CA2374143A1 - Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat - Google Patents

Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat Download PDF

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Publication number
CA2374143A1
CA2374143A1 CA002374143A CA2374143A CA2374143A1 CA 2374143 A1 CA2374143 A1 CA 2374143A1 CA 002374143 A CA002374143 A CA 002374143A CA 2374143 A CA2374143 A CA 2374143A CA 2374143 A1 CA2374143 A1 CA 2374143A1
Authority
CA
Canada
Prior art keywords
substrate
electronic
electronic power
circuit according
power electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002374143A
Other languages
English (en)
Other versions
CA2374143C (fr
Inventor
Benoit Boursat
Emmanuel Dutarde
Nathalie Martin
Pierre Solomalala
Jose Saiz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alstom Transport Technologies SAS
Original Assignee
Alstom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR0103184A external-priority patent/FR2814280B1/fr
Application filed by Alstom SA filed Critical Alstom SA
Publication of CA2374143A1 publication Critical patent/CA2374143A1/fr
Application granted granted Critical
Publication of CA2374143C publication Critical patent/CA2374143C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Substrat pour circuit électronique de puissance comportant une tranche en matériau électriquement isolant, caractérisé en ce que ladite tranche (1) présente une face (11) supportant une ou plusieurs pistes conductrices (4) destinées à permettre la connexion d'un ou plusieurs composants électroniques de puissance (3), lesdites pistes conductrices (4) étant obtenues par métallisation fine, d'une épaisseur inférieure ou égale à 150 µm, de ladite face (11).

Claims (8)

1) Substrat pour circuit électronique de puissance comportant une tranche en matériau électriquement isolant, caractérisé en ce que ladite tranche (1) présente une face (11) supportant une ou plusieurs pistes conductrices (4) directement connectées à un ou plusieurs composants électroniques de puissance (3), lesdites pistes conductrices (4) étant obtenues par métallisation fine, d'une épaisseur inférieure à 150 µm, de ladite face (11).
2) Substrat pour circuit électronique de puissance selon la revendication 1, caractérisé en ce que lesdites pistes conductrices (4) sont en cuivre et sont obtenues par croissance électrolytique.
3) Substrat pour circuit électronique de puissance selon la revendication 2, caractérisé en ce que l'épaisseur des pistes conductrices (4) en cuivre est comprise entre 100 µm et 150 µm.
4) Substrat pour circuit électronique selon l'une quelconque des revendications 1 à
3, caractérisé en ce que lesdits composants électroniques (3) de puissance sont des composants IGBT.
5) Substrat pour circuit électronique selon l'une quelconque des revendications 1 à
4, caractérisé en ce que ladite tranche (1) est réalisée en nitrure d'aluminium A1N.
6) Substrat pour circuit électronique selon l'une quelconque des revendications 1 à
5, caractérisé en ce que la face inférieure de la tranche (1) comporte des stries (26) formant des canaux dans lesquels s'écoule un fluide de refroidissement.
7) Substrat pour circuit électronique de puissance selon la revendication 1, caractérisé en ce que ladite tranche (1) possède une seule face métallisée.
8) Module électronique de puissance, caractérisé en ce qu'il comporte au moins un composant électronique de puissance monté sur un substrat selon l'une quelconque des revendications 1 à 7.
CA2374143A 2001-03-08 2002-03-04 Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat Expired - Lifetime CA2374143C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0103184 2001-03-08
FR0103184A FR2814280B1 (fr) 2000-09-15 2001-03-08 Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat

Publications (2)

Publication Number Publication Date
CA2374143A1 true CA2374143A1 (fr) 2002-09-08
CA2374143C CA2374143C (fr) 2012-09-11

Family

ID=8860901

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2374143A Expired - Lifetime CA2374143C (fr) 2001-03-08 2002-03-04 Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat

Country Status (5)

Country Link
US (1) US6586783B2 (fr)
EP (1) EP1239515B1 (fr)
JP (1) JP2002280500A (fr)
CA (1) CA2374143C (fr)
ES (1) ES2717849T3 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4241397B2 (ja) * 2002-04-19 2009-03-18 三菱マテリアル株式会社 回路基板の製造方法
JP4206915B2 (ja) * 2002-12-27 2009-01-14 三菱マテリアル株式会社 パワーモジュール用基板
KR20080065988A (ko) * 2005-09-28 2008-07-15 니뽄 가이시 가부시키가이샤 히트싱크 모듈 및 그 제조방법
US20070152325A1 (en) * 2005-12-30 2007-07-05 Intel Corporation Chip package dielectric sheet for body-biasing
JP4710798B2 (ja) * 2006-11-01 2011-06-29 三菱マテリアル株式会社 パワーモジュール用基板及びパワーモジュール用基板の製造方法並びにパワーモジュール
US8252410B2 (en) * 2007-09-05 2012-08-28 Applied Materials, Inc. Ceramic cover wafers of aluminum nitride or beryllium oxide
US7898807B2 (en) * 2009-03-09 2011-03-01 General Electric Company Methods for making millichannel substrate, and cooling device and apparatus using the substrate
DE102009033029A1 (de) * 2009-07-02 2011-01-05 Electrovac Ag Elektronische Vorrichtung
JP2012253125A (ja) * 2011-06-01 2012-12-20 Sumitomo Electric Ind Ltd 半導体装置及び配線基板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3766440A (en) * 1972-08-11 1973-10-16 Gen Motors Corp Ceramic integrated circuit convector assembly
JPS61176142A (ja) * 1985-01-31 1986-08-07 Toshiba Corp 基板構造体
JPH0679989B2 (ja) * 1985-02-26 1994-10-12 ティーディーケイ株式会社 窒化アルミニウム上の銅電極形成法
US4868712A (en) * 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package
JPH01272183A (ja) * 1988-04-25 1989-10-31 Toshiba Corp セラミックス回路基板
JPH07202063A (ja) * 1993-12-28 1995-08-04 Toshiba Corp セラミックス回路基板
DE9404717U1 (de) * 1994-03-22 1995-05-04 TBS GmbH, 33613 Bielefeld Kühlelement
US6033764A (en) * 1994-12-16 2000-03-07 Zecal Corp. Bumped substrate assembly
US5912066A (en) * 1996-03-27 1999-06-15 Kabushiki Kaisha Toshiba Silicon nitride circuit board and producing method therefor
US5719444A (en) * 1996-04-26 1998-02-17 Tilton; Charles L. Packaging and cooling system for power semi-conductor
US5763951A (en) * 1996-07-22 1998-06-09 Northrop Grumman Corporation Non-mechanical magnetic pump for liquid cooling
US5870823A (en) * 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels

Also Published As

Publication number Publication date
US20020125505A1 (en) 2002-09-12
JP2002280500A (ja) 2002-09-27
EP1239515A1 (fr) 2002-09-11
CA2374143C (fr) 2012-09-11
ES2717849T3 (es) 2019-06-25
US6586783B2 (en) 2003-07-01
EP1239515B1 (fr) 2019-01-02

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Effective date: 20220304