FR3076974B1 - Dispositif électronique renforcé pour moteur électrique - Google Patents
Dispositif électronique renforcé pour moteur électrique Download PDFInfo
- Publication number
- FR3076974B1 FR3076974B1 FR1873169A FR1873169A FR3076974B1 FR 3076974 B1 FR3076974 B1 FR 3076974B1 FR 1873169 A FR1873169 A FR 1873169A FR 1873169 A FR1873169 A FR 1873169A FR 3076974 B1 FR3076974 B1 FR 3076974B1
- Authority
- FR
- France
- Prior art keywords
- electric motor
- electronic device
- circuit board
- printed circuit
- semiconductor package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 abstract 4
- 239000004020 conductor Substances 0.000 abstract 2
- 239000012779 reinforcing material Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/30—Structural association with control circuits or drive circuits
- H02K11/33—Drive circuits, e.g. power electronics
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K29/00—Motors or generators having non-mechanical commutating devices, e.g. discharge tubes or semiconductor devices
- H02K29/06—Motors or generators having non-mechanical commutating devices, e.g. discharge tubes or semiconductor devices with position sensing devices
- H02K29/08—Motors or generators having non-mechanical commutating devices, e.g. discharge tubes or semiconductor devices with position sensing devices using magnetic effect devices, e.g. Hall-plates, magneto-resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K2211/00—Specific aspects not provided for in the other groups of this subclass relating to measuring or protective devices or electric components
- H02K2211/03—Machines characterised by circuit boards, e.g. pcb
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Motor Or Generator Frames (AREA)
Abstract
Il est proposé un dispositif électronique (100) pouvant être monté dans un moteur électrique, comprenant : une carte de circuit imprimé (110) comportant un trou pour monter un boîtier à semiconducteur (120) qui comprend un dispositif de détection magnétique intégré, le boîtier à semiconducteur (120) comprenant des conducteurs (121) ; et un matériau de renforcement (130) ; dans lequel le boîtier à semiconducteur (120) est monté dans le trou avec les conducteurs (121) soudés sur la carte de circuit imprimé, et dans lequel un intervalle (112, 113) est présent entre le boîtier à semiconducteur (120) et la carte de circuit imprimé (110), dans lequel le matériau de renforcement (130) recouvre au moins une partie des conducteurs (121) et au moins une partie de la carte de circuit imprimé (110). Figure pour l’abrégé : figure 4
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017130342.1A DE102017130342A1 (de) | 2017-12-18 | 2017-12-18 | Verstärkte elektronische Vorrichtung für einen Elektromotor |
DE102017130342.1 | 2017-12-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3076974A1 FR3076974A1 (fr) | 2019-07-19 |
FR3076974B1 true FR3076974B1 (fr) | 2024-01-19 |
Family
ID=65516390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1873169A Active FR3076974B1 (fr) | 2017-12-18 | 2018-12-18 | Dispositif électronique renforcé pour moteur électrique |
Country Status (5)
Country | Link |
---|---|
US (1) | US20190190354A1 (fr) |
CN (1) | CN109935554A (fr) |
BE (1) | BE1025927B1 (fr) |
DE (1) | DE102017130342A1 (fr) |
FR (1) | FR3076974B1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109845087B (zh) * | 2016-10-25 | 2022-06-17 | 三菱电机株式会社 | 电力控制装置、电动机、空调机以及电动机的制造方法 |
DE102017121485A1 (de) * | 2017-09-15 | 2019-03-21 | Infineon Technologies Austria Ag | Halbleitervorrichtung mit Kupferkorrosionsinhibitoren |
DE102020210407A1 (de) * | 2020-08-17 | 2022-02-17 | Robert Bosch Gesellschaft mit beschränkter Haftung | Rotationsmaschine mit Positionssensor |
