legal-status Critical Current

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    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Refroidissement d'un dispositif électronique La présente description concerne un dispositif électronique (100) comprenant une puce électronique (101) et un boitier de protection de ladite puce (101), ledit boitier comprenant : un substrat (103) comprenant une alternance de couches isolantes électriquement (107) et de couches conductrices thermiquement (109) dans laquelle au moins une couche (111) isolante électriquement comprend au moins une portion (113) conductrice thermiquement ; et un capot (105) en un matériau conducteur thermiquement comprenant au moins une partie latérale (123) disposée dans au moins une cavité (117) formée à partir d'une première face (115) dudit substrat (103). Figure pour l'abrégé : Fig. 1

Description

Refroidissement d'un dispositif électronique
La présente description concerne de façon générale les systèmes et dispositifs électroniques, et leurs moyens de protection et de refroidissement. La présente description s'applique plus particulièrement aux moyens de refroidissement d'un dispositif électronique protégé par un boitier.
De nombreuses techniques de refroidissement de systèmes et dispositifs électroniques protégés par un boîtier sont connues. Il est par exemple connu d'utiliser des boitiers adaptés à dissiper la chaleur dégagée par les composants et circuits du dispositif ou système électronique.
Il est souhaitable de pouvoir améliorer, au moins en partie, les moyens de refroidissement des dispositifs électroniques protégés par un boitier.
Il existe un besoin pour des moyens de refroidissement de dispositifs électroniques protégés par un boitier plus performants.
Un mode de réalisation pallie tout ou partie des inconvénients des moyens de refroidissement de dispositifs électroniques connus.
Un mode de réalisation prévoit un dispositif électronique comprenant une puce électronique et un boitier de protection de ladite puce, ledit boitier comprenant :
- un substrat comprenant une alternance de couches isolantes électriquement et de couches conductrices thermiquement dans laquelle au moins une couche isolante électriquement comprend au moins une portion conductrice thermiquement ; et
- un capot en un matériau conducteur thermiquement comprenant au moins une partie latérale disposée dans au moins une cavité formée à partir d'une première face dudit substrat.
Selon un mode de réalisation, le dispositif comprend, en outre, une couche en un matériau conducteur thermiquement en contact avec une deuxième face de ladite puce et avec ledit capot.
Selon un mode de réalisation, une troisième face de ladite puce est fixée à ladite première face dudit substrat.
Selon un mode de réalisation, ladite au moins une cavité s'étend de ladite première face dudit substrat, et s'étend jusqu'à ladite au moins une portion conductrice thermiquement.
Selon un mode de réalisation, ladite partie latérale dudit capot est en contact avec une desdites couches conductrices thermiquement en contact avec ladite portion conductrice thermiquement.
Selon un mode de réalisation, ladite partie latérale dudit capot est en contact avec ladite portion conductrice thermiquement.
Selon un mode de réalisation, ladite partie latérale dudit capot est reliée à ladite portion conductrice thermiquement par un via conducteur thermiquement.
Selon un mode de réalisation, ledit capot est un capot métallique.
Selon un mode de réalisation, lesdites couches conductrices thermiquement sont aussi conductrices électriquement.
Selon un mode de réalisation, ledit capot comprend, en outre, une partie transversale.
Selon un mode de réalisation, ladite au moins une partie latérale est fixée à ladite partie transversale.
Selon un mode de réalisation, ledit capot est fait en un seul bloc.
Un mode de réalisation prévoit un procédé de fabrication d'un dispositif électronique comprenant les étapes suivantes :
(a) fournir un substrat comprenant une alternance de couches isolantes électriquement et de couches conductrices thermiquement dans laquelle au moins une couche isolante électriquement comprend au moins une portion conductrice thermiquement, ledit substrat comprenant, en outre, au moins une cavité formée à partir d'une première face dudit substrat ;
(b) monter une puce électronique sur ladite première face dudit substrat ;
(c) former une couche en un matériau conducteur thermiquement en contact avec au moins une deuxième face de ladite puce électronique ; et
(d) disposer au moins une partie latérale d'un capot dans ladite cavité formée dudit substrat.
Selon un mode de réalisation, pendant l'étape (b) une troisième face de ladite puce est fixée à ladite première face dudit substrat.
Selon un mode de réalisation, le procédé comprend, en outre, une étape (d) de fixation d'une partie transversale dudit capot à ladite au moins une partie latérale dudit capot.
Ces caractéristiques et avantages, ainsi que d'autres, seront exposés en détail dans la description suivante de modes de réalisation particuliers faite à titre non limitatif en relation avec les figures jointes parmi lesquelles :
la représente une vue en coupe d'un mode de réalisation d'un dispositif électronique ;
la représente une vue en coupe d'un autre mode de réalisation d'un dispositif électronique ;
la représente trois vues en coupe illustrant des étapes d'un mode de mise en oeuvre d'un procédé de fabrication du dispositif électronique de la ;
la représente trois vues en coupe illustrant d'autres étapes d'un mode de mise en oeuvre d'un procédé de fabrication du dispositif électronique de la ; et
la représente une vue en coupe d'un autre mode de réalisation d'un dispositif électronique ;

Claims (14)

