FR3009476B1 - ELECTRONIC MODULE AND METHOD OF MANUFACTURING THE SAME - Google Patents

ELECTRONIC MODULE AND METHOD OF MANUFACTURING THE SAME Download PDF

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Publication number
FR3009476B1
FR3009476B1 FR1457388A FR1457388A FR3009476B1 FR 3009476 B1 FR3009476 B1 FR 3009476B1 FR 1457388 A FR1457388 A FR 1457388A FR 1457388 A FR1457388 A FR 1457388A FR 3009476 B1 FR3009476 B1 FR 3009476B1
Authority
FR
France
Prior art keywords
manufacturing
same
electronic module
module
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1457388A
Other languages
French (fr)
Other versions
FR3009476A1 (en
Inventor
Jen-Chun Chen
Tsung Jung Cheng
Chia Cheng Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universal Scientific Industrial Shanghai Co Ltd
Original Assignee
Universal Scientific Industrial Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universal Scientific Industrial Shanghai Co Ltd filed Critical Universal Scientific Industrial Shanghai Co Ltd
Publication of FR3009476A1 publication Critical patent/FR3009476A1/en
Application granted granted Critical
Publication of FR3009476B1 publication Critical patent/FR3009476B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
FR1457388A 2013-07-31 2014-07-30 ELECTRONIC MODULE AND METHOD OF MANUFACTURING THE SAME Active FR3009476B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW102127507 2013-07-31
TW102127507 2013-07-31
TW103105827 2014-02-21
TW103105827A TW201505137A (en) 2013-07-31 2014-02-21 Electronic package module and the method of manufacturing the same

Publications (2)

Publication Number Publication Date
FR3009476A1 FR3009476A1 (en) 2015-02-06
FR3009476B1 true FR3009476B1 (en) 2018-02-16

Family

ID=52342062

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1457388A Active FR3009476B1 (en) 2013-07-31 2014-07-30 ELECTRONIC MODULE AND METHOD OF MANUFACTURING THE SAME

Country Status (4)

Country Link
JP (1) JP5844439B2 (en)
DE (1) DE102014110301A1 (en)
FR (1) FR3009476B1 (en)
TW (1) TW201505137A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101670894B1 (en) 2015-05-27 2016-10-31 (주)파트론 Manufacturing method of semiconductor package
KR101661919B1 (en) * 2015-06-23 2016-10-04 (주)파트론 Manufacturing method of semiconductor package
US10236260B2 (en) * 2016-06-30 2019-03-19 Nxp Usa, Inc. Shielded package with integrated antenna
WO2018030152A1 (en) * 2016-08-08 2018-02-15 株式会社村田製作所 Circuit module and method for manufacturing circuit module
US11251135B2 (en) 2018-04-02 2022-02-15 Samsung Electro-Mechanics Co., Ltd. Electronic device module and method of manufacturing the same
KR102505198B1 (en) * 2018-04-02 2023-03-02 삼성전기주식회사 Electronic component module and manufacturing mehthod therof
CN112654129B (en) * 2019-10-10 2021-11-16 庆鼎精密电子（淮安）有限公司 Anti-electromagnetic interference circuit board and manufacturing method thereof
WO2023119884A1 (en) * 2021-12-24 2023-06-29 富士フイルム株式会社 Manufacturing method for printed circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4175351B2 (en) * 2005-08-26 2008-11-05 松下電工株式会社 Uneven multilayer circuit board module and manufacturing method thereof
CN103053021A (en) * 2010-08-18 2013-04-17 株式会社村田制作所 Electronic part and method of manufacturing same
JP2012159935A (en) * 2011-01-31 2012-08-23 Murata Mfg Co Ltd Electronic component module, method for manufacturing electronic component module, and multifunctional card
TWI502733B (en) * 2012-11-02 2015-10-01 環旭電子股份有限公司 Electronic package module and method of manufacturing the same

Also Published As

Publication number Publication date
JP5844439B2 (en) 2016-01-20
JP2015032834A (en) 2015-02-16
FR3009476A1 (en) 2015-02-06
DE102014110301A1 (en) 2015-02-05
TW201505137A (en) 2015-02-01

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