CN115589680A (zh) * | 2022-10-19 | 2023-01-10 | 广东芯测智联电子科技有限公司 | 一种封装体及其贴片方法 |
Family Cites Families (33)
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DE1241879B (de) * | 1964-06-01 | 1967-06-08 | Burndy Corp | Mikroverbindung fuer elektrische Leiter, insbesondere in Druckschaltungen |
DE3326968A1 (de) * | 1982-06-12 | 1985-02-14 | IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen | Traegerbauteil aus thermoplastischem material mit durch heisspraegen aufgebrachten metallischen leitern |
JPS59113648A (ja) * | 1982-12-20 | 1984-06-30 | Hitachi Ltd | 樹脂モ−ルド型半導体装置 |
US4729061A (en) * | 1985-04-29 | 1988-03-01 | Advanced Micro Devices, Inc. | Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom |
FR2603667B1 (fr) | 1986-09-10 | 1990-09-28 | Etri Sa | Ventilateur centrifuge entraine par un moteur a courant continu et a commutation electronique |
JP2901091B2 (ja) * | 1990-09-27 | 1999-06-02 | 株式会社日立製作所 | 半導体装置 |
JPH05207718A (ja) * | 1992-01-24 | 1993-08-13 | Nippon Densan Corp | 直流モータ |
JP3014029B2 (ja) * | 1995-06-16 | 2000-02-28 | 日本電気株式会社 | 半導体素子の実装方法 |
US5550086A (en) * | 1995-12-27 | 1996-08-27 | Tai; George | Ceramic chip form semiconductor diode fabrication method |
US5835355A (en) * | 1997-09-22 | 1998-11-10 | Lsi Logic Corporation | Tape ball grid array package with perforated metal stiffener |
US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
US6459593B1 (en) * | 2000-08-10 | 2002-10-01 | Nortel Networks Limited | Electronic circuit board |
JP4002064B2 (ja) * | 2000-12-18 | 2007-10-31 | カルソニックカンセイ株式会社 | ブラシレスモータ |
JP4010447B2 (ja) * | 2002-05-30 | 2007-11-21 | ローム株式会社 | 固体電解コンデンサ及びその製造方法 |
JP2004103981A (ja) * | 2002-09-12 | 2004-04-02 | Sanyo Electric Co Ltd | 固体電解コンデンサの製造方法及びこの方法によって製造される固体電解コンデンサ |
US6686609B1 (en) * | 2002-10-01 | 2004-02-03 | Ultrastar Limited | Package structure of surface mounting led and method of manufacturing the same |
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US6936922B1 (en) * | 2003-09-26 | 2005-08-30 | Amkor Technology, Inc. | Semiconductor package structure reducing warpage and manufacturing method thereof |
JP2006173383A (ja) * | 2004-12-16 | 2006-06-29 | Rohm Co Ltd | 固体電解コンデンサ及びこの固体電解コンデンサの基板への実装構造 |
JP4219953B2 (ja) * | 2006-12-11 | 2009-02-04 | シャープ株式会社 | Icチップ実装パッケージ、およびその製造方法 |
JP2008300538A (ja) * | 2007-05-30 | 2008-12-11 | Toshiba Corp | プリント回路板、プリント回路板の製造方法および電子機器 |
KR20090059391A (ko) * | 2007-12-06 | 2009-06-11 | 삼성전자주식회사 | 패키지 구조 및 그의 제조 방법 |
JP2009212104A (ja) * | 2008-02-29 | 2009-09-17 | Toshiba Corp | プリント回路板の製造方法、プリント回路板およびそのプリント回路板を備えた電子機器 |
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KR101677105B1 (ko) * | 2010-08-30 | 2016-11-17 | 삼성디스플레이 주식회사 | 전자 부품 및 그 제조 방법 |
KR101090816B1 (ko) * | 2011-05-04 | 2011-12-12 | 주식회사 아이. 피. 에스시스템 | 반도체 칩 본딩장치 |
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KR102379166B1 (ko) * | 2015-02-05 | 2022-03-25 | 삼성전자주식회사 | 전자 부품, 반도체 패키지 및 이를 이용한 전자 장치 |
US9545008B1 (en) * | 2016-03-24 | 2017-01-10 | Avx Corporation | Solid electrolytic capacitor for embedding into a circuit board |
-
2017
- 2017-12-18 DE DE102017130342.1A patent/DE102017130342A1/de active Pending
-
2018
- 2018-12-17 BE BE20185892A patent/BE1025927B1/nl active IP Right Grant
- 2018-12-17 US US16/221,862 patent/US20190190354A1/en active Pending
- 2018-12-18 CN CN201811549186.0A patent/CN109935554A/zh active Pending
- 2018-12-18 FR FR1873169A patent/FR3076974B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
US20190190354A1 (en) | 2019-06-20 |
BE1025927A1 (nl) | 2019-08-08 |
DE102017130342A1 (de) | 2019-06-19 |
FR3076974A1 (fr) | 2019-07-19 |
BE1025927B1 (nl) | 2020-03-09 |
CN109935554A (zh) | 2019-06-25 |
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