  1. Dispositif électronique (100 ; 200 ; 500) comprenant une puce électronique (101) et un boitier de protection de ladite puce (101), ledit boitier comprenant :
    - un substrat (103) comprenant une alternance de couches isolantes électriquement (107) et de couches conductrices thermiquement (109) dans laquelle au moins une couche (111) isolante électriquement comprend au moins une portion (113) conductrice thermiquement ; et
    - un capot (105 ; 501) en un matériau conducteur thermiquement comprenant au moins une partie latérale (123 ; 503) disposée dans au moins une cavité (117) formée à partir d'une première face (115) dudit substrat (103), le dispositif électronique comprenant, en outre, une couche (137) en un matériau conducteur thermiquement en contact avec une deuxième face (125) de ladite puce (101) et avec ledit capot (105 ; 501).
  2. Dispositif selon la revendication 1, dans lequel une troisième face (131) de ladite puce (101) est fixée à ladite première face (115) dudit substrat (103)
  3. Dispositif selon la revendication 1 ou 2, dans lequel ladite au moins une cavité (117) s'étend de ladite première face (115) dudit substrat, et s'étend jusqu'à ladite au moins une portion (113) conductrice thermiquement.
  4. Dispositif selon la revendication 3, dans lequel ladite partie latérale (123 ; 503) dudit capot (105 ; 501) est en contact avec une desdites couches conductrices thermiquement (109) en contact avec ladite portion (113) conductrice thermiquement.
  5. Dispositif selon la revendication 3, dans lequel ladite partie latérale (123 ; 503) dudit capot (105 ; 501) est en contact avec ladite portion (113) conductrice thermiquement.
  6. Dispositif selon la revendication 3, dans lequel ladite partie latérale (123) dudit capot (105) est reliée à ladite portion (113) conductrice thermiquement par un via (203) conducteur thermiquement.
  7. Dispositif selon l'une quelconque des revendications 1 à 6, dans lequel ledit capot (105 ; 501) est un capot métallique.
  8. Dispositif selon l'une quelconque des revendications 1 à 7, dans lequel lesdites couches (109) conductrices thermiquement sont aussi conductrices électriquement.
  9. Dispositif selon l'une quelconque des revendications 1 à 8, dans lequel ledit capot (105 ; 501) comprend, en outre, une partie transversale (121 ; 505).
  10. Dispositif selon la revendication 9, dans lequel ladite au moins une partie latérale (503) est fixée à ladite partie transversale (505).
  11. Dispositif selon la revendication 9, dans lequel ledit capot (121) est fait en un seul bloc.
  12. Procédé de fabrication d'un dispositif électronique (100) comprenant les étapes suivantes :
    (a) fournir un substrat (401) comprenant une alternance de couches (403) isolantes électriquement et de couches (405) conductrices thermiquement dans laquelle au moins une couche (407) isolante électriquement comprend au moins une portion (409) conductrice thermiquement, ledit substrat (401) comprenant, en outre, au moins une cavité (411) formée à partir d'une première face (413) dudit substrat (401) ;
    (b) monter une puce électronique (301) sur ladite première face (413) dudit substrat (401) ;
    (c) former une couche (415) en un matériau conducteur thermiquement en contact avec au moins une deuxième face (307) de ladite puce électronique (301) ; et
    (d) disposer au moins une partie latérale (419) d'un capot (417) dans ladite cavité (411) formée dudit substrat (401).
  13. Procédé selon la revendication 12, dans lequel pendant l'étape (b) une troisième face (305) de ladite puce (301) est fixée à ladite première face (413) dudit substrat (401).
  14. Procédé selon la revendication 12 ou 13, comprenant, en outre, une étape (d) de fixation d'une partie transversale (505) dudit capot (501) à ladite au moins une partie latérale (503) dudit capot (501).
FR2111527A 2021-10-29 2021-10-29 Refroidissement d'un dispositif électronique Pending FR3128815A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR2111527A FR3128815A1 (fr) 2021-10-29 2021-10-29 Refroidissement d'un dispositif électronique
US17/970,327 US20230140705A1 (en) 2021-10-29 2022-10-20 Cooling of an electronic device
CN202211334915.7A CN116072626A (zh) 2021-10-29 2022-10-28 电子器件的冷却
CN202222858835.3U CN220439602U (zh) 2021-10-29 2022-10-28 电子器件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2111527A FR3128815A1 (fr) 2021-10-29 2021-10-29 Refroidissement d'un dispositif électronique
FR2111527 2021-10-29

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FR3128815A1 true FR3128815A1 (fr) 2023-05-05

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US (1) US20230140705A1 (fr)
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5587882A (en) * 1995-08-30 1996-12-24 Hewlett-Packard Company Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate
US6282096B1 (en) * 2000-04-28 2001-08-28 Siliconware Precision Industries Co., Ltd. Integration of heat conducting apparatus and chip carrier in IC package
US20120119346A1 (en) * 2010-11-17 2012-05-17 Yunhyeok Im Semiconductor package and method of forming the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5587882A (en) * 1995-08-30 1996-12-24 Hewlett-Packard Company Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate
US6282096B1 (en) * 2000-04-28 2001-08-28 Siliconware Precision Industries Co., Ltd. Integration of heat conducting apparatus and chip carrier in IC package
US20120119346A1 (en) * 2010-11-17 2012-05-17 Yunhyeok Im Semiconductor package and method of forming the same

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CN220439602U (zh) 2024-02-02
US20230140705A1 (en) 2023-05-04
CN116072626A (zh) 2023-05-05

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