FR3128815A1 - Refroidissement d'un dispositif électronique - Google Patents
Refroidissement d'un dispositif électronique Download PDFInfo
- Publication number
- FR3128815A1 FR3128815A1 FR2111527A FR2111527A FR3128815A1 FR 3128815 A1 FR3128815 A1 FR 3128815A1 FR 2111527 A FR2111527 A FR 2111527A FR 2111527 A FR2111527 A FR 2111527A FR 3128815 A1 FR3128815 A1 FR 3128815A1
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- France
- Prior art keywords
- thermally conductive
- cover
- substrate
- face
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001816 cooling Methods 0.000 title abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000004020 conductor Substances 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
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- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Refroidissement d'un dispositif électronique La présente description concerne un dispositif électronique (100) comprenant une puce électronique (101) et un boitier de protection de ladite puce (101), ledit boitier comprenant : un substrat (103) comprenant une alternance de couches isolantes électriquement (107) et de couches conductrices thermiquement (109) dans laquelle au moins une couche (111) isolante électriquement comprend au moins une portion (113) conductrice thermiquement ; et un capot (105) en un matériau conducteur thermiquement comprenant au moins une partie latérale (123) disposée dans au moins une cavité (117) formée à partir d'une première face (115) dudit substrat (103). Figure pour l'abrégé : Fig. 1
Description
La présente description concerne de façon générale les systèmes et dispositifs électroniques, et leurs moyens de protection et de refroidissement. La présente description s'applique plus particulièrement aux moyens de refroidissement d'un dispositif électronique protégé par un boitier.
De nombreuses techniques de refroidissement de systèmes et dispositifs électroniques protégés par un boîtier sont connues. Il est par exemple connu d'utiliser des boitiers adaptés à dissiper la chaleur dégagée par les composants et circuits du dispositif ou système électronique.
Il est souhaitable de pouvoir améliorer, au moins en partie, les moyens de refroidissement des dispositifs électroniques protégés par un boitier.
Il existe un besoin pour des moyens de refroidissement de dispositifs électroniques protégés par un boitier plus performants.
Un mode de réalisation pallie tout ou partie des inconvénients des moyens de refroidissement de dispositifs électroniques connus.
Un mode de réalisation prévoit un dispositif électronique comprenant une puce électronique et un boitier de protection de ladite puce, ledit boitier comprenant :
- un substrat comprenant une alternance de couches isolantes électriquement et de couches conductrices thermiquement dans laquelle au moins une couche isolante électriquement comprend au moins une portion conductrice thermiquement ; et
- un capot en un matériau conducteur thermiquement comprenant au moins une partie latérale disposée dans au moins une cavité formée à partir d'une première face dudit substrat.
- un substrat comprenant une alternance de couches isolantes électriquement et de couches conductrices thermiquement dans laquelle au moins une couche isolante électriquement comprend au moins une portion conductrice thermiquement ; et
- un capot en un matériau conducteur thermiquement comprenant au moins une partie latérale disposée dans au moins une cavité formée à partir d'une première face dudit substrat.
Selon un mode de réalisation, le dispositif comprend, en outre, une couche en un matériau conducteur thermiquement en contact avec une deuxième face de ladite puce et avec ledit capot.
Selon un mode de réalisation, une troisième face de ladite puce est fixée à ladite première face dudit substrat.
Selon un mode de réalisation, ladite au moins une cavité s'étend de ladite première face dudit substrat, et s'étend jusqu'à ladite au moins une portion conductrice thermiquement.
Selon un mode de réalisation, ladite partie latérale dudit capot est en contact avec une desdites couches conductrices thermiquement en contact avec ladite portion conductrice thermiquement.
Selon un mode de réalisation, ladite partie latérale dudit capot est en contact avec ladite portion conductrice thermiquement.
Selon un mode de réalisation, ladite partie latérale dudit capot est reliée à ladite portion conductrice thermiquement par un via conducteur thermiquement.
Selon un mode de réalisation, ledit capot est un capot métallique.
Selon un mode de réalisation, lesdites couches conductrices thermiquement sont aussi conductrices électriquement.
Selon un mode de réalisation, ledit capot comprend, en outre, une partie transversale.
Selon un mode de réalisation, ladite au moins une partie latérale est fixée à ladite partie transversale.
Selon un mode de réalisation, ledit capot est fait en un seul bloc.
