FR2902493B1 - Module de source de lumiere. - Google Patents

Module de source de lumiere.

Info

Publication number
FR2902493B1
FR2902493B1 FR0752817A FR0752817A FR2902493B1 FR 2902493 B1 FR2902493 B1 FR 2902493B1 FR 0752817 A FR0752817 A FR 0752817A FR 0752817 A FR0752817 A FR 0752817A FR 2902493 B1 FR2902493 B1 FR 2902493B1
Authority
FR
France
Prior art keywords
light source
source module
module
light
source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0752817A
Other languages
English (en)
Other versions
FR2902493A1 (fr
Inventor
Tsukasa Tokida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Publication of FR2902493A1 publication Critical patent/FR2902493A1/fr
Application granted granted Critical
Publication of FR2902493B1 publication Critical patent/FR2902493B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
FR0752817A 2006-01-23 2007-01-23 Module de source de lumiere. Expired - Fee Related FR2902493B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006013696A JP4662361B2 (ja) 2006-01-23 2006-01-23 光源モジュール

Publications (2)

Publication Number Publication Date
FR2902493A1 FR2902493A1 (fr) 2007-12-21
FR2902493B1 true FR2902493B1 (fr) 2016-02-05

Family

ID=38268365

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0752817A Expired - Fee Related FR2902493B1 (fr) 2006-01-23 2007-01-23 Module de source de lumiere.

Country Status (4)

Country Link
US (1) US7535727B2 (fr)
JP (1) JP4662361B2 (fr)
DE (1) DE102007003256A1 (fr)
FR (1) FR2902493B1 (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4662361B2 (ja) * 2006-01-23 2011-03-30 株式会社小糸製作所 光源モジュール
DE102008005823B4 (de) * 2008-01-24 2013-12-12 Bjb Gmbh & Co. Kg Anschlusselement zur elektrischen Anbindung einer LED
US8212277B2 (en) 2008-07-29 2012-07-03 Stanley Electric Co., Ltd. Optical semiconductor device module with power supply through uneven contacts
JP5276455B2 (ja) * 2009-01-23 2013-08-28 スタンレー電気株式会社 光半導体装置モジュール
JP5479751B2 (ja) * 2009-02-16 2014-04-23 株式会社小糸製作所 光源モジュール及び車輌用灯具
US20100314983A1 (en) * 2009-06-11 2010-12-16 Shih-Ming Chen Light emitting diode lamp with enhanced heat-conducting performance
FR2950673B1 (fr) * 2009-09-30 2011-12-09 Valeo Vision Support pour source lumineuse de module d'eclairage
JP5351065B2 (ja) * 2010-01-25 2013-11-27 矢崎総業株式会社 Ｌｅｄランプユニット
JP5680947B2 (ja) * 2010-12-03 2015-03-04 スタンレー電気株式会社 車両用灯具のレンズホルダ取付構造
CN102537686B (zh) * 2010-12-13 2015-03-25 海洋王照明科技股份有限公司 一种led灯具
CN102537687B (zh) * 2010-12-13 2015-03-25 海洋王照明科技股份有限公司 Led灯具
JP2012251738A (ja) * 2011-06-03 2012-12-20 Sharp Corp 加熱調理器
WO2012165125A1 (fr) * 2011-06-03 2012-12-06 シャープ株式会社 Lampe à diodes électroluminescentes (led) et cuiseur la comportant
JP2012253232A (ja) * 2011-06-03 2012-12-20 Sharp Corp 加熱調理器
US8840291B2 (en) * 2011-10-26 2014-09-23 Federal-Mogul Ignition Company LED lamp assembly with heat sink
JP5939418B2 (ja) * 2012-01-24 2016-06-22 スタンレー電気株式会社 車両用灯具ユニット
US9052095B2 (en) * 2012-10-01 2015-06-09 Valeo North America, Inc. Light guide fixture system
DE102012219007B4 (de) 2012-10-18 2018-06-07 Automotive Lighting Reutlingen Gmbh Beleuchtungseinrichtung für ein Kraftfahrzeug
AT513915B1 (de) 2013-02-14 2015-11-15 Zizala Lichtsysteme Gmbh Lichtmodul sowie Beleuchtungsvorrichtung mit Lichtmodul für einen Fahrzeugscheinwerfer
US9791121B2 (en) * 2013-09-10 2017-10-17 Sl Corporation Vehicle lamp
CN105570819A (zh) * 2014-10-15 2016-05-11 富泰华工业（深圳）有限公司 背光源
CN106338043B (zh) * 2015-07-06 2020-11-03 松下知识产权经营株式会社 光源单元、照明装置和车辆
TWM526777U (zh) * 2015-08-21 2016-08-01 高準精密工業股份有限公司 具有卡扣部件之結構光模組
US10914962B2 (en) * 2015-08-21 2021-02-09 Everready Precision Ind. Corp Structured light module with fastening element
DE102019104792A1 (de) * 2018-03-01 2019-09-05 Nichia Corporation Lichtemittierendes modul

