FR3121688B1 - Fils et cables electriques pour applications spatiales - Google Patents
Fils et cables electriques pour applications spatiales Download PDFInfo
- Publication number
- FR3121688B1 FR3121688B1 FR2103805A FR2103805A FR3121688B1 FR 3121688 B1 FR3121688 B1 FR 3121688B1 FR 2103805 A FR2103805 A FR 2103805A FR 2103805 A FR2103805 A FR 2103805A FR 3121688 B1 FR3121688 B1 FR 3121688B1
- Authority
- FR
- France
- Prior art keywords
- silver
- copper
- copper alloy
- strand
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 5
- 229910052709 silver Inorganic materials 0.000 abstract 5
- 239000004332 silver Substances 0.000 abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 4
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 4
- 229910052802 copper Inorganic materials 0.000 abstract 4
- 239000010949 copper Substances 0.000 abstract 4
- 238000000034 method Methods 0.000 abstract 3
- 239000004020 conductor Substances 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/28—Protection against damage caused by moisture, corrosion, chemical attack or weather
- H01B7/2806—Protection against damage caused by corrosion
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Non-Insulated Conductors (AREA)
- Insulated Conductors (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
FILS ET CABLES ELECTRIQUES POUR APPLICATIONS SPATIALES La présente invention concerne un procédé de fabrication d’un fil d’ébauche en cuivre ou en alliage de cuivre argenté dont l’épaisseur de la couche d’argent est comprise entre 1,5 µm et 15 µm comprenant l’étape de déposition électrolytique d’argent sur le fil d’ébauche en cuivre ou en alliage de cuivre, ladite déposition électrolytique ayant lieu sous courant pulsé avec inversion dans un bain d’argenture dans des conditions électrolytiques particulières. Elle concerne de plus le fil d’ébauche en cuivre ou en alliage de cuivre argenté susceptible d’être obtenu par ce procédé, un procédé de fabrication d’un brin en cuivre ou en alliage de cuivre argenté, le brin susceptible d’être obtenu par ce procédé, un conducteur argenté et une couche de blindage électromagnétique comprenant le brin argenté, un fil électrique comprenant le conducteur argenté et un câble électrique comprenant le fil électrique ainsi que leurs utilisations.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2103805A FR3121688B1 (fr) | 2021-04-13 | 2021-04-13 | Fils et cables electriques pour applications spatiales |
BR112023020474A BR112023020474A2 (pt) | 2021-04-13 | 2022-04-11 | Fios e cabos elétricos para aplicações espaciais |
DE22722293.2T DE22722293T1 (de) | 2021-04-13 | 2022-04-11 | Elektrische drähte und kabel für raumanwendungen |
PCT/FR2022/050678 WO2022219276A1 (fr) | 2021-04-13 | 2022-04-11 | Fils et cables electriques pour applications spatiales |
JP2023562799A JP2024513982A (ja) | 2021-04-13 | 2022-04-11 | 宇宙用途用の電気ワイヤおよびケーブル |
CN202280028155.9A CN117157432A (zh) | 2021-04-13 | 2022-04-11 | 用于空间应用的电线和电缆 |
EP22722293.2A EP4323565A1 (fr) | 2021-04-13 | 2022-04-11 | Fils et cables electriques pour applications spatiales |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2103805A FR3121688B1 (fr) | 2021-04-13 | 2021-04-13 | Fils et cables electriques pour applications spatiales |
FR2103805 | 2021-04-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3121688A1 FR3121688A1 (fr) | 2022-10-14 |
FR3121688B1 true FR3121688B1 (fr) | 2023-04-14 |
Family
ID=77180082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR2103805A Active FR3121688B1 (fr) | 2021-04-13 | 2021-04-13 | Fils et cables electriques pour applications spatiales |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP4323565A1 (fr) |
JP (1) | JP2024513982A (fr) |
CN (1) | CN117157432A (fr) |
BR (1) | BR112023020474A2 (fr) |
DE (1) | DE22722293T1 (fr) |
FR (1) | FR3121688B1 (fr) |
WO (1) | WO2022219276A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2024053901A (ja) * | 2022-10-04 | 2024-04-16 | Dowaメタルテック株式会社 | 複合材、複合材の製造方法および端子 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102286762A (zh) * | 2011-09-13 | 2011-12-21 | 无锡市嘉邦电力管道厂 | 一种镀银的铜合金线 |
CN103436931A (zh) * | 2013-08-26 | 2013-12-11 | 中国人民解放军第五七一九工厂 | 双向脉冲镀银方法 |
CN109295445B (zh) * | 2018-08-31 | 2023-03-31 | 扬州虹扬科技发展有限公司 | 一种镀银铜线的电镀后处理工艺 |
CN112323106A (zh) * | 2020-10-22 | 2021-02-05 | 深圳市海里表面技术处理有限公司 | 一种快速镀银工艺 |
-
2021
- 2021-04-13 FR FR2103805A patent/FR3121688B1/fr active Active
-
2022
- 2022-04-11 JP JP2023562799A patent/JP2024513982A/ja active Pending
- 2022-04-11 CN CN202280028155.9A patent/CN117157432A/zh active Pending
- 2022-04-11 BR BR112023020474A patent/BR112023020474A2/pt unknown
- 2022-04-11 EP EP22722293.2A patent/EP4323565A1/fr active Pending
- 2022-04-11 DE DE22722293.2T patent/DE22722293T1/de active Pending
- 2022-04-11 WO PCT/FR2022/050678 patent/WO2022219276A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN117157432A (zh) | 2023-12-01 |
BR112023020474A2 (pt) | 2023-11-21 |
JP2024513982A (ja) | 2024-03-27 |
FR3121688A1 (fr) | 2022-10-14 |
DE22722293T1 (de) | 2024-05-02 |
EP4323565A1 (fr) | 2024-02-21 |
WO2022219276A1 (fr) | 2022-10-20 |
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Legal Events
Date | Code | Title | Description |
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PLFP | Fee payment |
Year of fee payment: 2 |
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PLSC | Publication of the preliminary search report |
Effective date: 20221014 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
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PLFP | Fee payment |
Year of fee payment: 4 |