Un mode de réalisation prévoit un procédé de fabrication d'un dispositif électronique comprenant les étapes suivantes :
(a) fournir un substrat comprenant une alternance de couches isolantes électriquement et de couches conductrices thermiquement dans laquelle au moins une couche isolante électriquement comprend au moins une portion conductrice thermiquement, ledit substrat comprenant, en outre, au moins une cavité formée à partir d'une première face dudit substrat ;
(b) monter une puce électronique sur ladite première face dudit substrat ;
(c) former une couche en un matériau conducteur thermiquement en contact avec au moins une deuxième face de ladite puce électronique ; et
(d) disposer au moins une partie latérale d'un capot dans ladite cavité formée dudit substrat.
(a) fournir un substrat comprenant une alternance de couches isolantes électriquement et de couches conductrices thermiquement dans laquelle au moins une couche isolante électriquement comprend au moins une portion conductrice thermiquement, ledit substrat comprenant, en outre, au moins une cavité formée à partir d'une première face dudit substrat ;
(b) monter une puce électronique sur ladite première face dudit substrat ;
(c) former une couche en un matériau conducteur thermiquement en contact avec au moins une deuxième face de ladite puce électronique ; et
(d) disposer au moins une partie latérale d'un capot dans ladite cavité formée dudit substrat.
Selon un mode de réalisation, pendant l'étape (b) une troisième face de ladite puce est fixée à ladite première face dudit substrat.
Selon un mode de réalisation, le procédé comprend, en outre, une étape (d) de fixation d'une partie transversale dudit capot à ladite au moins une partie latérale dudit capot.
Ces caractéristiques et avantages, ainsi que d'autres, seront exposés en détail dans la description suivante de modes de réalisation particuliers faite à titre non limitatif en relation avec les figures jointes parmi lesquelles :
la représente une vue en coupe d'un mode de réalisation d'un dispositif électronique ;
la représente une vue en coupe d'un autre mode de réalisation d'un dispositif électronique ;
la représente trois vues en coupe illustrant des étapes d'un mode de mise en oeuvre d'un procédé de fabrication du dispositif électronique de la ;
la représente trois vues en coupe illustrant d'autres étapes d'un mode de mise en oeuvre d'un procédé de fabrication du dispositif électronique de la ; et
la représente une vue en coupe d'un autre mode de réalisation d'un dispositif électronique ;
Claims (14)
- Dispositif électronique (100 ; 200 ; 500) comprenant une puce électronique (101) et un boitier de protection de ladite puce (101), ledit boitier comprenant :
- un substrat (103) comprenant une alternance de couches isolantes électriquement (107) et de couches conductrices thermiquement (109) dans laquelle au moins une couche (111) isolante électriquement comprend au moins une portion (113) conductrice thermiquement ; et
- un capot (105 ; 501) en un matériau conducteur thermiquement comprenant au moins une partie latérale (123 ; 503) disposée dans au moins une cavité (117) formée à partir d'une première face (115) dudit substrat (103), le dispositif électronique comprenant, en outre, une couche (137) en un matériau conducteur thermiquement en contact avec une deuxième face (125) de ladite puce (101) et avec ledit capot (105 ; 501). - Dispositif selon la revendication 1, dans lequel une troisième face (131) de ladite puce (101) est fixée à ladite première face (115) dudit substrat (103)
- Dispositif selon la revendication 1 ou 2, dans lequel ladite au moins une cavité (117) s'étend de ladite première face (115) dudit substrat, et s'étend jusqu'à ladite au moins une portion (113) conductrice thermiquement.
- Dispositif selon la revendication 3, dans lequel ladite partie latérale (123 ; 503) dudit capot (105 ; 501) est en contact avec une desdites couches conductrices thermiquement (109) en contact avec ladite portion (113) conductrice thermiquement.
- Dispositif selon la revendication 3, dans lequel ladite partie latérale (123 ; 503) dudit capot (105 ; 501) est en contact avec ladite portion (113) conductrice thermiquement.
- Dispositif selon la revendication 3, dans lequel ladite partie latérale (123) dudit capot (105) est reliée à ladite portion (113) conductrice thermiquement par un via (203) conducteur thermiquement.
- Dispositif selon l'une quelconque des revendications 1 à 6, dans lequel ledit capot (105 ; 501) est un capot métallique.