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5606358A (en) * 1991-12-23 1997-02-25 Eastman Kodak Company Light-emitting diode printhead
JP2567710Y2 (ja) * 1992-05-21 1998-04-02 スタンレー電気株式会社 ハイマウントストップランプの給電構造
US5269694A (en) * 1992-10-23 1993-12-14 Molex Incorporated Surface mount electrical connector
EP0833103A3 (fr) * 1996-09-30 1999-12-01 Toshiba Lighting & Technology Corporation Lampe et dispositif d'affichage le comprenant
WO1998045741A1 (fr) * 1997-04-08 1998-10-15 Hitachi, Ltd. Module optique, procede de fabrication d'un module optique, et dispositif optique de transmission
US6011233A (en) * 1997-07-23 2000-01-04 Narae Corporation Welding method of a connection terminal piece for a deflection yoke coil and the structure thereof
US5917701A (en) * 1997-11-05 1999-06-29 Artesyn Technologies, Inc. Heat sink hold-down clip
TW451535B (en) * 1998-09-04 2001-08-21 Sony Corp Semiconductor device and package, and fabrication method thereof
US6420937B1 (en) * 2000-08-29 2002-07-16 Matsushita Electric Industrial Co., Ltd. Voltage controlled oscillator with power amplifier
US6871981B2 (en) * 2001-09-13 2005-03-29 Heads Up Technologies, Inc. LED lighting device and system
TW527068U (en) * 2002-03-20 2003-04-01 Hon Hai Prec Ind Co Ltd Clip for heat dissipation device
US7380961B2 (en) * 2002-04-24 2008-06-03 Moriyama Sangyo Kabushiki Kaisha Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler
TW584218U (en) * 2002-06-06 2004-04-11 Hon Hai Prec Ind Co Ltd Mounting device for heat sink
US6867978B2 (en) * 2002-10-08 2005-03-15 Intel Corporation Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
JP2004304111A (ja) * 2003-04-01 2004-10-28 Sharp Corp 多波長レーザ装置
US7458705B2 (en) * 2003-06-20 2008-12-02 Yazaki Corporation LED illumination device
JP4274032B2 (ja) * 2003-07-09 2009-06-03 日亜化学工業株式会社 照明装置
US7211835B2 (en) * 2003-07-09 2007-05-01 Nichia Corporation Light emitting device, method of manufacturing the same and lighting equipment
US20050039551A1 (en) * 2003-07-24 2005-02-24 Eric Shute Tamper evident connector for an engine radiator
JP2005209537A (ja) * 2004-01-23 2005-08-04 Koito Mfg Co Ltd 灯具
CN100533808C (zh) * 2004-01-26 2009-08-26 株式会社半导体能源研究所 显示器件及其制造方法以及电视设备
CN2763972Y (zh) * 2004-12-11 2006-03-08 鸿富锦精密工业（深圳）有限公司 散热装置组合
JP2006245336A (ja) * 2005-03-03 2006-09-14 Koito Mfg Co Ltd 発光装置
JP4595665B2 (ja) * 2005-05-13 2010-12-08 富士電機システムズ株式会社 配線基板の製造方法
US20060288968A1 (en) * 2005-06-27 2006-12-28 Control Devices, Inc. Tamper evident connector for an engine radiator
JP2007141549A (ja) * 2005-11-16 2007-06-07 Koito Mfg Co Ltd 車輌用灯具
JP4662361B2 (ja) * 2006-01-23 2011-03-30 株式会社小糸製作所 光源モジュール
JP4535453B2 (ja) * 2006-03-06 2010-09-01 株式会社小糸製作所 光源モジュール及び車輌用灯具

Also Published As

Publication number Publication date
DE102007003256A1 (de) 2007-08-02
FR2902493A1 (fr) 2007-12-21
US7535727B2 (en) 2009-05-19
JP4662361B2 (ja) 2011-03-30
US20070171662A1 (en) 2007-07-26
JP2007194172A (ja) 2007-08-02

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