FR3054721B1 - ELECTRONIC POWER MODULE OF AN AIRCRAFT AND METHOD OF MANUFACTURING THE SAME - Google Patents

ELECTRONIC POWER MODULE OF AN AIRCRAFT AND METHOD OF MANUFACTURING THE SAME Download PDF

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Publication number
FR3054721B1
FR3054721B1 FR1657411A FR1657411A FR3054721B1 FR 3054721 B1 FR3054721 B1 FR 3054721B1 FR 1657411 A FR1657411 A FR 1657411A FR 1657411 A FR1657411 A FR 1657411A FR 3054721 B1 FR3054721 B1 FR 3054721B1
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France
Prior art keywords
aircraft
manufacturing
same
power module
electronic power
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FR1657411A
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French (fr)
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FR3054721A1 (en
Inventor
Rabih KHAZAKA
Stephane Azzopardi
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Safran SA
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Safran SA
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Priority to FR1657411A priority Critical patent/FR3054721B1/en
Priority to PCT/FR2017/052137 priority patent/WO2018020189A2/en
Publication of FR3054721A1 publication Critical patent/FR3054721A1/en
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Publication of FR3054721B1 publication Critical patent/FR3054721B1/en
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    • H—ELECTRICITY
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR1657411A 2016-07-29 2016-07-29 ELECTRONIC POWER MODULE OF AN AIRCRAFT AND METHOD OF MANUFACTURING THE SAME Active FR3054721B1 (en)

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FR1657411A FR3054721B1 (en) 2016-07-29 2016-07-29 ELECTRONIC POWER MODULE OF AN AIRCRAFT AND METHOD OF MANUFACTURING THE SAME
PCT/FR2017/052137 WO2018020189A2 (en) 2016-07-29 2017-07-28 Power electronics module for an aircraft and associated production method

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FR1657411A FR3054721B1 (en) 2016-07-29 2016-07-29 ELECTRONIC POWER MODULE OF AN AIRCRAFT AND METHOD OF MANUFACTURING THE SAME

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JPS61230346A (en) * 1985-04-04 1986-10-14 Mitsubishi Electric Corp Cooling device for semiconductor element
KR100342589B1 (en) * 1999-10-01 2002-07-04 김덕중 Semiconductor power modules and methods for manufacturing the same
DE102005036116B4 (en) * 2005-08-01 2012-03-22 Infineon Technologies Ag The power semiconductor module
JP2008124430A (en) * 2006-10-18 2008-05-29 Hitachi Ltd Power semiconductor module
EP2155628A2 (en) * 2007-04-24 2010-02-24 CeramTec AG Component having a metalized ceramic base
US8207607B2 (en) * 2007-12-14 2012-06-26 Denso Corporation Semiconductor device with resin mold
KR101343233B1 (en) * 2011-11-28 2013-12-18 삼성전기주식회사 Power Module Package
FR2990795B1 (en) 2012-05-16 2015-12-11 Sagem Defense Securite ELECTRONIC POWER MODULE ARRANGEMENT
DE202015001441U1 (en) * 2015-02-24 2015-03-18 Vincotech Gmbh Power semiconductor module with combined thick-film and metal sintered layers

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WO2018020189A2 (en) 2018-02-01
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