- Dispositif selon l'une quelconque des revendications 1 à 7, dans lequel lesdites couches (109) conductrices thermiquement sont aussi conductrices électriquement.
- Dispositif selon l'une quelconque des revendications 1 à 8, dans lequel ledit capot (105 ; 501) comprend, en outre, une partie transversale (121 ; 505).
- Dispositif selon la revendication 9, dans lequel ladite au moins une partie latérale (503) est fixée à ladite partie transversale (505).
- Dispositif selon la revendication 9, dans lequel ledit capot (121) est fait en un seul bloc.
- Procédé de fabrication d'un dispositif électronique (100) comprenant les étapes suivantes :
(a) fournir un substrat (401) comprenant une alternance de couches (403) isolantes électriquement et de couches (405) conductrices thermiquement dans laquelle au moins une couche (407) isolante électriquement comprend au moins une portion (409) conductrice thermiquement, ledit substrat (401) comprenant, en outre, au moins une cavité (411) formée à partir d'une première face (413) dudit substrat (401) ;
(b) monter une puce électronique (301) sur ladite première face (413) dudit substrat (401) ;
(c) former une couche (415) en un matériau conducteur thermiquement en contact avec au moins une deuxième face (307) de ladite puce électronique (301) ; et
(d) disposer au moins une partie latérale (419) d'un capot (417) dans ladite cavité (411) formée dudit substrat (401). - Procédé selon la revendication 12, dans lequel pendant l'étape (b) une troisième face (305) de ladite puce (301) est fixée à ladite première face (413) dudit substrat (401).
- Procédé selon la revendication 12 ou 13, comprenant, en outre, une étape (d) de fixation d'une partie transversale (505) dudit capot (501) à ladite au moins une partie latérale (503) dudit capot (501).
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2111527A FR3128815A1 (fr) | 2021-10-29 | 2021-10-29 | Refroidissement d'un dispositif électronique |
US17/970,327 US20230140705A1 (en) | 2021-10-29 | 2022-10-20 | Cooling of an electronic device |
CN202211334915.7A CN116072626A (zh) | 2021-10-29 | 2022-10-28 | 电子器件的冷却 |
CN202222858835.3U CN220439602U (zh) | 2021-10-29 | 2022-10-28 | 电子器件 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2111527A FR3128815A1 (fr) | 2021-10-29 | 2021-10-29 | Refroidissement d'un dispositif électronique |
FR2111527 | 2021-10-29 |
Publications (1)
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FR3128815A1 true FR3128815A1 (fr) | 2023-05-05 |
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Application Number | Title | Priority Date | Filing Date |
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FR2111527A Pending FR3128815A1 (fr) | 2021-10-29 | 2021-10-29 | Refroidissement d'un dispositif électronique |
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Country | Link |
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US (1) | US20230140705A1 (fr) |
CN (2) | CN116072626A (fr) |
FR (1) | FR3128815A1 (fr) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5587882A (en) * | 1995-08-30 | 1996-12-24 | Hewlett-Packard Company | Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate |
US6282096B1 (en) * | 2000-04-28 | 2001-08-28 | Siliconware Precision Industries Co., Ltd. | Integration of heat conducting apparatus and chip carrier in IC package |
US20120119346A1 (en) * | 2010-11-17 | 2012-05-17 | Yunhyeok Im | Semiconductor package and method of forming the same |
-
2021
- 2021-10-29 FR FR2111527A patent/FR3128815A1/fr active Pending
-
2022
- 2022-10-20 US US17/970,327 patent/US20230140705A1/en active Pending
- 2022-10-28 CN CN202211334915.7A patent/CN116072626A/zh active Pending
- 2022-10-28 CN CN202222858835.3U patent/CN220439602U/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5587882A (en) * | 1995-08-30 | 1996-12-24 | Hewlett-Packard Company | Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate |
US6282096B1 (en) * | 2000-04-28 | 2001-08-28 | Siliconware Precision Industries Co., Ltd. | Integration of heat conducting apparatus and chip carrier in IC package |
US20120119346A1 (en) * | 2010-11-17 | 2012-05-17 | Yunhyeok Im | Semiconductor package and method of forming the same |
Also Published As
Publication number | Publication date |
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CN220439602U (zh) | 2024-02-02 |
US20230140705A1 (en) | 2023-05-04 |
CN116072626A (zh) | 2023-05-05 |
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